NL6805947A - - Google Patents

Info

Publication number
NL6805947A
NL6805947A NL6805947A NL6805947A NL6805947A NL 6805947 A NL6805947 A NL 6805947A NL 6805947 A NL6805947 A NL 6805947A NL 6805947 A NL6805947 A NL 6805947A NL 6805947 A NL6805947 A NL 6805947A
Authority
NL
Netherlands
Application number
NL6805947A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6805947A publication Critical patent/NL6805947A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
NL6805947A 1967-05-01 1968-04-26 NL6805947A (ref)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB09989/67A GB1235101A (en) 1967-05-01 1967-05-01 Improvements relating to electrodeposition of copper

Publications (1)

Publication Number Publication Date
NL6805947A true NL6805947A (ref) 1968-11-04

Family

ID=10138480

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6805947A NL6805947A (ref) 1967-05-01 1968-04-26

Country Status (8)

Country Link
US (3) US3674660A (ref)
BE (1) BE714454A (ref)
DE (1) DE1771228C3 (ref)
ES (1) ES353094A1 (ref)
FR (1) FR1564283A (ref)
GB (1) GB1235101A (ref)
NL (1) NL6805947A (ref)
SE (1) SE332744B (ref)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5167234A (ja) * 1974-12-09 1976-06-10 Hitachi Ltd Pirorinsandometsukizeikahimakuboshiho
US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US4877518A (en) * 1988-05-02 1989-10-31 Phillips Petroleum Company Ore flotation employing dimercaptothiadiazoles
US4966688A (en) * 1988-06-23 1990-10-30 Phillips Petroleum Company Ore flotation employing amino mercaptothiadiazoles
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
US4976826A (en) * 1990-02-16 1990-12-11 Furukawa Circuit Foil Co., Ltd. Method of making electrodeposited copper foil
US5314756A (en) * 1991-11-27 1994-05-24 Hitachi Metals, Ltd. Permanent magnet of rare-earth-element/transition-metal system having improved corrosion resistance and manufacturing method thereof
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
AU3735797A (en) * 1996-06-26 1998-01-14 Park Electrochemical Corporation A process for producing polytetrafluoroethylene (ptfe) dielectric boards on metal plates
US6444110B2 (en) 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
US6709564B1 (en) * 1999-09-30 2004-03-23 Rockwell Scientific Licensing, Llc Integrated circuit plating using highly-complexed copper plating baths
TWI255871B (en) * 2000-12-20 2006-06-01 Learonal Japan Inc Electrolytic copper plating solution and process for electrolytic plating using the same
AU2003248060A1 (en) 2003-07-11 2005-01-28 Shishiai-Kabushikigaisha Cooling fluid composition for fuel battery
JP4759387B2 (ja) * 2003-12-25 2011-08-31 シーシーアイ株式会社 冷却液組成物
EP2357268A4 (en) * 2008-11-11 2012-12-05 Yuken Kogyo Co Ltd ZINCING BATH BASED WITH ZINCATE
US20120028073A1 (en) * 2009-02-12 2012-02-02 Technion Research & Development Foundation Ltd. Process for electroplating of copper
CN103173812B (zh) * 2013-03-21 2015-12-09 山东金宝电子股份有限公司 一种消除电解铜箔内应力的混合添加剂及用于生产低应力铜箔的方法
SE545031C2 (en) * 2021-07-15 2023-03-07 Seolfor Ab Compositions, methods and preparations of cyanide-free copper solutions, suitable for electroplating of copper deposits and alloys thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2195409A (en) * 1936-07-31 1940-04-02 Nat Aniline & Chem Co Inc Electrodeposition
US2437865A (en) * 1943-09-25 1948-03-16 United Chromium Inc Method of electrodepositing copper and baths and compositions therefor
US2700019A (en) * 1951-07-05 1955-01-18 Westinghouse Electric Corp Acid copper plating
NL267368A (ref) * 1960-07-23
US3341433A (en) * 1964-05-01 1967-09-12 M & T Chemicals Inc Electrodeposition of nickel

Also Published As

Publication number Publication date
ES353094A1 (es) 1969-10-01
US3784454A (en) 1974-01-08
GB1235101A (en) 1971-06-09
DE1771228A1 (de) 1973-04-26
DE1796337B2 (de) 1976-09-02
FR1564283A (ref) 1969-04-18
BE714454A (ref) 1968-09-16
SE332744B (ref) 1971-02-15
US3674660A (en) 1972-07-04
DE1771228B2 (de) 1974-01-24
DE1771228C3 (de) 1974-08-22
US3729393A (en) 1973-04-24
DE1796337A1 (de) 1974-02-28

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Legal Events

Date Code Title Description
BN A decision not to publish the application has become irrevocable