CN114108046A - Method for eliminating pits on FPC (Flexible printed Circuit) coating surface - Google Patents
Method for eliminating pits on FPC (Flexible printed Circuit) coating surface Download PDFInfo
- Publication number
- CN114108046A CN114108046A CN202111561567.2A CN202111561567A CN114108046A CN 114108046 A CN114108046 A CN 114108046A CN 202111561567 A CN202111561567 A CN 202111561567A CN 114108046 A CN114108046 A CN 114108046A
- Authority
- CN
- China
- Prior art keywords
- fpc
- washing
- plating solution
- water
- pits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000011248 coating agent Substances 0.000 title claims abstract description 12
- 238000000576 coating method Methods 0.000 title claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 46
- 238000007747 plating Methods 0.000 claims abstract description 41
- 238000005406 washing Methods 0.000 claims abstract description 40
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 18
- 230000003213 activating effect Effects 0.000 claims abstract description 16
- 238000009713 electroplating Methods 0.000 claims abstract description 15
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 15
- 229940074404 sodium succinate Drugs 0.000 claims abstract description 14
- ZDQYSKICYIVCPN-UHFFFAOYSA-L sodium succinate (anhydrous) Chemical compound [Na+].[Na+].[O-]C(=O)CCC([O-])=O ZDQYSKICYIVCPN-UHFFFAOYSA-L 0.000 claims abstract description 14
- 238000005530 etching Methods 0.000 claims abstract description 7
- 238000005237 degreasing agent Methods 0.000 claims abstract description 5
- 239000013527 degreasing agent Substances 0.000 claims abstract description 5
- 239000000243 solution Substances 0.000 claims description 26
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical group OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 6
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 6
- 239000010913 used oil Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052802 copper Inorganic materials 0.000 abstract description 11
- 239000010949 copper Substances 0.000 abstract description 11
- 238000001179 sorption measurement Methods 0.000 abstract description 4
- 239000000080 wetting agent Substances 0.000 abstract description 4
- 238000004140 cleaning Methods 0.000 abstract description 3
- 230000002950 deficient Effects 0.000 abstract description 3
- 239000004094 surface-active agent Substances 0.000 abstract description 3
- 239000012535 impurity Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a method for eliminating pits on a coating surface of an FPC (flexible printed circuit), which comprises the following steps of: (1) removing oil; (2) washing with water; (3) micro-etching; (4) washing with water; (5) activating; (6) washing with water; (7) pure water washing; (8) preparing a plating solution; (9) electroplating; the concentration of the degreasing agent used in the step (1) is 0.1 mL/L; and (3) when the plating solution is prepared in the step (8), 0.04-0.1mL/L of sodium succinate is added into the nickel plating solution. According to the invention, an oil removing procedure is added in the treatment before FPC electroplating, and the hydrophilicity of the FPC copper surface is enhanced by using the surfactant in the oil removing agent, so that the adsorption force of bubbles on the copper surface is reduced, and the cleaning is more thorough in the subsequent procedure; meanwhile, sodium succinate with proper concentration is added into the nickel plating solution as a wetting agent to reduce the surface tension of the nickel plating solution and accelerate the escape of bubbles, thereby reducing the generation of pits, solving the problem of poor pits on the coating surface of the product, improving the yield of the product and reducing the average defective rate from 6.05 percent to 0.20 percent.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to a method for eliminating pits on a coating surface of an FPC (flexible printed circuit).
Background
In recent years, with the development of electronic products towards high technology, miniaturization and high performance, the requirements of people on FPCs are evolved into the characteristics of high wiring density, light weight and thin thickness, and enterprises face higher challenges and technical requirements. Particularly, the poor current situation that pits on the surface of a plating layer cannot be effectively reduced by methods such as physical board brushing, chemical microetching and the like adopted by the FPC product in the electroplating pretreatment stage in the industry at present aiming at the existing plating layer product is influenced.
Disclosure of Invention
The invention aims to provide a method for eliminating pits on a coating surface of an FPC (flexible printed circuit), which can solve the problems of serious pit phenomenon and high reject ratio in the existing coating product.
In order to achieve the above purpose, the solution of the invention is:
a method for eliminating pits on a coating surface of an FPC comprises the following steps:
(1) removing oil; (2) washing with water; (3) micro-etching; (4) washing with water; (5) activating; (6) washing with water; (7) pure water washing; (8) preparing a plating solution; (9) electroplating;
wherein the concentration of the degreasing agent used in the step (1) is 0.1 mL/L; and (3) when the plating solution is prepared in the step (8), 0.04-0.1mL/L of sodium succinate is added into the nickel plating solution.
In the step (8), 0.1mL/L sodium succinate is added into the nickel plating solution.
In the step (1), the used oil removal agent is triethanolamine.
In the step (5), the activating agent is a mixed solution of palladium chloride, hydrochloric acid and water.
