NL164140C - Werkwijze voor de bereideing van lichtgevoelige kopieermaterialen. - Google Patents

Werkwijze voor de bereideing van lichtgevoelige kopieermaterialen.

Info

Publication number
NL164140C
NL164140C NL7305260.A NL7305260A NL164140C NL 164140 C NL164140 C NL 164140C NL 7305260 A NL7305260 A NL 7305260A NL 164140 C NL164140 C NL 164140C
Authority
NL
Netherlands
Prior art keywords
copies
photosensitive
preparation
photosensitive copies
Prior art date
Application number
NL7305260.A
Other languages
English (en)
Dutch (nl)
Other versions
NL7305260A (xx
NL164140B (nl
Original Assignee
Oce Van Der Grinten Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oce Van Der Grinten Nv filed Critical Oce Van Der Grinten Nv
Publication of NL7305260A publication Critical patent/NL7305260A/xx
Publication of NL164140B publication Critical patent/NL164140B/xx
Application granted granted Critical
Publication of NL164140C publication Critical patent/NL164140C/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/016—Diazonium salts or compounds
    • G03F7/021—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders
    • G03F7/0212—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the diazo resins or the polymeric diazonium compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/008—Azides
    • G03F7/012—Macromolecular azides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0381—Macromolecular compounds which are rendered insoluble or differentially wettable using a combination of a phenolic resin and a polyoxyethylene resin
NL7305260.A 1972-05-05 1973-04-16 Werkwijze voor de bereideing van lichtgevoelige kopieermaterialen. NL164140C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2119172A GB1375461A (xx) 1972-05-05 1972-05-05

Publications (3)

Publication Number Publication Date
NL7305260A NL7305260A (xx) 1973-11-07
NL164140B NL164140B (nl) 1980-06-16
NL164140C true NL164140C (nl) 1980-11-17

Family

ID=10158714

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7305260.A NL164140C (nl) 1972-05-05 1973-04-16 Werkwijze voor de bereideing van lichtgevoelige kopieermaterialen.

Country Status (8)

Country Link
US (1) US3869292A (xx)
JP (1) JPS5629261B2 (xx)
DE (1) DE2322230C2 (xx)
FR (1) FR2183748B1 (xx)
GB (1) GB1375461A (xx)
IT (1) IT985848B (xx)
NL (1) NL164140C (xx)
SE (1) SE403662B (xx)

