MY9904042A - Plating method of hard disk substrate - Google Patents
Plating method of hard disk substrateInfo
- Publication number
- MY9904042A MY9904042A MYPI9904042A MY9904042A MY 9904042 A MY9904042 A MY 9904042A MY PI9904042 A MYPI9904042 A MY PI9904042A MY 9904042 A MY9904042 A MY 9904042A
- Authority
- MY
- Malaysia
- Prior art keywords
- substrate
- hard disk
- nickel plating
- electroless nickel
- disk substrate
- Prior art date
Links
Landscapes
- Chemically Coating (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
DISCLOSED IS A METHOD OF ELECTROLESS NICKEL PLATING OF A GLASS OR CERAMIC MADE HARD DISK SUBSTRATE. THE METHOD INCLUDES THE STEPS OF : CONDITIONING THE SURFACE OF THE SUBSTRATE; DIPPING THE SUBSTRATE INA CATALYST SOLUTION MAINLY CONTAINING A WATER-SOLUBLE PALLADIUM SALT AND AN AMINE TYPE COMPLEXING AGENT, BUT NOT CONTAINING ANY TIN SALT; RINSING AND DRYING THE SUBSTRATE; AND EFFECTING THE SUBSTRATE TO ELECTROLESS NICKEL PLATING BY DIPPING THE SUBSTRATE IN AN ELECTROLESS NICKEL PLATING SOLUTION. THIS METHOD ALLOWS FORMATION OF AN ELECTROLESS NICKEL PLATING FILM, WHICH IS EXCELLENT IN ADHESIVENESS, ON A GLASS OR CERAMIC MADE HARD DISK SUBSTRATE WITHOUT OCCURENCE OF DEFECTS SUCH AS PITS.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10263829A JP2000096252A (en) | 1998-09-18 | 1998-09-18 | Method for plating to hard disk substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
MY9904042A true MY9904042A (en) | 2007-06-29 |
Family
ID=17394811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI9904042 MY9904042A (en) | 1998-09-18 | 1999-09-17 | Plating method of hard disk substrate |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2000096252A (en) |
MY (1) | MY9904042A (en) |
SG (1) | SG84536A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4600623B2 (en) * | 2001-02-16 | 2010-12-15 | 上村工業株式会社 | Method for forming electroless zinc oxide film |
JP2003064479A (en) * | 2001-08-22 | 2003-03-05 | Sony Corp | Pre-treatment of electroless plating |
JP5327494B2 (en) * | 2005-11-16 | 2013-10-30 | 日立化成株式会社 | Method for producing catalyst concentrate for electroless plating and method for applying plating catalyst using the same |
JP4975344B2 (en) * | 2006-03-15 | 2012-07-11 | 大和電機工業株式会社 | Plating method |
JP5288362B2 (en) * | 2007-01-17 | 2013-09-11 | 奥野製薬工業株式会社 | Multilayer plating film and printed wiring board |
JP2008255460A (en) * | 2007-04-09 | 2008-10-23 | Rohm & Haas Electronic Materials Llc | Electroless plating treatment method of polyimide resin |
JP5481700B2 (en) * | 2008-09-03 | 2014-04-23 | 奥野製薬工業株式会社 | Activation solution for electroless plating |
FR2950062B1 (en) * | 2009-09-11 | 2012-08-03 | Alchimer | SOLUTION AND METHOD FOR ACTIVATING THE SURFACE OF A SEMICONDUCTOR SUBSTRATE |
FR2950633B1 (en) * | 2009-09-30 | 2011-11-25 | Alchimer | SOLUTION AND METHOD FOR ACTIVATION OF THE OXIDIZED SURFACE OF A SEMICONDUCTOR SUBSTRATE |
CN114108046A (en) * | 2021-12-20 | 2022-03-01 | 厦门华天华电子有限公司 | Method for eliminating pits on FPC (Flexible printed Circuit) coating surface |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3940512A (en) * | 1971-01-25 | 1976-02-24 | E. I. Du Pont De Nemours And Company | Method and apparatus for concomitant particulate deposition in electroless plating, and the product thereof |
US4180480A (en) * | 1975-10-15 | 1979-12-25 | Mcgean Chemical Company, Inc. | Catalytically active compositions from precious metal complexes |
US4259409A (en) * | 1980-03-06 | 1981-03-31 | Ses, Incorporated | Electroless plating process for glass or ceramic bodies and product |
DE3424065A1 (en) * | 1984-06-29 | 1986-01-09 | Bayer Ag, 5090 Leverkusen | METHOD FOR ACTIVATING SUBSTRATE SURFACES FOR ELECTRIC METALLIZATION |
US4581256A (en) * | 1984-11-19 | 1986-04-08 | Chemline Industries | Electroless plating composition and method of use |
US5405656A (en) * | 1990-04-02 | 1995-04-11 | Nippondenso Co., Ltd. | Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor |
DE69426732T3 (en) * | 1993-03-18 | 2010-11-25 | Atotech Deutschland Gmbh | Self-accelerating and self-refreshing process for dip coating without formaldehyde |
US5348574A (en) * | 1993-07-02 | 1994-09-20 | Monsanto Company | Metal-coated polyimide |
US5753304A (en) * | 1997-06-23 | 1998-05-19 | The Metal Arts Company, Inc. | Activation bath for electroless nickel plating |
-
1998
- 1998-09-18 JP JP10263829A patent/JP2000096252A/en active Pending
-
1999
- 1999-06-25 SG SG9903433A patent/SG84536A1/en unknown
- 1999-09-17 MY MYPI9904042 patent/MY9904042A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2000096252A (en) | 2000-04-04 |
SG84536A1 (en) | 2001-11-20 |
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