NL164725C - Werkwijze toe te passen bij het vervaardigen van een gedrukte ketenplaat, alsmede gedrukte ketenplaat vervaardigd onder toepassing van deze werkwijze. - Google Patents

Werkwijze toe te passen bij het vervaardigen van een gedrukte ketenplaat, alsmede gedrukte ketenplaat vervaardigd onder toepassing van deze werkwijze.

Info

Publication number
NL164725C
NL164725C NL7100964.A NL7100964A NL164725C NL 164725 C NL164725 C NL 164725C NL 7100964 A NL7100964 A NL 7100964A NL 164725 C NL164725 C NL 164725C
Authority
NL
Netherlands
Prior art keywords
chainplate
printed
manufactured
manufacture
printed chainplate
Prior art date
Application number
NL7100964.A
Other languages
English (en)
Dutch (nl)
Other versions
NL164725B (nl
NL7100964A (de
Original Assignee
Macdermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Inc filed Critical Macdermid Inc
Publication of NL7100964A publication Critical patent/NL7100964A/xx
Publication of NL164725B publication Critical patent/NL164725B/xx
Application granted granted Critical
Publication of NL164725C publication Critical patent/NL164725C/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
NL7100964.A 1970-01-26 1971-01-25 Werkwijze toe te passen bij het vervaardigen van een gedrukte ketenplaat, alsmede gedrukte ketenplaat vervaardigd onder toepassing van deze werkwijze. NL164725C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US588170A 1970-01-26 1970-01-26

Publications (3)

Publication Number Publication Date
NL7100964A NL7100964A (de) 1971-07-28
NL164725B NL164725B (nl) 1980-08-15
NL164725C true NL164725C (nl) 1981-01-15

Family

ID=21718185

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7100964.A NL164725C (nl) 1970-01-26 1971-01-25 Werkwijze toe te passen bij het vervaardigen van een gedrukte ketenplaat, alsmede gedrukte ketenplaat vervaardigd onder toepassing van deze werkwijze.

Country Status (8)

