MY9904042A - Plating method of hard disk substrate - Google Patents

Plating method of hard disk substrate

Info

Publication number
MY9904042A
MY9904042A MYPI9904042A MY9904042A MY 9904042 A MY9904042 A MY 9904042A MY PI9904042 A MYPI9904042 A MY PI9904042A MY 9904042 A MY9904042 A MY 9904042A
Authority
MY
Malaysia
Prior art keywords
substrate
hard disk
nickel plating
electroless nickel
disk substrate
Prior art date
Application number
Inventor
Masahiro Saito
Ikuo Nakayama
Masanori Tada
Koichiro Shimizu
Original Assignee
Uyemura & Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uyemura & Co Ltd filed Critical Uyemura & Co Ltd
Publication of MY9904042A publication Critical patent/MY9904042A/en

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

DISCLOSED IS A METHOD OF ELECTROLESS NICKEL PLATING OF A GLASS OR CERAMIC MADE HARD DISK SUBSTRATE. THE METHOD INCLUDES THE STEPS OF : CONDITIONING THE SURFACE OF THE SUBSTRATE; DIPPING THE SUBSTRATE INA CATALYST SOLUTION MAINLY CONTAINING A WATER-SOLUBLE PALLADIUM SALT AND AN AMINE TYPE COMPLEXING AGENT, BUT NOT CONTAINING ANY TIN SALT; RINSING AND DRYING THE SUBSTRATE; AND EFFECTING THE SUBSTRATE TO ELECTROLESS NICKEL PLATING BY DIPPING THE SUBSTRATE IN AN ELECTROLESS NICKEL PLATING SOLUTION. THIS METHOD ALLOWS FORMATION OF AN ELECTROLESS NICKEL PLATING FILM, WHICH IS EXCELLENT IN ADHESIVENESS, ON A GLASS OR CERAMIC MADE HARD DISK SUBSTRATE WITHOUT OCCURENCE OF DEFECTS SUCH AS PITS.
MYPI9904042 1998-09-18 1999-09-17 Plating method of hard disk substrate MY9904042A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10263829A JP2000096252A (en) 1998-09-18 1998-09-18 Method for plating to hard disk substrate

Publications (1)

Publication Number Publication Date
MY9904042A true MY9904042A (en) 2007-06-29

Family

ID=17394811

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9904042 MY9904042A (en) 1998-09-18 1999-09-17 Plating method of hard disk substrate

Country Status (3)

Country Link
JP (1) JP2000096252A (en)
MY (1) MY9904042A (en)
SG (1) SG84536A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4600623B2 (en) * 2001-02-16 2010-12-15 上村工業株式会社 Method for forming electroless zinc oxide film
JP2003064479A (en) * 2001-08-22 2003-03-05 Sony Corp Pre-treatment of electroless plating
JP5327494B2 (en) * 2005-11-16 2013-10-30 日立化成株式会社 Method for producing catalyst concentrate for electroless plating and method for applying plating catalyst using the same
JP4975344B2 (en) * 2006-03-15 2012-07-11 大和電機工業株式会社 Plating method
JP5288362B2 (en) * 2007-01-17 2013-09-11 奥野製薬工業株式会社 Multilayer plating film and printed wiring board
JP2008255460A (en) * 2007-04-09 2008-10-23 Rohm & Haas Electronic Materials Llc Electroless plating treatment method of polyimide resin
JP5481700B2 (en) * 2008-09-03 2014-04-23 奥野製薬工業株式会社 Activation solution for electroless plating
FR2950062B1 (en) * 2009-09-11 2012-08-03 Alchimer SOLUTION AND METHOD FOR ACTIVATING THE SURFACE OF A SEMICONDUCTOR SUBSTRATE
FR2950633B1 (en) * 2009-09-30 2011-11-25 Alchimer SOLUTION AND METHOD FOR ACTIVATION OF THE OXIDIZED SURFACE OF A SEMICONDUCTOR SUBSTRATE
CN114108046A (en) * 2021-12-20 2022-03-01 厦门华天华电子有限公司 Method for eliminating pits on FPC (Flexible printed Circuit) coating surface

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3940512A (en) * 1971-01-25 1976-02-24 E. I. Du Pont De Nemours And Company Method and apparatus for concomitant particulate deposition in electroless plating, and the product thereof
US4180480A (en) * 1975-10-15 1979-12-25 Mcgean Chemical Company, Inc. Catalytically active compositions from precious metal complexes
US4259409A (en) * 1980-03-06 1981-03-31 Ses, Incorporated Electroless plating process for glass or ceramic bodies and product
DE3424065A1 (en) * 1984-06-29 1986-01-09 Bayer Ag, 5090 Leverkusen METHOD FOR ACTIVATING SUBSTRATE SURFACES FOR ELECTRIC METALLIZATION
US4581256A (en) * 1984-11-19 1986-04-08 Chemline Industries Electroless plating composition and method of use
US5405656A (en) * 1990-04-02 1995-04-11 Nippondenso Co., Ltd. Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor
DE69426732T3 (en) * 1993-03-18 2010-11-25 Atotech Deutschland Gmbh Self-accelerating and self-refreshing process for dip coating without formaldehyde
US5348574A (en) * 1993-07-02 1994-09-20 Monsanto Company Metal-coated polyimide
US5753304A (en) * 1997-06-23 1998-05-19 The Metal Arts Company, Inc. Activation bath for electroless nickel plating

Also Published As

Publication number Publication date
JP2000096252A (en) 2000-04-04
SG84536A1 (en) 2001-11-20

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