NL113327C - - Google Patents

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Publication number
NL113327C
NL113327C NL113327DA NL113327C NL 113327 C NL113327 C NL 113327C NL 113327D A NL113327D A NL 113327DA NL 113327 C NL113327 C NL 113327C
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Netherlands
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Publication of NL113327C publication Critical patent/NL113327C/xx

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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S228/00—Metal fusion bonding
    • Y10S228/903—Metal to nonmetal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/00—Metal working
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    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
NL113327D 1956-10-31 NL113327C (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US619639A US3006067A (en) 1956-10-31 1956-10-31 Thermo-compression bonding of metal to semiconductors, and the like

Publications (1)

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NL113327C true NL113327C (da) 1900-01-01

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NL219101D NL219101A (da) 1956-10-31
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US (1) US3006067A (da)
BE (1) BE559732A (da)
CH (1) CH351342A (da)
DE (1) DE1127000C2 (da)
FR (1) FR1179416A (da)
GB (2) GB881834A (da)
NL (2) NL113327C (da)

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NL281360A (da) * 1961-07-26 1900-01-01
BE621898A (da) * 1961-08-30 1900-01-01
NL283249A (da) * 1961-09-19 1900-01-01
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NL292051A (da) * 1962-04-27
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GB1106163A (en) * 1964-03-02 1968-03-13 Post Office Improvements in or relating to the bonding of metals to semiconductor, metallic or non-metallic surfaces
DE1282190B (de) * 1964-03-12 1968-11-07 Kabusihiki Kaisha Hitachi Seis Verfahren zum Herstellen von Transistoren
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US3373481A (en) * 1965-06-22 1968-03-19 Sperry Rand Corp Method of electrically interconnecting conductors
US3442003A (en) * 1965-07-26 1969-05-06 Teledyne Inc Method for interconnecting thin films
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US3523222A (en) * 1966-09-15 1970-08-04 Texas Instruments Inc Semiconductive contacts
US3465421A (en) * 1966-12-20 1969-09-09 American Standard Inc High temperature bonding to germanium
US3442007A (en) * 1966-12-29 1969-05-06 Kewanee Oil Co Process of attaching a collector grid to a photovoltaic cell
US3483610A (en) * 1967-06-08 1969-12-16 Bell Telephone Labor Inc Thermocompression bonding of foil leads
GB1256518A (da) * 1968-11-30 1971-12-08
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NL219101A (da) 1900-01-01
GB881834A (en) 1961-11-08
US3006067A (en) 1961-10-31
CH351342A (fr) 1961-01-15
DE1127000C2 (de) 1974-04-11
BE559732A (da) 1900-01-01
GB881832A (en) 1961-11-08
DE1127000B (da) 1974-04-11
FR1179416A (fr) 1959-05-25

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