BE716446A - - Google Patents

Info

Publication number
BE716446A
BE716446A BE716446DA BE716446A BE 716446 A BE716446 A BE 716446A BE 716446D A BE716446D A BE 716446DA BE 716446 A BE716446 A BE 716446A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE716446A publication Critical patent/BE716446A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
BE716446D 1967-06-15 1968-06-12 BE716446A (en:Method)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US64502567A 1967-06-15 1967-06-15
US654025A US3416597A (en) 1967-06-15 1967-06-15 Heat sink for forced air or convection cooling of semiconductors

Publications (1)

Publication Number Publication Date
BE716446A true BE716446A (en:Method) 1968-12-12

Family

ID=27094610

Family Applications (1)

Application Number Title Priority Date Filing Date
BE716446D BE716446A (en:Method) 1967-06-15 1968-06-12

Country Status (6)

Country Link
US (1) US3416597A (en:Method)
BE (1) BE716446A (en:Method)
DE (1) DE1764486C3 (en:Method)
FR (1) FR1586363A (en:Method)
GB (1) GB1172332A (en:Method)
NL (1) NL6808229A (en:Method)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2640000C2 (de) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben
DE2739242C2 (de) * 1977-08-31 1979-10-04 Siemens Ag, 1000 Berlin Und 8000 Muenchen Hochleistungsstromrichter
US4489363A (en) * 1983-01-31 1984-12-18 Sperry Corporation Apparatus for cooling integrated circuit chips
US4601202A (en) * 1983-12-27 1986-07-22 General Electric Company Gas turbine engine component cooling system
US4608819A (en) * 1983-12-27 1986-09-02 General Electric Company Gas turbine engine component cooling system
US4790373A (en) * 1986-08-01 1988-12-13 Hughes Tool Company Cooling system for electrical components
DE3703873A1 (de) * 1987-02-07 1988-08-18 Sueddeutsche Kuehler Behr Kuehlkoerper, insbesondere zum kuehlen elektronischer bauelemente
DE3704015C2 (de) * 1987-02-10 1996-02-22 Hess Joachim Schutzgehäuse aus Kunststoff zur wiederholt dicht verschließbaren Aufnahme von Meß-, Schalt-, Überwachungs- und ähnlichen Geräten
US4858717A (en) * 1988-03-23 1989-08-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Acoustic convective system
US4947287A (en) * 1988-11-30 1990-08-07 Sundstrand Corporation Capacitor cooling arrangement
US5020586A (en) * 1989-09-08 1991-06-04 Hewlett-Packard Company Air-cooled heat exchanger for electronic circuit modules
DE3940289A1 (de) * 1989-12-06 1991-06-13 Klein Kg Elektro Geraete G Kuehlkoerper fuer geraete der elektrotechnik
JP4438526B2 (ja) * 2004-06-16 2010-03-24 株式会社安川電機 パワー部品冷却装置
US8020608B2 (en) * 2004-08-31 2011-09-20 Hewlett-Packard Development Company, L.P. Heat sink fin with stator blade
TWM339197U (en) * 2007-12-13 2008-08-21 Asia Vital Components Co Ltd Heat dissipating unit
US20110036552A1 (en) * 2009-08-11 2011-02-17 Ventiva, Inc. Heatsink having one or more ozone catalyzing fins
CN204406297U (zh) * 2015-02-02 2015-06-17 北京京东方茶谷电子有限公司 一种主机机箱和主机
GB201608523D0 (en) * 2016-05-16 2016-06-29 Rolls Royce Plc Heat sink
US10952352B2 (en) 2017-10-27 2021-03-16 Micron Technology, Inc. Assemblies including heat dispersing elements and related systems and methods

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH82679A (de) * 1919-05-02 1919-10-16 Oerlikon Maschf Kühleinrichtung an elektrischen Flachleitern
DE929521C (de) * 1953-03-06 1955-06-27 Eduard Dipl-Ing Schmieg Rippenrohr
US2818237A (en) * 1955-10-27 1957-12-31 Carlton G Lehr Cooling means
US3086283A (en) * 1959-08-24 1963-04-23 Charles A Webber Method for improving assembly of heat exchanger for semiconductors
US3216496A (en) * 1961-02-01 1965-11-09 Astro Dynamics Inc Heat sink for electronic devices
US3171069A (en) * 1961-10-12 1965-02-23 Udylite Corp Diode heat sink structure
US3261396A (en) * 1963-11-13 1966-07-19 Staver Co Heat dissipator for electronic circuitry
US3313340A (en) * 1965-03-23 1967-04-11 Lambda Electronics Corp Heat exchanger

Also Published As

Publication number Publication date
DE1764486C3 (de) 1973-12-13
FR1586363A (en:Method) 1970-02-20
DE1764486A1 (de) 1972-03-30
US3416597A (en) 1968-12-17
GB1172332A (en) 1969-11-26
NL6808229A (en:Method) 1968-12-16
DE1764486B2 (de) 1973-05-30

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