NL2013438B1 - Target processing unit. - Google Patents

Target processing unit. Download PDF

Info

Publication number
NL2013438B1
NL2013438B1 NL2013438A NL2013438A NL2013438B1 NL 2013438 B1 NL2013438 B1 NL 2013438B1 NL 2013438 A NL2013438 A NL 2013438A NL 2013438 A NL2013438 A NL 2013438A NL 2013438 B1 NL2013438 B1 NL 2013438B1
Authority
NL
Netherlands
Prior art keywords
conduits
processing unit
target processing
plane
vacuum chamber
Prior art date
Application number
NL2013438A
Other languages
English (en)
Dutch (nl)
Other versions
NL2013438A (en
Inventor
Joost Koning Johan
Johannes Van Den Bergen David
Original Assignee
Mapper Lithography Ip Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mapper Lithography Ip Bv filed Critical Mapper Lithography Ip Bv
Publication of NL2013438A publication Critical patent/NL2013438A/en
Application granted granted Critical
Publication of NL2013438B1 publication Critical patent/NL2013438B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/023—Means for mechanically adjusting components not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/12—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electromagnetic waves
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/10—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002—Details
    • H01J37/3007—Electron or ion-optical systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177—Multi-beam, e.g. fly's eye, comb probe

Landscapes

  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electromagnetism (AREA)
  • General Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
NL2013438A 2013-09-07 2014-09-08 Target processing unit. NL2013438B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361875016P 2013-09-07 2013-09-07
US201361875016 2013-09-07

Publications (2)

Publication Number Publication Date
NL2013438A NL2013438A (en) 2015-03-10
NL2013438B1 true NL2013438B1 (en) 2016-05-18

Family

ID=51492355

Family Applications (2)

Application Number Title Priority Date Filing Date
NL2013437A NL2013437B1 (en) 2013-09-07 2014-09-08 Target processing unit.
NL2013438A NL2013438B1 (en) 2013-09-07 2014-09-08 Target processing unit.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL2013437A NL2013437B1 (en) 2013-09-07 2014-09-08 Target processing unit.

Country Status (6)

Country Link
US (2) US9263234B2 (enExample)
JP (2) JP6224252B2 (enExample)
KR (2) KR101784752B1 (enExample)
CN (2) CN105745577B (enExample)
NL (2) NL2013437B1 (enExample)
WO (1) WO2015032955A1 (enExample)

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RU2014114517A (ru) * 2011-09-12 2015-10-20 МЭППЕР ЛИТОГРАФИ АйПи Б.В. Устройство обработки подложки
JP5853122B2 (ja) * 2013-05-10 2016-02-09 株式会社日立ハイテクノロジーズ 荷電粒子線装置
DE102016217285A1 (de) * 2016-09-12 2018-03-15 Carl Zeiss Smt Gmbh Vorrichtung zur übertragung von elektrischen signalen sowie lithographieanlage
US11106145B2 (en) * 2016-10-17 2021-08-31 Nikon Corporation Exposure system and lithography system
US10905025B1 (en) * 2019-06-12 2021-01-26 Facebook, Inc. Interconnection module and server rack
CN111239916B (zh) * 2020-02-12 2021-05-18 烽火通信科技股份有限公司 光纤背板上光纤连接器用的清洁工具及清洁方法
KR102467191B1 (ko) * 2020-03-11 2022-11-16 주식회사 포스코 광 점퍼 코드 안전 장치 및 그를 이용한 전력 계통 시스템
CN113495436B (zh) * 2021-07-13 2023-12-29 江门市和盈新材料科技有限公司 一种光电子元件智能制造的光刻机
EP4290550A1 (en) * 2022-06-10 2023-12-13 ASML Netherlands B.V. Electron-optical device
WO2025058838A1 (en) * 2023-09-12 2025-03-20 Lam Research Corporation Prevention of atmosphere exposure in gas delivery system

