NL281641A - - Google Patents

Info

Publication number
NL281641A
NL281641A NL281641DA NL281641A NL 281641 A NL281641 A NL 281641A NL 281641D A NL281641D A NL 281641DA NL 281641 A NL281641 A NL 281641A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of NL281641A publication Critical patent/NL281641A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01005—Boron [B]
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01014—Silicon [Si]
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    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
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    • H01L2924/01021—Scandium [Sc]
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    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
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    • H01L2924/01032—Germanium [Ge]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
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    • H01L2924/01042—Molybdenum [Mo]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01043—Technetium [Tc]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
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    • H01L2924/01073—Tantalum [Ta]
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    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
NL281641D 1961-08-04 NL281641A (US07923587-20110412-C00001.png)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES75181A DE1276209B (de) 1961-08-04 1961-08-04 Halter fuer mindestens ein scheibenfoermiges Halbleiterbauelement
DES0077980 1962-02-10

Publications (1)

Publication Number Publication Date
NL281641A true NL281641A (US07923587-20110412-C00001.png) 1900-01-01

Family

ID=25996550

Family Applications (5)

Application Number Title Priority Date Filing Date
NL288523D NL288523A (US07923587-20110412-C00001.png) 1961-08-04
NL281641D NL281641A (US07923587-20110412-C00001.png) 1961-08-04
NL136972D NL136972C (US07923587-20110412-C00001.png) 1961-08-04
NL7214496A NL7214496A (US07923587-20110412-C00001.png) 1961-08-04 1972-10-26
NL7214497A NL7214497A (US07923587-20110412-C00001.png) 1961-08-04 1972-10-26

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL288523D NL288523A (US07923587-20110412-C00001.png) 1961-08-04

Family Applications After (3)

Application Number Title Priority Date Filing Date
NL136972D NL136972C (US07923587-20110412-C00001.png) 1961-08-04
NL7214496A NL7214496A (US07923587-20110412-C00001.png) 1961-08-04 1972-10-26
NL7214497A NL7214497A (US07923587-20110412-C00001.png) 1961-08-04 1972-10-26

Country Status (7)

