NL267988A - - Google Patents
Info
- Publication number
- NL267988A NL267988A NL267988DA NL267988A NL 267988 A NL267988 A NL 267988A NL 267988D A NL267988D A NL 267988DA NL 267988 A NL267988 A NL 267988A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/003—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised by the matrix material, e.g. material composition or physical properties
- B29C70/0035—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised by the matrix material, e.g. material composition or physical properties comprising two or more matrix materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
- B29K2309/08—Glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
- Y10T428/31544—Addition polymer is perhalogenated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
- Y10T428/31699—Ester, halide or nitrile of addition polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
- Y10T442/3382—Including a free metal or alloy constituent
- Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
- Y10T442/3423—Plural metallic films or foils or sheets
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US49814A US3136680A (en) | 1960-08-15 | 1960-08-15 | Polytetrafluoroethylene copper laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
NL267988A true NL267988A (sv) | 1900-01-01 |
Family
ID=21961881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL267988D NL267988A (sv) | 1960-08-15 |
Country Status (3)
Country | Link |
---|---|
US (1) | US3136680A (sv) |
GB (1) | GB928267A (sv) |
NL (1) | NL267988A (sv) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1348589A (sv) * | 1962-11-30 | 1964-04-10 | ||
US3324280A (en) * | 1964-08-06 | 1967-06-06 | Frank E Cheney | Insulated metal sheath heating element for electric water heaters |
US3462333A (en) * | 1965-02-25 | 1969-08-19 | Ramsey Corp | Method of making seal |
US3463871A (en) * | 1965-05-27 | 1969-08-26 | Philadelphia Insulated Wire Co | Strippable insulated electrical wire |
US3437032A (en) * | 1965-07-01 | 1969-04-08 | Xerox Corp | Heated fuser roll |
US3486961A (en) * | 1966-07-27 | 1969-12-30 | Minnesota Mining & Mfg | Continuous method for making a polytetrafluoroethylene laminate |
US3502498A (en) * | 1967-08-18 | 1970-03-24 | Dilectrix Corp | Metal-fluorocarbon adherent composite structures and process for preparing same |
US3676566A (en) * | 1967-08-18 | 1972-07-11 | Du Pont | Laminar structures of polyimide and fluorocarbon polymers |
US3496336A (en) * | 1967-10-25 | 1970-02-17 | Texas Instruments Inc | Electric heater |
US3504103A (en) * | 1968-06-28 | 1970-03-31 | Rogers Corp | Multilayer electrical conductor assembly |
US3536546A (en) * | 1968-10-07 | 1970-10-27 | North American Rockwell | Method of improving adhesion of copperepoxy glass laminates |
US3645834A (en) * | 1969-03-24 | 1972-02-29 | Goodyear Tire & Rubber | Reinforced fluorocarbon polyamide containers |
US3650827A (en) * | 1969-11-17 | 1972-03-21 | Electronized Chem Corp | Fep cables |
JPS5445440A (en) * | 1977-09-19 | 1979-04-10 | Oiles Industry Co Ltd | Double layer bearing and method of producing same |
US4335180A (en) * | 1978-12-26 | 1982-06-15 | Rogers Corporation | Microwave circuit boards |
US4451527A (en) * | 1981-07-28 | 1984-05-29 | Minnesota Mining And Manufacturing Company | Conformable metal-clad laminate |
US4468293A (en) * | 1982-03-05 | 1984-08-28 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
US4515671A (en) * | 1983-01-24 | 1985-05-07 | Olin Corporation | Electrochemical treatment of copper for improving its bond strength |
US4770927A (en) * | 1983-04-13 | 1988-09-13 | Chemical Fabrics Corporation | Reinforced fluoropolymer composite |
US4510208A (en) * | 1983-07-01 | 1985-04-09 | The Dow Chemical Company | Duplex metal alloy/polymer compositions |
