NL219101A - - Google Patents

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Publication number
NL219101A
NL219101A NL219101DA NL219101A NL 219101 A NL219101 A NL 219101A NL 219101D A NL219101D A NL 219101DA NL 219101 A NL219101 A NL 219101A
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NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of NL219101A publication Critical patent/NL219101A/xx

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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S228/903—Metal to nonmetal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
NL219101D 1956-10-31 NL219101A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US619639A US3006067A (en) 1956-10-31 1956-10-31 Thermo-compression bonding of metal to semiconductors, and the like

Publications (1)

Publication Number Publication Date
NL219101A true NL219101A (ja) 1900-01-01

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NL219101D NL219101A (ja) 1956-10-31
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US (1) US3006067A (ja)
BE (1) BE559732A (ja)
CH (1) CH351342A (ja)
DE (1) DE1127000C2 (ja)
FR (1) FR1179416A (ja)
GB (2) GB881832A (ja)
NL (2) NL113327C (ja)

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US3136050A (en) * 1959-11-17 1964-06-09 Texas Instruments Inc Container closure method
US3179785A (en) * 1960-09-20 1965-04-20 Hughes Aircraft Co Apparatus for thermo-compression bonding
US3125803A (en) * 1960-10-24 1964-03-24 Terminals
NL132800C (ja) * 1960-11-16
NL275554A (ja) * 1961-04-19 1900-01-01
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DE1281812C2 (de) * 1961-08-30 1973-04-26 Western Electric Co Vorrichtung zum anschweissen von duennen draehten an halbleiterbauteile mit hilfe der presschweissung (kalt- und warmschweissung), mit einer zufuhr fuer den draht an einem, den pressdruck auf den draht uebertragenden schweisskopf, der an seinem schweissende zur aufnahme des drahtes profiliert ist
NL283249A (ja) * 1961-09-19 1900-01-01
DE1251871B (ja) * 1962-02-06 1900-01-01
NL292051A (ja) * 1962-04-27
US3217401A (en) * 1962-06-08 1965-11-16 Transitron Electronic Corp Method of attaching metallic heads to silicon layers of semiconductor devices
US3271625A (en) * 1962-08-01 1966-09-06 Signetics Corp Electronic package assembly
US3304595A (en) * 1962-11-26 1967-02-21 Nippon Electric Co Method of making a conductive connection to a semiconductor device electrode
US3356914A (en) * 1963-05-03 1967-12-05 Westinghouse Electric Corp Integrated semiconductor rectifier assembly
US3296692A (en) * 1963-09-13 1967-01-10 Bell Telephone Labor Inc Thermocompression wire attachments to quartz crystals
US3310858A (en) * 1963-12-12 1967-03-28 Bell Telephone Labor Inc Semiconductor diode and method of making
US3370207A (en) * 1964-02-24 1968-02-20 Gen Electric Multilayer contact system for semiconductor devices including gold and copper layers
US3286340A (en) * 1964-02-28 1966-11-22 Philco Corp Fabrication of semiconductor units
GB1106163A (en) * 1964-03-02 1968-03-13 Post Office Improvements in or relating to the bonding of metals to semiconductor, metallic or non-metallic surfaces
DE1282190B (de) * 1964-03-12 1968-11-07 Kabusihiki Kaisha Hitachi Seis Verfahren zum Herstellen von Transistoren
DE1514304A1 (de) * 1964-04-03 1969-05-14 Philco Ford Corp Halbleiteranordnung und Herstellungsverfahren hierfuer
US3362064A (en) * 1964-05-08 1968-01-09 Space Sciences Inc Measuring device
US3380155A (en) * 1965-05-12 1968-04-30 Sprague Electric Co Production of contact pads for semiconductors
US3373481A (en) * 1965-06-22 1968-03-19 Sperry Rand Corp Method of electrically interconnecting conductors
US3442003A (en) * 1965-07-26 1969-05-06 Teledyne Inc Method for interconnecting thin films
US3461542A (en) * 1966-01-06 1969-08-19 Western Electric Co Bonding leads to quartz crystals
US3523222A (en) * 1966-09-15 1970-08-04 Texas Instruments Inc Semiconductive contacts
US3465421A (en) * 1966-12-20 1969-09-09 American Standard Inc High temperature bonding to germanium
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BE559732A (ja) 1900-01-01
GB881834A (en) 1961-11-08
DE1127000B (ja) 1974-04-11
US3006067A (en) 1961-10-31
CH351342A (fr) 1961-01-15
NL113327C (ja) 1900-01-01
DE1127000C2 (de) 1974-04-11
FR1179416A (fr) 1959-05-25
GB881832A (en) 1961-11-08

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