NL194524B - Method for manufacturing a thin film transistor. - Google Patents

Method for manufacturing a thin film transistor.

Info

Publication number
NL194524B
NL194524B NL8503123A NL8503123A NL194524B NL 194524 B NL194524 B NL 194524B NL 8503123 A NL8503123 A NL 8503123A NL 8503123 A NL8503123 A NL 8503123A NL 194524 B NL194524 B NL 194524B
Authority
NL
Netherlands
Prior art keywords
manufacturing
thin film
film transistor
transistor
thin
Prior art date
Application number
NL8503123A
Other languages
Dutch (nl)
Other versions
NL194524C (en
NL8503123A (en
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of NL8503123A publication Critical patent/NL8503123A/en
Publication of NL194524B publication Critical patent/NL194524B/en
Application granted granted Critical
Publication of NL194524C publication Critical patent/NL194524C/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308Chemical or electrical treatment, e.g. electrolytic etching using masks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78618Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651Silicon transistors
    • H01L29/7866Non-monocrystalline silicon transistors
    • H01L29/78672Polycrystalline or microcrystalline silicon transistor
    • H01L29/78675Polycrystalline or microcrystalline silicon transistor with normal-type structure, e.g. with top gate
NL8503123A 1984-11-15 1985-11-13 Method for manufacturing a thin film transistor. NL194524C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59241239A JPH0824184B2 (en) 1984-11-15 1984-11-15 Method for manufacturing thin film transistor
JP24123984 1984-11-15

Publications (3)

Publication Number Publication Date
NL8503123A NL8503123A (en) 1986-06-02
NL194524B true NL194524B (en) 2002-02-01
NL194524C NL194524C (en) 2002-06-04

Family

ID=17071271

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8503123A NL194524C (en) 1984-11-15 1985-11-13 Method for manufacturing a thin film transistor.

Country Status (7)

Country Link
JP (1) JPH0824184B2 (en)
KR (1) KR930010978B1 (en)
CN (1) CN85109088A (en)
DE (1) DE3540452C2 (en)
FR (1) FR2573248B1 (en)
GB (1) GB2167899B (en)
NL (1) NL194524C (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5242507A (en) * 1989-04-05 1993-09-07 Boston University Impurity-induced seeding of polycrystalline semiconductors
US5242858A (en) * 1990-09-07 1993-09-07 Canon Kabushiki Kaisha Process for preparing semiconductor device by use of a flattening agent and diffusion
JP3556679B2 (en) * 1992-05-29 2004-08-18 株式会社半導体エネルギー研究所 Electro-optical device
US5403756A (en) * 1991-11-20 1995-04-04 Sharp Kabushiki Kaisha Method of producing a polycrystalline semiconductor film without annealing, for thin film transistor
KR950003235B1 (en) * 1991-12-30 1995-04-06 주식회사 금성사 Semiconductor device structure
JP3587537B2 (en) * 1992-12-09 2004-11-10 株式会社半導体エネルギー研究所 Semiconductor device
US5985741A (en) 1993-02-15 1999-11-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
KR100612853B1 (en) * 2004-07-21 2006-08-14 삼성전자주식회사 Si based material layer having wire type silicide and method of forming the same
CN104409635B (en) 2014-12-16 2017-02-22 京东方科技集团股份有限公司 Organic thin film transistor and manufacturing method thereof, array substrate, and display unit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4177084A (en) * 1978-06-09 1979-12-04 Hewlett-Packard Company Method for producing a low defect layer of silicon-on-sapphire wafer
JPS558026A (en) * 1978-06-30 1980-01-21 Matsushita Electric Ind Co Ltd Semi-conductor device manufacturing method
JPS5856409A (en) * 1981-09-30 1983-04-04 Toshiba Corp Production of semiconductor device
JPS59165451A (en) * 1983-03-11 1984-09-18 Toshiba Corp Manufacture of semiconductor device
JPS61191070A (en) * 1985-02-20 1986-08-25 Toshiba Corp Manufacture of semiconductor device

Also Published As

Publication number Publication date
GB2167899B (en) 1988-04-27
DE3540452C2 (en) 1999-07-29
GB8527737D0 (en) 1985-12-18
NL194524C (en) 2002-06-04
JPH0824184B2 (en) 1996-03-06
CN85109088A (en) 1986-08-27
FR2573248A1 (en) 1986-05-16
FR2573248B1 (en) 1991-06-21
KR860004455A (en) 1986-06-23
GB2167899A (en) 1986-06-04
JPS61119079A (en) 1986-06-06
NL8503123A (en) 1986-06-02
KR930010978B1 (en) 1993-11-18
DE3540452A1 (en) 1986-06-05

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Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
V1 Lapsed because of non-payment of the annual fee

Effective date: 20030601