After the technical scheme is adopted, the oil removing procedure is added in the treatment before the electroplating of the FPC, the hydrophilicity of the copper surface of the FPC is enhanced by using the surfactant in the oil removing agent, so that the adsorption force of bubbles on the copper surface is reduced, and the cleaning in the subsequent procedure is more thorough; meanwhile, sodium succinate with proper concentration is added into the nickel plating solution as a wetting agent to reduce the surface tension of the nickel plating solution and accelerate the escape of bubbles, thereby reducing the generation of pits, solving the problem of poor pits on the coating surface of the product, improving the yield of the product and reducing the average defective rate from 6.05 percent to 0.20 percent.
Detailed Description
In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following specific examples.
In the electroplating process, the FPC board is used as a cathode, and when the plating metal is deposited on the copper surface, hydrogen atoms in the plating solution obtain electrons at the cathode and are reduced into hydrogen (2H)++2e-=H2) (ii) a When hydrogen bubbles of the plating solution are adsorbed on the plating layer and do not escape from the copper surface in time, no plating layer is deposited at the position where the bubbles are located, and the plating layer is deposited at the position where the bubbles are not located all the time, and when the plating is finished, a pit is formed on the plating layer. Therefore, the FPC board can be treated before electroplating to increase the hydrophilicity of the FPC board and further reduce the adsorption force of bubbles on the copper surface; meanwhile, a wetting agent can be added into the plating tank to reduce the surface tension of the plating solution, so that bubbles are not easy to adsorb on the copper surface during electroplating.
The invention relates to a method for eliminating pits on a coating surface of an FPC (flexible printed circuit), which comprises the following steps of:
(1) removing oil; (2) washing with water; (3) micro-etching; (4) washing with water; (5) activating; (6) washing with water; (7) pure water washing; (8) preparing a plating solution; (9) electroplating;
wherein the concentration of the degreasing agent used in the step (1) is 0.1 mL/L; when the plating solution is prepared in the step (8), 0.04-0.1mL/L of sodium succinate is added into the nickel plating solution, and the best effect is achieved when the concentration of the added sodium succinate is 0.1 mL/L.
In the step (1), the used oil removal agent is triethanolamine, so that alkaline oil removal is realized.
In the step (5), the activating agent is a mixed solution of palladium chloride, hydrochloric acid and water.
The following is a first embodiment of the present invention:
(1) oil removal: using triethanolamine (oil removal agent) with the concentration of 0.04mL/L to remove oil from the FPC;
(2) washing with water: removing residual impurities on the surface of the FPC by water washing;
(3) micro-etching: using H2SO4+H2O2Microetching the FPC (microetching liquid);
(4) washing with water: removing residual microetching liquid on the surface of the FPC by water washing;
(5) and (3) activation: activating the FPC by using a mixed solution (activating agent) of palladium chloride, hydrochloric acid and water;
(6) washing with water: removing the residual activating agent on the surface of the FPC by water washing;
(7) pure water washing: removing all impurities on the surface of the FPC by pure water washing;
(8) preparing a plating solution: adding 0.04mL/L sodium succinate into the nickel plating solution;
(9) and (4) electroplating.
The following is a second embodiment of the present invention:
(1) oil removal: using triethanolamine (oil removal agent) with the concentration of 0.07mL/L to remove oil from the FPC;
(2) washing with water: removing residual impurities on the surface of the FPC by water washing;
(3) micro-etching: using H2SO4+H2O2Microetching the FPC (microetching liquid);
(4) washing with water: removing residual microetching liquid on the surface of the FPC by water washing;
(5) and (3) activation: activating the FPC by using a mixed solution (activating agent) of palladium chloride, hydrochloric acid and water;
(6) washing with water: removing the residual activating agent on the surface of the FPC by water washing;
(7) pure water washing: removing all impurities on the surface of the FPC by pure water washing;
(8) preparing a plating solution: adding 0.07mL/L sodium succinate into the nickel plating solution;
(9) and (4) electroplating.
The following is a third embodiment of the present invention:
(1) oil removal: using triethanolamine (oil removal agent) with the concentration of 0.1mL/L to remove oil from the FPC;
(2) washing with water: removing residual impurities on the surface of the FPC by water washing;
(3) micro-etching: using H2SO4+H2O2Microetching the FPC (microetching liquid);
(4) washing with water: removing residual microetching liquid on the surface of the FPC by water washing;
(5) and (3) activation: activating the FPC by using a mixed solution (activating agent) of palladium chloride, hydrochloric acid and water;
(6) washing with water: removing the residual activating agent on the surface of the FPC by water washing;
(7) pure water washing: removing all impurities on the surface of the FPC by pure water washing;
(8) preparing a plating solution: adding 0.1mL/L sodium succinate into the nickel plating solution;
(9) and (4) electroplating.
