JPS54141891A - Manufacturing of multi-layer printed circuit board material - Google Patents
Manufacturing of multi-layer printed circuit board materialInfo
- Publication number
- JPS54141891A JPS54141891A JP5065578A JP5065578A JPS54141891A JP S54141891 A JPS54141891 A JP S54141891A JP 5065578 A JP5065578 A JP 5065578A JP 5065578 A JP5065578 A JP 5065578A JP S54141891 A JPS54141891 A JP S54141891A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- impregnated
- glass cloth
- curing
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To suppress the dilation of the title board by the flow of the impregnation resin and the shrinkage caused by the curing of the resin, and to improve the dimensional stability of the board, by impregnating a glass cloth successively with a specific amount of a polyimide resin and a thermosetting resin, and curing under specific conditions.
CONSTITUTION: A glass cloth is impregnated with 10W40wt% of a polyimide resin, and cured by heating until the resin becomes unflowable even under hot-pressing. Subsequently, the glass cloth is impregnated with a thermosetting resin such as epoxy resin etc. The total amount of the polyimide resin and the thermosetting resin is 40W65wt%. The impregnated cloth is dired by heating so as to give a resin having a curing time of 100W600 sec on a heat plate of 160°C.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5065578A JPS54141891A (en) | 1978-04-26 | 1978-04-26 | Manufacturing of multi-layer printed circuit board material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5065578A JPS54141891A (en) | 1978-04-26 | 1978-04-26 | Manufacturing of multi-layer printed circuit board material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54141891A true JPS54141891A (en) | 1979-11-05 |
Family
ID=12864954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5065578A Pending JPS54141891A (en) | 1978-04-26 | 1978-04-26 | Manufacturing of multi-layer printed circuit board material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54141891A (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3698940A (en) * | 1970-01-26 | 1972-10-17 | Macdermid Inc | Method of making additive printed circuit boards and product thereof |
JPS5139770A (en) * | 1974-09-30 | 1976-04-02 | Matsushita Electric Works Ltd | SHIANEETOJUSHISEKISOBAN NO SEIZOHOHO |
JPS51148768A (en) * | 1975-06-04 | 1976-12-21 | Ibm | Manufacture of resinnrich epoxy preepreg |
-
1978
- 1978-04-26 JP JP5065578A patent/JPS54141891A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3698940A (en) * | 1970-01-26 | 1972-10-17 | Macdermid Inc | Method of making additive printed circuit boards and product thereof |
JPS5139770A (en) * | 1974-09-30 | 1976-04-02 | Matsushita Electric Works Ltd | SHIANEETOJUSHISEKISOBAN NO SEIZOHOHO |
JPS51148768A (en) * | 1975-06-04 | 1976-12-21 | Ibm | Manufacture of resinnrich epoxy preepreg |
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