NL1015044C2 - Werkwijze voor het aanbrengen van perforaties in een substraat alsmede inrichting voor het uitvoeren van de werkwijze. - Google Patents

Werkwijze voor het aanbrengen van perforaties in een substraat alsmede inrichting voor het uitvoeren van de werkwijze. Download PDF

Info

Publication number
NL1015044C2
NL1015044C2 NL1015044A NL1015044A NL1015044C2 NL 1015044 C2 NL1015044 C2 NL 1015044C2 NL 1015044 A NL1015044 A NL 1015044A NL 1015044 A NL1015044 A NL 1015044A NL 1015044 C2 NL1015044 C2 NL 1015044C2
Authority
NL
Netherlands
Prior art keywords
substrate
perforations
plasmatron
pattern
areas
Prior art date
Application number
NL1015044A
Other languages
English (en)
Dutch (nl)
Inventor
Karst Jan Van Weperen
Stefan Jozef Siegfried R Ckl
Markus Helmut Bohrer
Original Assignee
Stork Screens Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stork Screens Bv filed Critical Stork Screens Bv
Priority to NL1015044A priority Critical patent/NL1015044C2/nl
Priority to EP01924002A priority patent/EP1276585A1/fr
Priority to PCT/NL2001/000315 priority patent/WO2001083149A1/fr
Priority to US10/258,837 priority patent/US20040020903A1/en
Priority to AU2001250674A priority patent/AU2001250674A1/en
Application granted granted Critical
Publication of NL1015044C2 publication Critical patent/NL1015044C2/nl

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K10/00Welding or cutting by means of a plasma
    • B23K10/003Scarfing, desurfacing or deburring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
NL1015044A 2000-04-28 2000-04-28 Werkwijze voor het aanbrengen van perforaties in een substraat alsmede inrichting voor het uitvoeren van de werkwijze. NL1015044C2 (nl)

Priority Applications (5)

Application Number Priority Date Filing Date Title
NL1015044A NL1015044C2 (nl) 2000-04-28 2000-04-28 Werkwijze voor het aanbrengen van perforaties in een substraat alsmede inrichting voor het uitvoeren van de werkwijze.
EP01924002A EP1276585A1 (fr) 2000-04-28 2001-04-20 Procede pour former des perforations dans un substrat et dispositif de realisation de ce procede
PCT/NL2001/000315 WO2001083149A1 (fr) 2000-04-28 2001-04-20 Procede pour former des perforations dans un substrat et dispositif de realisation de ce procede
US10/258,837 US20040020903A1 (en) 2000-04-28 2001-04-20 Method for forming of perforations in a substrate and device for carrying out said method
AU2001250674A AU2001250674A1 (en) 2000-04-28 2001-04-20 Method for forming of perforations in a substrate and device for carrying out said method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1015044 2000-04-28
NL1015044A NL1015044C2 (nl) 2000-04-28 2000-04-28 Werkwijze voor het aanbrengen van perforaties in een substraat alsmede inrichting voor het uitvoeren van de werkwijze.

Publications (1)

Publication Number Publication Date
NL1015044C2 true NL1015044C2 (nl) 2001-10-30

Family

ID=19771277

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1015044A NL1015044C2 (nl) 2000-04-28 2000-04-28 Werkwijze voor het aanbrengen van perforaties in een substraat alsmede inrichting voor het uitvoeren van de werkwijze.

Country Status (5)

Country Link
US (1) US20040020903A1 (fr)
EP (1) EP1276585A1 (fr)
AU (1) AU2001250674A1 (fr)
NL (1) NL1015044C2 (fr)
WO (1) WO2001083149A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7668069B2 (en) * 2005-05-09 2010-02-23 Searete Llc Limited use memory device with associated information
AT514283B1 (de) * 2013-04-19 2015-09-15 Tannpapier Gmbh Plasmaperforation

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4767903A (en) * 1984-12-31 1988-08-30 Ag Fur Industrielle Elektronik Agie Process and apparatus for determining the electroerosive completion of a starting hole
US4818834A (en) * 1988-03-21 1989-04-04 Raycon Corporation Process for drilling chamfered holes
DE19522642A1 (de) * 1995-06-22 1997-01-02 Air Liquide Gmbh Verfahren und Vorrichtung zum Flammrichten metallischer Bauteile

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3668028A (en) * 1970-06-10 1972-06-06 Du Pont Method of making printing masks with high energy beams
US4495399A (en) * 1981-03-26 1985-01-22 Cann Gordon L Micro-arc milling of metallic and non-metallic substrates
US4778155A (en) * 1987-07-23 1988-10-18 Allegheny Ludlum Corporation Plasma arc hole cutter
US5981899A (en) * 1997-01-17 1999-11-09 Balzers Aktiengesellschaft Capacitively coupled RF-plasma reactor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4767903A (en) * 1984-12-31 1988-08-30 Ag Fur Industrielle Elektronik Agie Process and apparatus for determining the electroerosive completion of a starting hole
US4818834A (en) * 1988-03-21 1989-04-04 Raycon Corporation Process for drilling chamfered holes
DE19522642A1 (de) * 1995-06-22 1997-01-02 Air Liquide Gmbh Verfahren und Vorrichtung zum Flammrichten metallischer Bauteile

Also Published As

Publication number Publication date
EP1276585A1 (fr) 2003-01-22
AU2001250674A1 (en) 2001-11-12
WO2001083149A1 (fr) 2001-11-08
US20040020903A1 (en) 2004-02-05

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Effective date: 20041101