Country Link
US (1) US3698940A (de)
BE (1) BE761781A (de)
CH (1) CH528848A (de)
DE (2) DE2105845C3 (de)
ES (1) ES387611A1 (de)
FR (1) FR2077622B1 (de)
GB (1) GB1343211A (de)
NL (1) NL164725C (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3854973A (en) * 1970-01-26 1974-12-17 Macdermid Inc Method of making additive printed circuit boards
US3808028A (en) * 1971-08-11 1974-04-30 Western Electric Co Method of improving adhesive properties of a surface comprising a cured epoxy
US3798060A (en) * 1971-10-28 1974-03-19 Westinghouse Electric Corp Methods for fabricating ceramic circuit boards with conductive through holes
US3969555A (en) * 1972-03-30 1976-07-13 The Dow Chemical Company Aluminum plating corrosion resistance
US3775121A (en) * 1972-08-09 1973-11-27 Western Electric Co Method of selectively depositing a metal on a surface of a substrate
NL7304429A (de) * 1973-03-30 1974-10-02
GB1478341A (en) * 1973-06-07 1977-06-29 Hitachi Chemical Co Ltd Printed circuit board and method of making the same
US3876461A (en) * 1973-09-04 1975-04-08 Motorola Inc Semiconductor process
US3959523A (en) * 1973-12-14 1976-05-25 Macdermid Incorporated Additive printed circuit boards and method of manufacture
US3934334A (en) * 1974-04-15 1976-01-27 Texas Instruments Incorporated Method of fabricating metal printed wiring boards
US4006047A (en) * 1974-07-22 1977-02-01 Amp Incorporated Catalysts for electroless deposition of metals on comparatively low-temperature polyolefin and polyester substrates
US3982045A (en) * 1974-10-11 1976-09-21 Macdermid Incorporated Method of manufacture of additive printed circuitboards using permanent resist mask
US3934335A (en) * 1974-10-16 1976-01-27 Texas Instruments Incorporated Multilayer printed circuit board
US4024305A (en) * 1975-06-04 1977-05-17 International Business Machines Corporation Method for producing a resin rich epoxy prepreg and laminate
US4066809A (en) * 1976-06-28 1978-01-03 International Business Machines Corporation Method for preparing substrate surfaces for electroless deposition
US4216246A (en) * 1977-05-14 1980-08-05 Hitachi Chemical Company, Ltd. Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards
US4171240A (en) * 1978-04-26 1979-10-16 Western Electric Company, Inc. Method of removing a cured epoxy from a metal surface
JPS54141891A (en) * 1978-04-26 1979-11-05 Matsushita Electric Works Ltd Manufacturing of multi-layer printed circuit board material
US4327126A (en) * 1980-11-10 1982-04-27 Ralph Ogden Method of making printed circuit boards
US4532152A (en) * 1982-03-05 1985-07-30 Elarde Vito D Fabrication of a printed circuit board with metal-filled channels
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
US4685203A (en) * 1983-09-13 1987-08-11 Mitsubishi Denki Kabushiki Kaisha Hybrid integrated circuit substrate and method of manufacturing the same
DE3417563C2 (de) * 1984-05-11 1986-12-04 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Verfahren zur Herstellung von Metallmustern auf isolierenden Trägern, insbesondere gedruckte Schaltungen
US5108786A (en) * 1989-05-01 1992-04-28 Enthone-Omi, Inc. Method of making printed circuit boards
IT1232863B (it) * 1989-06-27 1992-03-05 Alfachimici Spa Procedimento a ciclo ridotto per la fabbricazione di circuiti stampati, e composizione per la sua attuazione
US5385787A (en) * 1993-02-03 1995-01-31 Amp-Akzo Corporation Organosilane adhesion promotion in manufacture of additive printed wiring board
US5582872A (en) * 1994-03-28 1996-12-10 Current Inc. Electrostatic dissipative laminate and method for making
DE19643670A1 (de) * 1995-10-31 1997-05-07 Whitaker Corp Überspannungs-Schutzmaterial zur Verwendung bei Schaltungsplatten
US5780366A (en) * 1996-09-10 1998-07-14 International Business Machines Corporation Technique for forming resin-impregnated fiberglass sheets using multiple resins
US5756405A (en) * 1996-09-10 1998-05-26 International Business Machines Corporation Technique for forming resin-impregnated fiberglass sheets
US5719090A (en) * 1996-09-10 1998-02-17 International Business Machines Corporation Technique for forming resin-imprenated fiberglass sheets with improved resistance to pinholing
US10278283B1 (en) * 2017-12-14 2019-04-30 Wen Yao Chang Method for forming a circuit board with a substrate made of silicon

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3326742A (en) 1963-03-25 1967-06-20 Princeton Chemical Res Inc Surface treatment and bonding of organic high polymers
US3518067A (en) 1965-08-20 1970-06-30 Union Carbide Corp Method of plating polyarylene polyethers,polycarbonate or polyhydroxyethers and the resulting articles
US3479160A (en) 1965-10-11 1969-11-18 Borg Warner Metal plating of plastic materials
US3671289A (en) 1969-09-23 1972-06-20 Crown City Plating Co Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating

Also Published As

Publication number Publication date
NL164725B (nl) 1980-08-15
DE2166971C3 (de) 1982-02-18
DE2105845A1 (de) 1971-08-26
FR2077622A1 (de) 1971-10-29
DE2166971A1 (de) 1977-02-10
DE2166971B2 (de) 1979-08-02
BE761781A (fr) 1971-07-01
GB1343211A (en) 1974-01-10
ES387611A1 (es) 1973-05-01
US3698940A (en) 1972-10-17
DE2105845C3 (de) 1978-12-07
NL7100964A (de) 1971-07-28
DE2105845B2 (de) 1976-11-04
CH528848A (fr) 1972-09-30
FR2077622B1 (de) 1974-02-01

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Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee