NL177553C - Werkwijze om een plaatmateriaal voor gedrukte bedradingen te vervaardigen. - Google Patents

Werkwijze om een plaatmateriaal voor gedrukte bedradingen te vervaardigen.

Info

Publication number
NL177553C
NL177553C NL7300018A NL7300018A NL177553C NL 177553 C NL177553 C NL 177553C NL 7300018 A NL7300018 A NL 7300018A NL 7300018 A NL7300018 A NL 7300018A NL 177553 C NL177553 C NL 177553C
Authority
NL
Netherlands
Prior art keywords
manufacturing
plate material
printed wires
wires
printed
Prior art date
Application number
NL7300018A
Other languages
English (en)
Dutch (nl)
Other versions
NL177553B (nl
NL7300018A (OSRAM
Original Assignee
Ohmega Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US00273756A external-priority patent/US3808576A/en
Application filed by Ohmega Technologies Inc filed Critical Ohmega Technologies Inc
Publication of NL7300018A publication Critical patent/NL7300018A/xx
Publication of NL177553B publication Critical patent/NL177553B/xx
Application granted granted Critical
Publication of NL177553C publication Critical patent/NL177553C/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0315Oxidising metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0361Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0723Electroplating, e.g. finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
NL7300018A 1972-07-21 1973-01-02 Werkwijze om een plaatmateriaal voor gedrukte bedradingen te vervaardigen. NL177553C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00273756A US3808576A (en) 1971-01-15 1972-07-21 Circuit board with resistance layer

Publications (3)

Publication Number Publication Date
NL7300018A NL7300018A (OSRAM) 1974-01-23
NL177553B NL177553B (nl) 1985-05-01
NL177553C true NL177553C (nl) 1985-10-01

Family

ID=23045271

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7300018A NL177553C (nl) 1972-07-21 1973-01-02 Werkwijze om een plaatmateriaal voor gedrukte bedradingen te vervaardigen.

Country Status (4)

Country Link
CA (1) CA959173A (OSRAM)
DE (1) DE2261249C3 (OSRAM)
IT (1) IT988081B (OSRAM)
NL (1) NL177553C (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472468A (en) * 1977-11-21 1979-06-09 Nitto Electric Ind Co Printing circuit substrate with resistance
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
DE3708832A1 (de) * 1987-03-18 1988-09-29 Siemens Ag Nasschemische strukturierung von hafniumborid-schichten

Also Published As

Publication number Publication date
NL177553B (nl) 1985-05-01
DE2261249A1 (de) 1974-01-31
DE2261249C3 (de) 1979-06-28
IT988081B (it) 1975-04-10
NL7300018A (OSRAM) 1974-01-23
DE2261249B2 (de) 1978-10-26
CA959173A (en) 1974-12-10

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Legal Events

Date Code Title Description
BB A search report has been drawn up
BC A request for examination has been filed
A85 Still pending on 85-01-01
CNR Transfer of rights (patent application after its laying openfor public ins pection)

Free format text: OHMEGA TECHNOLOGIES, INC.

V1 Lapsed because of non-payment of the annual fee