Country Link
US (2) US3280389A (US07923587-20110412-C00001.png)
BE (2) BE628175A (US07923587-20110412-C00001.png)
CH (2) CH456772A (US07923587-20110412-C00001.png)
DE (2) DE1276209B (US07923587-20110412-C00001.png)
GB (2) GB1009359A (US07923587-20110412-C00001.png)
NL (5) NL7214496A (US07923587-20110412-C00001.png)
SE (2) SE312859B (US07923587-20110412-C00001.png)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1248814B (de) * 1962-05-28 1968-03-14 Siemens Ag Halbleiterbauelement und zugehörige Kühlordnung
NL302170A (US07923587-20110412-C00001.png) * 1963-06-15
US3414964A (en) * 1964-01-24 1968-12-10 Siemens Ag Method for the production of a soldered joint
US3313987A (en) * 1964-04-22 1967-04-11 Int Rectifier Corp Compression bonded semiconductor device
USB411062I5 (US07923587-20110412-C00001.png) * 1964-11-13
US3328650A (en) * 1965-01-14 1967-06-27 Int Rectifier Corp Compression bonded semiconductor device
US3413532A (en) * 1965-02-08 1968-11-26 Westinghouse Electric Corp Compression bonded semiconductor device
CH442502A (de) * 1965-04-23 1967-08-31 Siemens Ag Gleichrichteranlage
GB1132847A (en) * 1965-04-27 1968-11-06 Lucas Industries Ltd Full wave rectifier assemblies
DE1514477C3 (de) * 1965-06-10 1975-06-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiteranordnung mit einer Anzahl von Halbleiterbauelementen
NL136731C (US07923587-20110412-C00001.png) * 1965-06-23
US3354258A (en) * 1965-07-21 1967-11-21 Hughes Aircraft Co Package for semiconductor devices and method of making same
DE1299076B (de) * 1966-06-10 1969-07-10 Siemens Ag Halbleiter-Scheibenzellen-Anordnung mit mindestens einem Paar zwischen Druckstuecken eingespannten Zellen
CH440464A (de) * 1966-07-14 1967-07-31 Bbc Brown Boveri & Cie Kühlkörper für Halbleiterelemente
GB1191887A (en) * 1966-09-02 1970-05-13 Gen Electric Semiconductor Rectifier Assemblies
US3457472A (en) * 1966-10-10 1969-07-22 Gen Electric Semiconductor devices adapted for pressure mounting
CA869745A (en) * 1967-09-11 1971-04-27 R. Petersen Sigrud Spring mounted pressure diodes
DE1614640B1 (de) * 1967-10-26 1971-12-02 Siemens Ag Gleichrichteranordnung
US3512053A (en) * 1968-01-25 1970-05-12 Asea Ab Semi-conductor device having means pressing a connector into contact with a semi-conductor disc
FR1600561A (US07923587-20110412-C00001.png) * 1968-01-26 1970-07-27
US3523215A (en) * 1968-03-19 1970-08-04 Westinghouse Electric Corp Stack module for flat package semiconductor device assemblies
US3536960A (en) * 1968-06-26 1970-10-27 Electric Regulator Corp Heat sink module
GB1260657A (en) * 1968-11-26 1972-01-19 Westinghouse Brake & Signal Improvements relating to mountings for rectifier devices
US3571663A (en) * 1969-01-08 1971-03-23 Chemetron Corp Releasable clamp assembly for a solid state circuit element
US3573569A (en) * 1969-08-12 1971-04-06 Gen Motors Corp Controlled rectifier mounting assembly
US3661013A (en) * 1969-12-23 1972-05-09 Electric Regulator Corp Semiconductor assembly
US3651383A (en) * 1970-02-05 1972-03-21 Gen Electric Unitary high power semiconductor subassembly suitable for mounting on a separable heat sink
SE350874B (US07923587-20110412-C00001.png) * 1970-03-05 1972-11-06 Asea Ab
US3763402A (en) * 1970-11-09 1973-10-02 Gen Electric Fluid cooled rectifier holding assembly
US3715632A (en) * 1971-01-08 1973-02-06 Gen Electric Liquid cooled semiconductor device clamping assembly
CH533362A (de) * 1971-06-25 1973-01-31 Bbc Brown Boveri & Cie Halbleiterbauelement
US3718841A (en) * 1971-07-09 1973-02-27 Gen Electric Modular rectifier holding assembly with heat sink supporting circuit protecting means
US3727114A (en) * 1971-08-03 1973-04-10 Mitsubishi Electric Corp Air cooled semiconductor stack
FR2164545B1 (US07923587-20110412-C00001.png) * 1971-12-21 1974-06-07 Ibm France
US3808471A (en) * 1972-10-26 1974-04-30 Borg Warner Expandible pressure mounted semiconductor assembly
US3800191A (en) * 1972-10-26 1974-03-26 Borg Warner Expandible pressure mounted semiconductor assembly
CS180334B1 (en) * 1975-11-28 1977-12-30 Jiri Kovar Power semiconducting disc elements suppressing and jigging equipment
DE2603813C2 (de) * 1976-02-02 1982-11-18 Brown, Boveri & Cie Ag, 6800 Mannheim Spannvorrichtung für ein thermisch und elektrisch druckkontaktiertes Halbleiterbauelement in Scheibenzellenbauweise
DE3363736D1 (en) * 1982-09-10 1986-07-03 Bbc Brown Boveri & Cie Horizontal axis rectifier device
US4562512A (en) * 1984-07-23 1985-12-31 Sundstrand Corporation Multiple semiconductor containing package having a heat sink core
US4686499A (en) * 1984-09-28 1987-08-11 Cincinnati Microwave, Inc. Police radar warning receiver with cantilevered PC board structure
GB2189343B (en) * 1986-04-02 1990-11-14 Int Rectifier Co Ltd Semi-conductor modules
US5548965A (en) * 1995-05-31 1996-08-27 Spectronics Corporation Multi-cavity evaporator
FR2748888B1 (fr) * 1996-05-14 1998-06-19 Gec Alsthom Transport Sa Dispositif a elements semi-conducteurs de puissance
US5923083A (en) * 1997-03-01 1999-07-13 Microsemi Corporation Packaging technology for Schottky die
USD420335S (en) * 1998-01-16 2000-02-08 Inductotherm Corp. Location device
US5940273A (en) * 1998-06-08 1999-08-17 Inductotherm Corp. Semiconductor clamping device
TWM320181U (en) * 2007-01-11 2007-10-01 Everlight Electronics Co Ltd Altenating current light emitting diode device
EP2109885B1 (en) * 2007-01-26 2016-05-04 Inductotherm Corp. Compression clamping of semiconductor components
WO2014184061A1 (en) * 2013-05-13 2014-11-20 Abb Technology Ag Spacer system for a semiconductor switching device
DE102013227000B4 (de) * 2013-12-20 2020-04-16 Siemens Aktiengesellschaft Elektrisches Modul
US10978313B2 (en) * 2018-02-20 2021-04-13 International Business Machines Corporation Fixture facilitating heat sink fabrication
EP4372806A1 (en) * 2022-11-15 2024-05-22 GE Energy Power Conversion Technology Ltd Heatsink for cooling electronic device packages and associated packaging stack