The experimental data recorded were:
from the experimental data, when the concentration of the degreasing agent is 0.1mL/L, the copper surface after degreasing has the best hydrophilicity and is least easily adsorbed by bubbles; and when the concentration of the sodium succinate is 0.1mL/L, the pit rate at the periphery of the bonding pad is reduced to 0 during electroplating, and the effect is obvious.
Through the scheme, the oil removing procedure is added in the treatment before the electroplating of the FPC, the hydrophilicity of the copper surface of the FPC is enhanced by using the surfactant in the oil removing agent, so that the adsorption force of bubbles on the copper surface is reduced, and the cleaning in the subsequent procedure is more thorough; meanwhile, sodium succinate with proper concentration is added into the nickel plating solution as a wetting agent to reduce the surface tension of the nickel plating solution and accelerate the escape of bubbles, thereby reducing the generation of pits, solving the problem of poor pits on the coating surface of the product, improving the yield of the product and reducing the average defective rate from 6.05 percent to 0.20 percent.
The above embodiments are not intended to limit the form and style of the present invention, and any suitable changes or modifications made by those skilled in the art should be considered as not departing from the scope of the present invention.
Claims (4)
1. A method for eliminating pits on a coating surface of an FPC is characterized by comprising the following steps:
(1) removing oil; (2) washing with water; (3) micro-etching; (4) washing with water; (5) activating; (6) washing with water; (7) pure water washing; (8) preparing a plating solution; (9) electroplating;
wherein the concentration of the degreasing agent used in the step (1) is 0.1 mL/L; and (3) when the plating solution is prepared in the step (8), 0.04-0.1mL/L of sodium succinate is added into the nickel plating solution.
2. The method for removing the pits on the FPC plating surface of claim 1, wherein:
in the step (8), 0.1mL/L sodium succinate is added into the nickel plating solution.
3. The method for removing the pits on the FPC plating surface of claim 1, wherein:
in the step (1), the used oil removal agent is triethanolamine.
4. The method for removing the pits on the FPC plating surface of claim 1, wherein:
in the step (5), the activating agent is a mixed solution of palladium chloride, hydrochloric acid and water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111561567.2A CN114108046A (en) | 2021-12-20 | 2021-12-20 | Method for eliminating pits on FPC (Flexible printed Circuit) coating surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111561567.2A CN114108046A (en) | 2021-12-20 | 2021-12-20 | Method for eliminating pits on FPC (Flexible printed Circuit) coating surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114108046A true CN114108046A (en) | 2022-03-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111561567.2A Withdrawn CN114108046A (en) | 2021-12-20 | 2021-12-20 | Method for eliminating pits on FPC (Flexible printed Circuit) coating surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114108046A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000096252A (en) * | 1998-09-18 | 2000-04-04 | C Uyemura & Co Ltd | Method for plating to hard disk substrate |
| CN102586765A (en) * | 2012-03-20 | 2012-07-18 | 景旺电子（深圳）有限公司 | Method for chemical nickel-plating and gold immersion on FPC (Flexible Printed Circuit) |
| CN102888628A (en) * | 2012-10-11 | 2013-01-23 | 合肥奥福表面处理科技有限公司 | Electro-nickelling working solution for PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board |
| JP2015156459A (en) * | 2014-02-21 | 2015-08-27 | Dic株式会社 | Laminate, conductive pattern, and electronic circuit |
| CN106987873A (en) * | 2017-05-31 | 2017-07-28 | 东莞市诚志电子有限公司 | A kind of nickel plating process for electroplating bright nickeline |
| CN110318045A (en) * | 2019-06-20 | 2019-10-11 | 深圳市宏达秋科技有限公司 | A kind of high stability chemical nickel-plating liquid and preparation method thereof |
-
2021
- 2021-12-20 CN CN202111561567.2A patent/CN114108046A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000096252A (en) * | 1998-09-18 | 2000-04-04 | C Uyemura & Co Ltd | Method for plating to hard disk substrate |
| CN102586765A (en) * | 2012-03-20 | 2012-07-18 | 景旺电子（深圳）有限公司 | Method for chemical nickel-plating and gold immersion on FPC (Flexible Printed Circuit) |
| CN102888628A (en) * | 2012-10-11 | 2013-01-23 | 合肥奥福表面处理科技有限公司 | Electro-nickelling working solution for PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board |
| JP2015156459A (en) * | 2014-02-21 | 2015-08-27 | Dic株式会社 | Laminate, conductive pattern, and electronic circuit |
| CN106987873A (en) * | 2017-05-31 | 2017-07-28 | 东莞市诚志电子有限公司 | A kind of nickel plating process for electroplating bright nickeline |
| CN110318045A (en) * | 2019-06-20 | 2019-10-11 | 深圳市宏达秋科技有限公司 | A kind of high stability chemical nickel-plating liquid and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 刘程主编: "《表面活性剂性质理论与应用》", 北京：北京工业大学出版社, pages: 49 * |
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Application publication date: 20220301 |
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