US4490218A (en) * | 1983-11-07 | 1984-12-25 | Olin Corporation | Process and apparatus for producing surface treated metal foil |
US4690845A (en) * | 1984-02-22 | 1987-09-01 | Gila River Products, Inc. | Method and apparatus for laminating flexible printed circuits |
JPS60214942A (ja) * | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | 圧縮変形しにくい延伸多孔質四弗化エチレン樹脂体 |
JPS60214941A (ja) * | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | プリント基板 |
JPS60225750A (ja) * | 1984-04-24 | 1985-11-11 | 株式会社 潤工社 | プリント基板 |
US4609586A (en) * | 1984-08-02 | 1986-09-02 | The Boeing Company | Thermally conductive printed wiring board laminate |
US4634631A (en) * | 1985-07-15 | 1987-01-06 | Rogers Corporation | Flexible circuit laminate and method of making the same |
US4824511A (en) * | 1987-10-19 | 1989-04-25 | E. I. Du Pont De Nemours And Company | Multilayer circuit board with fluoropolymer interlayers |
US4886699A (en) * | 1987-10-26 | 1989-12-12 | Rogers Corporation | Glass fiber reinforced fluoropolymeric circuit laminate |
EP0318876A3 (en) * | 1987-11-30 | 1989-10-18 | E.I. Du Pont De Nemours And Company | Method for improving the adhesion of a metal to a fluoropolymer |
US4895752A (en) * | 1987-12-18 | 1990-01-23 | E. I. Du Pont De Nemours And Company | Low dielectric constant laminate of fluoropolymer and polyaramid |
CA1298770C (en) * | 1987-12-18 | 1992-04-14 | Craig S. Mcewen | Low dielectric constant laminate of fluoropolymer and polyaramid |
US4868350A (en) * | 1988-03-07 | 1989-09-19 | International Business Machines Corporation | High performance circuit boards |
US4861648A (en) * | 1988-03-14 | 1989-08-29 | Gila River Products, Inc. | Materials for laminating flexible printed circuits |
US5141800A (en) * | 1989-02-02 | 1992-08-25 | Chemical Fabrics Corporation | Method of making laminated PTFE-containing composites and products thereof |
DE69132258D1 (de) * | 1990-11-14 | 2000-07-27 | Titeflex Corp | Laminate aus Fluorpolymer und Aluminium |
US5468561A (en) * | 1993-11-05 | 1995-11-21 | Texas Instruments Incorporated | Etching and patterning an amorphous copolymer made from tetrafluoroethylene and 2,2-bis(trifluoromethyl)-4,5-difluoro-1,3-dioxole (TFE AF) |
SE513875C2 (sv) * | 1998-06-15 | 2000-11-20 | Ericsson Telefon Ab L M | Elektrisk komponent samt ett flerlagrigt kretskort |
US6215649B1 (en) * | 1998-11-05 | 2001-04-10 | International Business Machines Corporation | Printed circuit board capacitor structure and method |
US6574090B2 (en) | 1998-11-05 | 2003-06-03 | International Business Machines Corporatiion | Printed circuit board capacitor structure and method |
JP4545682B2 (ja) * | 2005-12-05 | 2010-09-15 | 株式会社潤工社 | 弗素樹脂積層基板 |
KR102125905B1 (ko) * | 2013-04-25 | 2020-06-24 | 삼성디스플레이 주식회사 | 인쇄 회로 기판, 표시 장치 및 인쇄 회로 기판의 제조 방법 |
JP6275200B2 (ja) * | 2016-06-16 | 2018-02-07 | 日本化薬株式会社 | 高周波回路に適した両面回路用基板 |
TWI725538B (zh) * | 2019-09-04 | 2021-04-21 | 台燿科技股份有限公司 | 金屬箔積層板、印刷電路板、及金屬箔積層板之製法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2700212A (en) * | 1948-10-15 | 1955-01-25 | Gen Electric | Electrical conductor |
BE495038A (sv) * | 1949-04-09 | 1900-01-01 | ||
US2833686A (en) * | 1955-06-20 | 1958-05-06 | Du Pont | Bonding polytetrafluoroethylene resins |
US2955974A (en) * | 1957-06-10 | 1960-10-11 | Int Resistance Co | Metal to plastic laminated article and the method of making the same |
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0
- NL NL267988D patent/NL267988A/xx unknown
-
1960
- 1960-08-15 US US49814A patent/US3136680A/en not_active Expired - Lifetime
-
1961
- 1961-06-12 GB GB21112/61A patent/GB928267A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB928267A (en) | 1963-06-12 |
US3136680A (en) | 1964-06-09 |