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR7281E (fr) * 1906-07-07 1907-06-19 Vindrier Freres Soc Perfectionnement dans les cannetières
NL179929C (US07923587-20110412-C00001.png) * 1952-11-03 1900-01-01 Du Pont
NL87784C (US07923587-20110412-C00001.png) * 1953-10-23 1958-04-15
BE543787A (US07923587-20110412-C00001.png) * 1954-12-21
US2839710A (en) * 1955-05-12 1958-06-17 Westinghouse Freins & Signaux Rectifier assemblies
US2806187A (en) * 1955-11-08 1957-09-10 Westinghouse Electric Corp Semiconductor rectifier device
US2956214A (en) * 1955-11-30 1960-10-11 Bogue Elec Mfg Co Diode
CH344786A (de) * 1956-06-29 1960-02-29 Bbc Brown Boveri & Cie Kühler für die Wärmeableitung an einer in einem Gefäss eingebauten Halbleiterzelle
FR1165234A (fr) * 1957-01-19 1958-10-20 Westinghouse Freins & Signaux Procédé de fixation d'un capot de protection d'un organe sensible tel que redresseur sur un socle destiné à supporter ledit organe et produit industriel en résultant
GB883862A (en) * 1958-05-29 1961-12-06 Ass Elect Ind Improvements relating to semi-conductor rectifiers
NL241492A (US07923587-20110412-C00001.png) * 1958-07-21
FR1256292A (fr) * 1959-05-04 1961-03-17 Thomson Houston Comp Francaise Perfectionnements aux redresseurs
GB1001269A (US07923587-20110412-C00001.png) * 1960-09-30 1900-01-01

Also Published As

Publication number Publication date
SE329212B (US07923587-20110412-C00001.png) 1970-10-05
GB1009359A (en) 1965-11-10
NL136972C (US07923587-20110412-C00001.png) 1900-01-01
SE312859B (US07923587-20110412-C00001.png) 1969-07-28
GB1029171A (en) 1966-05-11
CH417775A (de) 1966-07-31
DE1276209B (de) 1968-08-29
BE620870A (US07923587-20110412-C00001.png) 1900-01-01
NL7214496A (US07923587-20110412-C00001.png) 1973-02-26
CH456772A (de) 1968-07-31
NL7214497A (US07923587-20110412-C00001.png) 1973-02-26
US3226466A (en) 1965-12-28
DE1439126A1 (de) 1969-01-30
BE628175A (US07923587-20110412-C00001.png) 1900-01-01
US3280389A (en) 1966-10-18
DE1439126C3 (de) 1974-07-18
DE1439126B2 (de) 1973-12-20
NL288523A (US07923587-20110412-C00001.png) 1900-01-01

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