NL272139A - - Google Patents

Info

Publication number
NL272139A
NL272139A NL272139DA NL272139A NL 272139 A NL272139 A NL 272139A NL 272139D A NL272139D A NL 272139DA NL 272139 A NL272139 A NL 272139A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of NL272139A publication Critical patent/NL272139A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/005—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of glass or ceramic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/10—Glass interlayers, e.g. frit or flux
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/66—Forming laminates or joined articles showing high dimensional accuracy, e.g. indicated by the warpage
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/76—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/80—Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Products (AREA)
  • Lead Frames For Integrated Circuits (AREA)
NL272139D 1960-12-15 NL272139A (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US76046A US3220095A (en) 1960-12-15 1960-12-15 Method for forming enclosures for semiconductor devices

Publications (1)

Publication Number Publication Date
NL272139A true NL272139A (en:Method) 1900-01-01

Family

ID=22129611

Family Applications (1)

Application Number Title Priority Date Filing Date
NL272139D NL272139A (en:Method) 1960-12-15

Country Status (5)

Country Link
US (1) US3220095A (en:Method)
DE (1) DE1239020B (en:Method)
FR (1) FR1307782A (en:Method)
GB (1) GB991940A (en:Method)
NL (1) NL272139A (en:Method)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3435516A (en) * 1959-05-06 1969-04-01 Texas Instruments Inc Semiconductor structure fabrication
DE1416437B2 (de) * 1961-09-21 1970-06-11 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Trägerplatte für mikrominiaturisierte Schaltelemente und Verfahren zu ihrer Herstellung
US3335336A (en) * 1962-06-04 1967-08-08 Nippon Electric Co Glass sealed ceramic housings for semiconductor devices
US3341649A (en) * 1964-01-17 1967-09-12 Signetics Corp Modular package for semiconductor devices
US3324357A (en) * 1964-01-29 1967-06-06 Int Standard Electric Corp Multi-terminal semiconductor device having active element directly mounted on terminal leads
US3312771A (en) * 1964-08-07 1967-04-04 Nat Beryllia Corp Microelectronic package
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng
US3382342A (en) * 1964-09-03 1968-05-07 Gti Corp Micromodular package and method of sealing same
US3333167A (en) * 1964-10-08 1967-07-25 Dreyfus Jean-Paul Leon Housing for transistor die
US3340347A (en) * 1964-10-12 1967-09-05 Corning Glass Works Enclosed electronic device
US3349481A (en) * 1964-12-29 1967-10-31 Alpha Microelectronics Company Integrated circuit sealing method and structure
US3497947A (en) * 1967-08-18 1970-03-03 Frank J Ardezzone Miniature circuit connection and packaging techniques
US3574929A (en) * 1969-06-02 1971-04-13 Bourns Inc Adustable resistors and method
US3730969A (en) * 1972-03-06 1973-05-01 Rca Corp Electronic device package
US4326214A (en) * 1976-11-01 1982-04-20 National Semiconductor Corporation Thermal shock resistant package having an ultraviolet light transmitting window for a semiconductor chip

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2735162A (en) * 1956-02-21 Method of making heating elements
US2089541A (en) * 1933-10-30 1937-08-10 Dallenbach Walter Electrode lead-in for metal vacuum vessels
US2306054A (en) * 1938-02-19 1942-12-22 Corning Glass Works Glass heating and working
US2235504A (en) * 1939-04-19 1941-03-18 Westinghouse Electric & Mfg Co Ignitron starter
US2568881A (en) * 1948-12-28 1951-09-25 Steatite Res Corp Ceramic parts for electrical devices having magnetic properties and method of making
USRE25161E (en) * 1953-03-24 1962-04-17 Filament bar casing and method
US2937410A (en) * 1954-09-03 1960-05-24 Edith M Davies Method of molding capacitors in printed circuits
CH320932A (fr) * 1954-11-01 1957-04-15 Omega Brandt & Freres Sa Louis Ampoule pour organes électroniques, notamment pour transistors
US2830238A (en) * 1955-09-30 1958-04-08 Hughes Aircraft Co Heat dissipating semiconductor device
US2880383A (en) * 1956-10-05 1959-03-31 Motorola Inc High frequency transistor package
BE566982A (en:Method) * 1957-04-24
GB920607A (en:Method) * 1958-11-29
US2971138A (en) * 1959-05-18 1961-02-07 Rca Corp Circuit microelement

Also Published As

Publication number Publication date
DE1239020B (de) 1967-04-20
GB991940A (en) 1965-05-12
FR1307782A (fr) 1962-10-26
US3220095A (en) 1965-11-30

Similar Documents

Publication Publication Date Title
DE7626244U1 (en:Method)
AT12687B (en:Method)
AT11472B (en:Method)
GB322309A (en:Method)
AT11578B (en:Method)
AT15472B (en:Method)
AT1395B (en:Method)
AT14210B (en:Method)
DE7738634U1 (en:Method)
AT11404B (en:Method)
AT11700B (en:Method)
AT11435B (en:Method)
AT11454B (en:Method)
AT11475B (en:Method)
AT12752B (en:Method)
AT11687B (en:Method)
AT11906B (en:Method)
AT11892B (en:Method)
AT11345B (en:Method)
AT11810B (en:Method)
AT11588B (en:Method)
AT10880B (en:Method)
AT11854B (en:Method)
AT2551B (en:Method)
AT11674B (en:Method)