Classifications

• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
  • H03F1/08—Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements
  • H03F1/14—Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of neutralising means
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D99/00—Subject matter not provided for in other groups of this subclass
• • H10P95/00—
• • H10W20/40—
• • H10W72/90—
• • H10W74/43—
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
  • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
  • H01L2224/45001—Core members of the connector
  • H01L2224/4501—Shape
  • H01L2224/45012—Cross-sectional shape
  • H01L2224/45015—Cross-sectional shape being circular
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
  • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
  • H01L2224/45001—Core members of the connector
  • H01L2224/45099—Material
  • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
  • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
  • H01L2224/45144—Gold (Au) as principal constituent
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/20—Parameters
  • H01L2924/207—Diameter ranges
  • H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/30—Technical effects
  • H01L2924/301—Electrical effects
  • H01L2924/30105—Capacitance
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/30—Technical effects
  • H01L2924/301—Electrical effects
  • H01L2924/3025—Electromagnetic shielding
• • H10W72/5363—
• • H10W72/5522—
• • H10W72/59—
• • H10W72/923—
• • H10W72/934—
• • H10W72/952—

Landscapes

• Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Bipolar Transistors (AREA)
• Electrodes Of Semiconductors (AREA)
• Semiconductor Integrated Circuits (AREA)
• Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
• Wire Bonding (AREA)
• Bipolar Integrated Circuits (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=26643768

Family Applications (1)

Country Status (9)

Families Citing this family (25)

Family Cites Families (3)

• 0
  • NL NL134388D patent/NL134388C/xx active
• 1965
  • 1965-05-12 JP JP40027552A patent/JPS4820951B1/ja active Pending
  • 1965-05-12 DK DK240965AA patent/DK117084B/da unknown
  • 1965-05-12 SE SE6211/65A patent/SE320128B/xx unknown
  • 1965-05-12 GB GB20051/65A patent/GB1111663A/en not_active Expired
  • 1965-05-12 CH CH662865A patent/CH432661A/de unknown
  • 1965-05-12 DE DE19651514254 patent/DE1514254B2/de active Pending
  • 1965-05-13 BE BE663896A patent/BE663896A/xx unknown
  • 1965-09-17 BE BE669821A patent/BE669821A/xx unknown
• 1966
  • 1966-08-17 US US572938A patent/US3373323A/en not_active Expired - Lifetime

Also Published As

Similar Documents