Families Citing this family (97)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5236043B2 (xx) * 1974-02-21 1977-09-13
JPS5241050B2 (xx) * 1974-03-27 1977-10-15
JPS51120712A (en) * 1975-04-15 1976-10-22 Toshiba Corp Positive type photo-resistant compound
JPS522519A (en) * 1975-06-24 1977-01-10 Toshiba Corp Positive photosensitive composite material
US4009033A (en) * 1975-09-22 1977-02-22 International Business Machines Corporation High speed positive photoresist composition
JPS549619A (en) * 1977-06-23 1979-01-24 Oji Paper Co Photosensitive composition
US4259434A (en) * 1977-10-24 1981-03-31 Fuji Photo Film Co., Ltd. Method for developing positive acting light-sensitive planographic printing plate
JPS5498614A (en) * 1978-01-09 1979-08-03 Konishiroku Photo Ind Co Ltd Photosensitive composition
DE2855393A1 (de) * 1978-12-21 1980-07-03 Hoechst Ag Verfahren zum herstellen von flachdruckformen
GB2052084B (en) * 1979-06-13 1983-04-20 Fuji Photo Film Co Ltd Process for preparing photosensitive lithographic printing plate precursor
JPS5672991A (en) * 1979-11-19 1981-06-17 Mita Ind Co Ltd Color former for coloring substance of leucoline and recording material made by use thereof
JPS56162744A (en) * 1980-05-19 1981-12-14 Hitachi Ltd Formation of fine pattern
JPS5730829A (en) * 1980-08-01 1982-02-19 Hitachi Ltd Micropattern formation method
JPS5852638A (ja) * 1981-09-24 1983-03-28 Hitachi Ltd 放射線感応性組成物
JPS5872139A (ja) * 1981-10-26 1983-04-30 Tokyo Ohka Kogyo Co Ltd 感光性材料
US4554237A (en) * 1981-12-25 1985-11-19 Hitach, Ltd. Photosensitive resin composition and method for forming fine patterns with said composition
US4439516A (en) * 1982-03-15 1984-03-27 Shipley Company Inc. High temperature positive diazo photoresist processing using polyvinyl phenol
JPS58203433A (ja) * 1982-05-21 1983-11-26 Fuji Photo Film Co Ltd 感光性組成物
JPS58205147A (ja) * 1982-05-25 1983-11-30 Sumitomo Chem Co Ltd ポジ型フオトレジスト組成物
DE3415033C2 (de) * 1983-04-20 1986-04-03 Hitachi Chemical Co., Ltd. 4'-Azidobenzal-2-methoxyacetophenon, Verfahren zu seiner Herstellung und dieses enthaltende photoempfindliche Masse
DE3417607A1 (de) * 1983-05-12 1984-11-15 Hitachi Chemical Co., Ltd. Verfahren zur herstellung feiner muster
EP0135900A3 (en) * 1983-09-16 1986-06-11 Olin Hunt Specialty Products, Inc. Aqueous developable negative resist compositions
US4551409A (en) * 1983-11-07 1985-11-05 Shipley Company Inc. Photoresist composition of cocondensed naphthol and phenol with formaldehyde in admixture with positive o-quinone diazide or negative azide
US4569897A (en) * 1984-01-16 1986-02-11 Rohm And Haas Company Negative photoresist compositions with polyglutarimide polymer
US4631249A (en) * 1984-01-16 1986-12-23 Rohm & Haas Company Process for forming thermally stable negative images on surfaces utilizing polyglutarimide polymer in photoresist composition
DE3406927A1 (de) * 1984-02-25 1985-08-29 Hoechst Ag, 6230 Frankfurt Strahlungsempfindliches gemisch auf basis von saeurespaltbaren verbindungen
JPS60220931A (ja) * 1984-03-06 1985-11-05 Tokyo Ohka Kogyo Co Ltd 感光性樹脂用下地材料
IE57143B1 (en) * 1984-06-01 1992-05-06 Rohm & Haas Photosensitive coating compositions,thermally stable coating prepared from them,and the use of such coatings in forming thermally stable polymer images
DE3421448A1 (de) * 1984-06-08 1985-12-12 Hoechst Ag, 6230 Frankfurt Perfluoralkylgruppen aufweisende polymere, sie enthaltende reproduktionsschichten und deren verwendung fuer den wasserlosen offsetdruck
JPS6161154A (ja) * 1984-09-03 1986-03-28 Oki Electric Ind Co Ltd 微細ネガレジストパターン形成方法
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US4600683A (en) * 1985-04-22 1986-07-15 International Business Machines Corp. Cross-linked polyalkenyl phenol based photoresist compositions
JPH0766184B2 (ja) * 1985-06-04 1995-07-19 住友化学工業株式会社 ポジ型フオトレジスト組成物
US5215857A (en) * 1985-08-07 1993-06-01 Japan Synthetic Rubber Co., Ltd. 1,2-quinonediazide containing radiation-sensitive resin composition utilizing methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate or methyl 3-methoxypropionate as the solvent
US5238774A (en) * 1985-08-07 1993-08-24 Japan Synthetic Rubber Co., Ltd. Radiation-sensitive composition containing 1,2-quinonediazide compound, alkali-soluble resin and monooxymonocarboxylic acid ester solvent
JPS62123444A (ja) 1985-08-07 1987-06-04 Japan Synthetic Rubber Co Ltd ポジ型感放射線性樹脂組成物
EP0212482B1 (de) * 1985-08-12 1989-04-19 Hoechst Celanese Corporation Verfahren zur Herstellung negativer Bilder aus einem positiv arbeitenden Photoresist
