NL177553C - Werkwijze om een plaatmateriaal voor gedrukte bedradingen te vervaardigen. - Google Patents
Werkwijze om een plaatmateriaal voor gedrukte bedradingen te vervaardigen.Info
- Publication number
- NL177553C NL177553C NL7300018A NL7300018A NL177553C NL 177553 C NL177553 C NL 177553C NL 7300018 A NL7300018 A NL 7300018A NL 7300018 A NL7300018 A NL 7300018A NL 177553 C NL177553 C NL 177553C
- Authority
- NL
- Netherlands
- Prior art keywords
- manufacturing
- plate material
- printed wires
- wires
- printed
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US00273756A US3808576A (en) | 1971-01-15 | 1972-07-21 | Circuit board with resistance layer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NL7300018A NL7300018A (OSRAM) | 1974-01-23 |
| NL177553B NL177553B (nl) | 1985-05-01 |
| NL177553C true NL177553C (nl) | 1985-10-01 |
Family
ID=23045271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7300018A NL177553C (nl) | 1972-07-21 | 1973-01-02 | Werkwijze om een plaatmateriaal voor gedrukte bedradingen te vervaardigen. |
Country Status (4)
| Country | Link |
|---|---|
| CA (1) | CA959173A (OSRAM) |
| DE (1) | DE2261249C3 (OSRAM) |
| IT (1) | IT988081B (OSRAM) |
| NL (1) | NL177553C (OSRAM) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5472468A (en) * | 1977-11-21 | 1979-06-09 | Nitto Electric Ind Co | Printing circuit substrate with resistance |
| JPS56155592A (en) * | 1980-04-03 | 1981-12-01 | Furukawa Circuit Foil | Copper foil for printed circuit and method of manufacturing same |
| DE3708832A1 (de) * | 1987-03-18 | 1988-09-29 | Siemens Ag | Nasschemische strukturierung von hafniumborid-schichten |
-
1972
- 1972-12-14 DE DE19722261249 patent/DE2261249C3/de not_active Expired
- 1972-12-15 IT IT5477572A patent/IT988081B/it active
-
1973
- 1973-01-02 NL NL7300018A patent/NL177553C/xx not_active IP Right Cessation
- 1973-02-09 CA CA163,403A patent/CA959173A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| NL177553B (nl) | 1985-05-01 |
| DE2261249A1 (de) | 1974-01-31 |
| DE2261249C3 (de) | 1979-06-28 |
| IT988081B (it) | 1975-04-10 |
| NL7300018A (OSRAM) | 1974-01-23 |
| DE2261249B2 (de) | 1978-10-26 |
| CA959173A (en) | 1974-12-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BB | A search report has been drawn up | ||
| BC | A request for examination has been filed | ||
| A85 | Still pending on 85-01-01 | ||
| CNR | Transfer of rights (patent application after its laying openfor public ins pection) |
Free format text: OHMEGA TECHNOLOGIES, INC. |
|
| V1 | Lapsed because of non-payment of the annual fee |