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US5250808A (en) * 1987-05-21 1993-10-05 Electroscan Corporation Integrated electron optical/differential pumping/imaging signal system for an environmental scanning electron microscope
US4831270A (en) * 1987-05-21 1989-05-16 Ion Implant Services Ion implantation apparatus
JP2000512397A (ja) 1996-06-10 2000-09-19 ホログラフィック リトグラフィー システムズ，インコーポレイティド 生産環境のためのホログラフィのパターン化の方法及び工具
US6714278B2 (en) * 1996-11-25 2004-03-30 Nikon Corporation Exposure apparatus
TWI220998B (en) * 2001-02-13 2004-09-11 Nikon Corp Exposure method, exposure apparatus and manufacture method of the same
US6756706B2 (en) 2002-01-18 2004-06-29 Nikon Corporation Method and apparatus for cooling power supply wires used to drive stages in electron beam lithography machines
JP2004055933A (ja) 2002-07-22 2004-02-19 Advantest Corp 電子ビーム露光装置、及び電子ビーム計測モジュール
JP2005106166A (ja) * 2003-09-30 2005-04-21 Nikon Corp アクティブ除振装置及び露光装置
JP2005209702A (ja) * 2004-01-20 2005-08-04 Fujitsu Access Ltd 電子機器用キャビネット
JP4405867B2 (ja) * 2004-06-29 2010-01-27 キヤノン株式会社 電子線露光装置、および、デバイス製造方法
JP2006079911A (ja) * 2004-09-09 2006-03-23 Hitachi High-Technologies Corp 電子ビーム電流計測方法、電子ビーム描画装置および電子ビーム検出器
EP2250660A1 (en) 2008-02-26 2010-11-17 Mapper Lithography IP B.V. Projection lens arrangement
US8226795B2 (en) * 2009-02-03 2012-07-24 Nordson Corporation Magnetic clips and substrate holders for use in a plasma processing system
NL1036912C2 (en) * 2009-04-29 2010-11-01 Mapper Lithography Ip Bv Charged particle optical system comprising an electrostatic deflector.
NL2003619C2 (en) * 2009-10-09 2011-04-12 Mapper Lithography Ip Bv Projection lens assembly.
US8362441B2 (en) * 2009-10-09 2013-01-29 Mapper Lithography Ip B.V. Enhanced integrity projection lens assembly
US8638109B2 (en) * 2009-12-31 2014-01-28 Mapper Lithography Ip B.V. Capacitive sensing system with differential pairs
KR101496878B1 (ko) 2010-02-23 2015-03-02 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조 방법
US20120069317A1 (en) * 2010-09-20 2012-03-22 Jerry Peijster Lithography system arranged on a foundation, and method for arranging a lithography system on said foundation
US8895943B2 (en) * 2010-12-14 2014-11-25 Mapper Lithography Ip B.V. Lithography system and method of processing substrates in such a lithography system
JP6038882B2 (ja) * 2011-04-20 2016-12-07 マッパー・リソグラフィー・アイピー・ビー．ブイ． 光ファイバの構成体及びこのような構成体を形成する方法
NL2007392C2 (en) 2011-09-12 2013-03-13 Mapper Lithography Ip Bv Assembly for providing an aligned stack of two or more modules and a lithography system or a microscopy system comprising such an assembly.
WO2013037802A1 (en) 2011-09-12 2013-03-21 Mapper Lithography Ip B.V. Vacuum chamber with base plate
RU2014114517A (ru) * 2011-09-12 2015-10-20 МЭППЕР ЛИТОГРАФИ АйПи Б.В. Устройство обработки подложки
JP5973061B2 (ja) * 2012-05-14 2016-08-23 マッパー・リソグラフィー・アイピー・ビー．ブイ． 荷電粒子マルチ小ビームリソグラフィシステム及び冷却装置製造方法
JP5936484B2 (ja) * 2012-08-20 2016-06-22 株式会社日立ハイテクノロジーズ 荷電粒子線装置及び試料観察方法

Also Published As

Publication number Publication date
KR102124913B1 (ko) 2020-06-22
JP6580634B2 (ja) 2019-09-25
NL2013437B1 (en) 2016-05-18
CN105745577A (zh) 2016-07-06
WO2015032955A1 (en) 2015-03-12
US20150090895A1 (en) 2015-04-02
CN107272352A (zh) 2017-10-20
CN107272352B (zh) 2021-02-02
US9263234B2 (en) 2016-02-16
NL2013437A (en) 2015-03-10
JP2017224828A (ja) 2017-12-21
KR20160055852A (ko) 2016-05-18
KR20170087970A (ko) 2017-07-31
CN105745577B (zh) 2018-01-23
KR101784752B1 (ko) 2017-11-06
JP2016530728A (ja) 2016-09-29
NL2013438A (en) 2015-03-10
US9941093B2 (en) 2018-04-10
US20160126055A1 (en) 2016-05-05
JP6224252B2 (ja) 2017-11-01

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Legal Events

Date Code Title Description
RC Pledge established

Free format text: DETAILS LICENCE OR PLEDGE: RIGHT OF PLEDGE, ESTABLISHED

Name of requester: DE STAAT DER NEDERLANDEN / RIJKSDIENST VOOR ONDERN

Effective date: 20180621

PD Change of ownership

Owner name: ASML NETHERLANDS B.V.; NL

Free format text: DETAILS ASSIGNMENT: CHANGE OF OWNER(S), ASSIGNMENT; FORMER OWNER NAME: MAPPER LITHOGRAPHY IP B.V.

Effective date: 20190425