NL133498C - - Google Patents
Info
- Publication number
- NL133498C NL133498C NL133498DA NL133498C NL 133498 C NL133498 C NL 133498C NL 133498D A NL133498D A NL 133498DA NL 133498 C NL133498 C NL 133498C
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/12—Etching of semiconducting materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES58641A DE1248169B (de) | 1958-06-18 | 1958-06-18 | Verfahren zur Oberflaechenbehandlung von Halbleiterbauelementen mit einem stroemenden AEtzmittel |
Publications (1)
Publication Number | Publication Date |
---|---|
NL133498C true NL133498C (fr) |
Family
ID=7492689
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL133498D NL133498C (fr) | 1958-06-18 | ||
NL239732D NL239732A (fr) | 1958-06-18 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL239732D NL239732A (fr) | 1958-06-18 |
Country Status (7)
Country | Link |
---|---|
US (1) | US3041225A (fr) |
BE (1) | BE579805A (fr) |
CH (1) | CH371522A (fr) |
DE (1) | DE1248169B (fr) |
FR (1) | FR1227736A (fr) |
GB (1) | GB911676A (fr) |
NL (2) | NL239732A (fr) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3234058A (en) * | 1962-06-27 | 1966-02-08 | Ibm | Method of forming an integral masking fixture by epitaxial growth |
US3489608A (en) * | 1965-10-26 | 1970-01-13 | Kulicke & Soffa Ind Inc | Method and apparatus for treating semiconductor wafers |
US4027686A (en) * | 1973-01-02 | 1977-06-07 | Texas Instruments Incorporated | Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water |
US3950184A (en) * | 1974-11-18 | 1976-04-13 | Texas Instruments Incorporated | Multichannel drainage system |
US4161356A (en) * | 1977-01-21 | 1979-07-17 | Burchard John S | Apparatus for in-situ processing of photoplates |
JPS5927229B2 (ja) * | 1979-09-19 | 1984-07-04 | 富士通株式会社 | スピンナ− |
DE3027934A1 (de) * | 1980-07-23 | 1982-02-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur einseitigen aetzung von halbleiterscheiben |
DE3114309C2 (de) * | 1981-04-09 | 1986-01-02 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum Herstellen von Infrarot-Detektorelementen |
NL8403459A (nl) * | 1984-11-13 | 1986-06-02 | Philips Nv | Werkwijze en inrichting voor het aanbrengen van een laag van fotogevoelig materiaal op een halfgeleiderschijf. |
JPS6314434A (ja) * | 1986-07-04 | 1988-01-21 | Dainippon Screen Mfg Co Ltd | 基板表面処理方法および装置 |
US5185056A (en) * | 1991-09-13 | 1993-02-09 | International Business Machines Corporation | Method and apparatus for etching semiconductor wafers and developing resists |
US5779816A (en) * | 1997-01-30 | 1998-07-14 | Trinh; Tieu T. | Nozzle and system for use in wafer cleaning procedures |
JP2003173999A (ja) * | 2001-12-07 | 2003-06-20 | Mitsubishi Electric Corp | 半導体基板洗浄装置、半導体基板洗浄方法および半導体装置の製造方法 |
JP6869101B2 (ja) * | 2017-05-12 | 2021-05-12 | 株式会社ダイセル | 接着剤層形成装置、半導体チップ製造ライン、及び積層体の製造方法 |
CN116240547B (zh) * | 2022-12-25 | 2024-03-12 | 湖北兴福电子材料股份有限公司 | 一种铜蚀刻液及其制备方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2124052A (en) * | 1935-07-12 | 1938-07-19 | John L Clough | Method and apparatus for washing dishes |
US2178701A (en) * | 1936-05-28 | 1939-11-07 | Ralph D Petre | Method for applying fluids to and cleaning articles |
US2523018A (en) * | 1946-12-12 | 1950-09-19 | Paper Patents Co | Method of cylinder etching and machine therefor |
NL80773C (fr) * | 1948-12-29 | 1900-01-01 | ||
NL88607C (fr) * | 1948-12-29 | |||
US2699793A (en) * | 1949-10-04 | 1955-01-18 | Buck | Centrifugal cleaner for air filters |
US2758037A (en) * | 1953-06-17 | 1956-08-07 | Cahill William Starling | Apparatus for and a method of applying an adhesive coating to rubber tires |
BE535909A (fr) * | 1954-02-23 | |||
US2705192A (en) * | 1954-06-04 | 1955-03-29 | Westinghouse Electric Corp | Etching solutions and process for etching members therewith |
US2767137A (en) * | 1954-07-15 | 1956-10-16 | Philco Corp | Method for electrolytic etching |
US2869266A (en) * | 1954-10-04 | 1959-01-20 | Turco Products Inc | Method for removing metal from the surface of a metal object |
US2827723A (en) * | 1954-11-26 | 1958-03-25 | Turco Products Inc | Apparatus for removing metal from the surface of a metal object |
US2799637A (en) * | 1954-12-22 | 1957-07-16 | Philco Corp | Method for electrolytic etching |
US2746848A (en) * | 1955-01-19 | 1956-05-22 | Photo Engravers Res Inc | Etching |
NL104994C (fr) * | 1955-06-23 | |||
US2908247A (en) * | 1956-04-03 | 1959-10-13 | Gordy Air Less Spray Company | Liquid spraying apparatus |
US2950990A (en) * | 1957-04-08 | 1960-08-30 | Ibm | Method for applying a uniform coating to a cylindrical body |
-
0
- NL NL133498D patent/NL133498C/xx active
- NL NL239732D patent/NL239732A/xx unknown
-
1958
- 1958-06-18 DE DES58641A patent/DE1248169B/de active Pending
-
1959
- 1959-06-05 GB GB19325/59A patent/GB911676A/en not_active Expired
- 1959-06-11 CH CH7430659A patent/CH371522A/de unknown
- 1959-06-15 US US820533A patent/US3041225A/en not_active Expired - Lifetime
- 1959-06-17 FR FR797783A patent/FR1227736A/fr not_active Expired
- 1959-06-18 BE BE579805A patent/BE579805A/fr unknown
Also Published As
Publication number | Publication date |
---|---|
GB911676A (en) | 1962-11-28 |
CH371522A (de) | 1963-08-31 |
FR1227736A (fr) | 1960-08-24 |
US3041225A (en) | 1962-06-26 |
NL239732A (fr) | |
DE1248169B (de) | 1967-08-24 |
BE579805A (fr) | 1959-12-18 |