US5256522A (en) * 1985-08-12 1993-10-26 Hoechst Celanese Corporation Image reversal negative working O-naphthoquinone diazide and cross-linking compound containing photoresist process with thermal curing
US5217840A (en) * 1985-08-12 1993-06-08 Hoechst Celanese Corporation Image reversal negative working o-quinone diazide and cross-linking compound containing photoresist process with thermal curing treatment and element produced therefrom
US4931381A (en) * 1985-08-12 1990-06-05 Hoechst Celanese Corporation Image reversal negative working O-quinone diazide and cross-linking compound containing photoresist process with thermal curing treatment
DE3528930A1 (de) * 1985-08-13 1987-02-26 Hoechst Ag Polymere verbindungen und diese enthaltendes strahlungsempfindliches gemisch
DE3528929A1 (de) * 1985-08-13 1987-02-26 Hoechst Ag Strahlungsempfindliches gemisch, dieses enthaltendes strahlungsempfindliches aufzeichnungsmaterial und verfahren zur herstellung von reliefbildern
US4758497A (en) * 1985-08-22 1988-07-19 Polychrome Corporation Photosensitive naphthoquinone diazide sulfonyl ester compounds for the fabrication of lithographic plates and photosensitive sheet construction with the compounds
US4806458A (en) * 1985-10-28 1989-02-21 Hoechst Celanese Corporation Composition containing a mixture of hexa-alkyl disilazane and propylene glycol alkyl ether and/or propylene glycol alkyl ether acetate
US5039594A (en) * 1985-10-28 1991-08-13 Hoechst Celanese Corporation Positive photoresist containing a mixture of propylene glycol alkyl ethers and propylene glycol alkyl ether acetate
US4948697A (en) * 1985-10-28 1990-08-14 Hoechst Celanese Corporation Positive photoresist with a solvent mixture of propylene glycol alkyl ether and propylene glycol alkyl ether acetate
US4983490A (en) * 1985-10-28 1991-01-08 Hoechst Celanese Corporation Photoresist treating composition consisting of a mixture of propylene glycol alkyl ether and propylene glycol alkyl ether acetate
US4692398A (en) * 1985-10-28 1987-09-08 American Hoechst Corporation Process of using photoresist treating composition containing a mixture of a hexa-alkyl disilazane, propylene glycol alkyl ether and propylene glycol alkyl ether acetate
JPS62102241A (ja) * 1985-10-30 1987-05-12 Tokyo Ohka Kogyo Co Ltd 感光性組成物
US4942108A (en) * 1985-12-05 1990-07-17 International Business Machines Corporation Process of making diazoquinone sensitized polyamic acid based photoresist compositions having reduced dissolution rates in alkaline developers
DE3683464D1 (de) * 1985-12-05 1992-02-27 Ibm Photoresistzusammensetzungen mit vermindertem loesungsgrad in basischen entwicklern, auf basis von durch diazochinon sensibilisierter polyamidsaeure.
US4980264A (en) * 1985-12-17 1990-12-25 International Business Machines Corporation Photoresist compositions of controlled dissolution rate in alkaline developers
US4822716A (en) * 1985-12-27 1989-04-18 Kabushiki Kaisha Toshiba Polysilanes, Polysiloxanes and silicone resist materials containing these compounds
US4720445A (en) * 1986-02-18 1988-01-19 Allied Corporation Copolymers from maleimide and aliphatic vinyl ethers and esters used in positive photoresist
JPS62227143A (ja) * 1986-03-28 1987-10-06 Toshiba Corp 感光性組成物
JPH07113773B2 (ja) * 1986-07-04 1995-12-06 株式会社日立製作所 パタ−ン形成方法
US5300380A (en) * 1986-08-06 1994-04-05 Ciba-Geigy Corporation Process for the production of relief structures using a negative photoresist based on polyphenols and epoxy compounds or vinyl ethers
EP0255989B1 (de) * 1986-08-06 1990-11-22 Ciba-Geigy Ag Negativ-Photoresist auf Basis von Polyphenolen und Epoxidverbindungen oder Vinylethern
US4788127A (en) * 1986-11-17 1988-11-29 Eastman Kodak Company Photoresist composition comprising an interpolymer of a silicon-containing monomer and an hydroxystyrene
US5128230A (en) * 1986-12-23 1992-07-07 Shipley Company Inc. Quinone diazide containing photoresist composition utilizing mixed solvent of ethyl lactate, anisole and amyl acetate
JPH07117747B2 (ja) * 1987-04-21 1995-12-18 富士写真フイルム株式会社 感光性組成物
JPS63265242A (ja) * 1987-04-23 1988-11-01 Fuji Photo Film Co Ltd 多色画像形成方法
JPS6435436A (en) * 1987-07-30 1989-02-06 Mitsubishi Chem Ind Photosensitive planographic printing plate
DE3729035A1 (de) * 1987-08-31 1989-03-09 Hoechst Ag Positiv arbeitendes lichtempfindliches gemisch und daraus hergestelltes photolithographisches aufzeichnungsmaterial
