NL177553C - METHOD OF MANUFACTURING A PLATE MATERIAL FOR PRINTED WIRES - Google Patents

METHOD OF MANUFACTURING A PLATE MATERIAL FOR PRINTED WIRES

Info

Publication number
NL177553C
NL177553C NL7300018A NL7300018A NL177553C NL 177553 C NL177553 C NL 177553C NL 7300018 A NL7300018 A NL 7300018A NL 7300018 A NL7300018 A NL 7300018A NL 177553 C NL177553 C NL 177553C
Authority
NL
Netherlands
Prior art keywords
manufacturing
plate material
printed wires
wires
printed
Prior art date
Application number
NL7300018A
Other languages
Dutch (nl)
Other versions
NL7300018A (en
NL177553B (en
Original Assignee
Ohmega Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US00273756A external-priority patent/US3808576A/en
Application filed by Ohmega Technologies Inc filed Critical Ohmega Technologies Inc
Publication of NL7300018A publication Critical patent/NL7300018A/xx
Publication of NL177553B publication Critical patent/NL177553B/en
Application granted granted Critical
Publication of NL177553C publication Critical patent/NL177553C/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
NL7300018A 1972-07-21 1973-01-02 METHOD OF MANUFACTURING A PLATE MATERIAL FOR PRINTED WIRES NL177553C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00273756A US3808576A (en) 1971-01-15 1972-07-21 Circuit board with resistance layer

Publications (3)

Publication Number Publication Date
NL7300018A NL7300018A (en) 1974-01-23
NL177553B NL177553B (en) 1985-05-01
NL177553C true NL177553C (en) 1985-10-01

Family

ID=23045271

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7300018A NL177553C (en) 1972-07-21 1973-01-02 METHOD OF MANUFACTURING A PLATE MATERIAL FOR PRINTED WIRES

Country Status (4)

Country Link
CA (1) CA959173A (en)
DE (1) DE2261249C3 (en)
IT (1) IT988081B (en)
NL (1) NL177553C (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472468A (en) * 1977-11-21 1979-06-09 Nitto Electric Ind Co Printing circuit substrate with resistance
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
DE3708832A1 (en) * 1987-03-18 1988-09-29 Siemens Ag Wet-chemical patterning of hafnium boride layers

Also Published As

Publication number Publication date
DE2261249C3 (en) 1979-06-28
NL7300018A (en) 1974-01-23
NL177553B (en) 1985-05-01
DE2261249B2 (en) 1978-10-26
CA959173A (en) 1974-12-10
DE2261249A1 (en) 1974-01-31
IT988081B (en) 1975-04-10

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Legal Events

Date Code Title Description
BB A search report has been drawn up
BC A request for examination has been filed
A85 Still pending on 85-01-01
CNR Transfer of rights (patent application after its laying openfor public ins pection)

Free format text: OHMEGA TECHNOLOGIES, INC.

V1 Lapsed because of non-payment of the annual fee