US4927956A (en) * 1987-09-16 1990-05-22 Hoechst Celanese Corporation 3,5-disubstituted-4-acetoxystyrene and process for its production
JP2693472B2 (ja) * 1987-11-26 1997-12-24 株式会社東芝 レジスト
DE3800617A1 (de) * 1988-01-12 1989-07-20 Hoechst Ag Elektrophotographisches aufzeichnungsmaterial
US4824758A (en) * 1988-01-25 1989-04-25 Hoechst Celanese Corp Photoresist compositions based on acetoxystyrene copolymers
DE3812326A1 (de) * 1988-04-14 1989-10-26 Basf Ag Positiv arbeitendes, strahlungsempfindliches gemisch auf basis von saeurespaltbaren und photochemisch saeurebildenden verbindungen und verfahren zur herstellung von reliefmustern und reliefbildern
DE3820699A1 (de) * 1988-06-18 1989-12-21 Hoechst Ag Strahlungsempfindliches gemisch und hieraus hergestelltes strahlungsempfindliches aufzeichnungsmaterial
US5342727A (en) * 1988-10-21 1994-08-30 Hoechst Celanese Corp. Copolymers of 4-hydroxystyrene and alkyl substituted-4-hydroxystyrene in admixture with a photosensitizer to form a photosensitive composition
DE3837499A1 (de) * 1988-11-04 1990-05-23 Hoechst Ag Verfahren zur herstellung von substituierten 1,2-naphthochinon-(2)-diazid-4-sulfonsaeureestern und deren verwendung in einem strahlungsempfindlichen gemisch
DE3837500A1 (de) * 1988-11-04 1990-05-23 Hoechst Ag Neue, strahlungsempfindliche verbindungen, hiermit hergestelltes strahlungsempfindliches gemisch und aufzeichnungsmaterial
US5128232A (en) * 1989-05-22 1992-07-07 Shiply Company Inc. Photoresist composition with copolymer binder having a major proportion of phenolic units and a minor proportion of non-aromatic cyclic alcoholic units
DE3940911A1 (de) * 1989-12-12 1991-06-13 Hoechst Ag Verfahren zur herstellung negativer kopien
DE4002397A1 (de) * 1990-01-27 1991-08-01 Hoechst Ag Strahlungsempfindliches gemisch und hieraus hergestelltes strahlungsempfindliches aufzeichnungsmaterial
DE4003025A1 (de) * 1990-02-02 1991-08-08 Hoechst Ag Strahlungsempfindliches gemisch, hiermit hergestelltes strahlungsempfindliches aufzeichnungsmaterial und verfahren zur herstellung von reliefaufzeichnungen
DE4004719A1 (de) * 1990-02-15 1991-08-22 Hoechst Ag Strahlungsempfindliches gemisch, hiermit hergestelltes strahlungsempfindliches aufzeichnungsmaterial und verfahren zur herstellung von reliefaufzeichnungen
US5210137A (en) * 1990-11-19 1993-05-11 Shell Oil Company Polyketone polymer blends
EP0501919A1 (de) * 1991-03-01 1992-09-02 Ciba-Geigy Ag Strahlungsempfindliche Zusammensetzungen auf der Basis von Polyphenolen und Acetalen
US5200460A (en) * 1991-04-30 1993-04-06 Shell Oil Company Polyacetal polymer blends
US5550004A (en) * 1992-05-06 1996-08-27 Ocg Microelectronic Materials, Inc. Chemically amplified radiation-sensitive composition
US5340687A (en) * 1992-05-06 1994-08-23 Ocg Microelectronic Materials, Inc. Chemically modified hydroxy styrene polymer resins and their use in photoactive resist compositions wherein the modifying agent is monomethylol phenol
KR950004908B1 (ko) * 1992-09-09 1995-05-15 삼성전자주식회사 포토 레지스트 조성물 및 이를 이용한 패턴형성방법
DE19507618A1 (de) * 1995-03-04 1996-09-05 Hoechst Ag Polymere und diese enthaltendes lichtempfindliches Gemisch
US5853947A (en) * 1995-12-21 1998-12-29 Clariant Finance (Bvi) Limited Quinonediazide positive photoresist utilizing mixed solvent consisting essentially of 3-methyl-3-methoxy butanol and propylene glycol alkyl ether acetate
US5719004A (en) * 1996-08-07 1998-02-17 Clariant Finance (Bvi) Limited Positive photoresist composition containing a 2,4-dinitro-1-naphthol
US5763135A (en) * 1996-09-30 1998-06-09 Clariant Finance (Bvi) Limited Light sensitive composition containing an arylhydrazo dye
US6103443A (en) * 1997-11-21 2000-08-15 Clariant Finance Lmited Photoresist composition containing a novel polymer
DE19803564A1 (de) 1998-01-30 1999-08-05 Agfa Gevaert Ag Polymere mit Einheiten aus N-substituiertem Maleimid und deren Verwendung in strahlungsempfindlichen Gemischen
US6783914B1 (en) 2000-02-25 2004-08-31 Massachusetts Institute Of Technology Encapsulated inorganic resists
US6936398B2 (en) 2001-05-09 2005-08-30 Massachusetts Institute Of Technology Resist with reduced line edge roughness
JP2014510626A (ja) 2011-03-10 2014-05-01 スリーエム イノベイティブ プロパティズ カンパニー 濾材
US8703385B2 (en) 2012-02-10 2014-04-22 3M Innovative Properties Company Photoresist composition
US8715904B2 (en) 2012-04-27 2014-05-06 3M Innovative Properties Company Photocurable composition
US8883402B2 (en) 2012-08-09 2014-11-11 3M Innovative Properties Company Photocurable compositions
CN104737075A (zh) 2012-08-09 2015-06-24 3M创新有限公司 可光致固化的组合物

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US3230087A (en) * 1959-02-26 1966-01-18 Azoplate Corp Light-sensitive polymeric diazonium and azidoacrylamido reproduction materials and process for making plates therefrom
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US3396020A (en) * 1965-11-16 1968-08-06 Azoplate Corp Planographic printing plate
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US3625919A (en) * 1967-02-10 1971-12-07 Hiroyoshi Kamogawa Process for the preparation of diazotized vinylphenol polymers having phototropic properties
US3589898A (en) * 1968-10-08 1971-06-29 Polychrome Corp Litho plate
DE1817107C3 (de) * 1968-12-27 1980-09-11 Hoechst Ag, 6000 Frankfurt Vorsensibilisierte MehrmetaU-Offsetdruckplatte
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US3669658A (en) * 1969-06-11 1972-06-13 Fuji Photo Film Co Ltd Photosensitive printing plate
US3647443A (en) * 1969-09-12 1972-03-07 Eastman Kodak Co Light-sensitive quinone diazide polymers and polymer compositions
JPS508658B1 (xx) * 1970-06-19 1975-04-05
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US3778270A (en) * 1970-11-12 1973-12-11 Du Pont Photosensitive bis-diazonium salt compositions and elements

Also Published As

Publication number Publication date
NL7305260A (xx) 1973-11-07
US3869292A (en) 1975-03-04
JPS5629261B2 (xx) 1981-07-07
GB1375461A (xx) 1974-11-27
JPS4948403A (xx) 1974-05-10
SE403662B (sv) 1978-08-28
IT985848B (it) 1974-12-20
NL164140B (nl) 1980-06-16
FR2183748B1 (xx) 1977-02-11
FR2183748A1 (xx) 1973-12-21
DE2322230A1 (de) 1973-11-22
DE2322230C2 (de) 1984-01-12

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Legal Events

Date Code Title Description
BC A request for examination has been filed
SNR Assignments of patents or rights arising from examined patent applications

Owner name: SHIPLEY COMPANY INCORPORATED

V1 Lapsed because of non-payment of the annual fee