MY209223A - Computing system with superconducting and non-superconducting components located on a common substrate - Google Patents

Computing system with superconducting and non-superconducting components located on a common substrate

Info

Publication number
MY209223A
MY209223A MYPI2020004613A MYPI2020004613A MY209223A MY 209223 A MY209223 A MY 209223A MY PI2020004613 A MYPI2020004613 A MY PI2020004613A MY PI2020004613 A MYPI2020004613 A MY PI2020004613A MY 209223 A MY209223 A MY 209223A
Authority
MY
Malaysia
Prior art keywords
superconducting
superconducting components
common substrate
computing system
kelvin
Prior art date
Application number
MYPI2020004613A
Inventor
B Christiansen Martin
K Wakamiya Stanley
G Chorosinski Leonard
C Heffner Harlan
Original Assignee
Microsoft Technology Licensing Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microsoft Technology Licensing Llc filed Critical Microsoft Technology Licensing Llc
Publication of MY209223A publication Critical patent/MY209223A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20372—Cryogenic cooling; Nitrogen liquid cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)

Abstract

A computing system including a common substrate having both superconducting components and non-superconducting components is provided. The superconducting components may be attached towards a first end of the common substrate and the non-superconducting components may be attached towards a second end, opposite to the first end, of the common substrate. The common substrate may include circuit traces for interconnecting the superconducting components with the non-superconducting components. A heat-shield may thermally separate the first end from the second end of the common substrate such that the superconducting components are configured to operate in a temperature range between 2 Kelvin to 77 Kelvin and the non-superconducting components are configured to operate in a temperature range between 200 Kelvin to 400 Kelvin. Each of the superconducting components may be configured to provide primarily a processor functionality and each of the non-superconducting components may be configured to provide primarily a storage functionality. Figure 2
MYPI2020004613A 2018-03-14 2018-12-01 Computing system with superconducting and non-superconducting components located on a common substrate MY209223A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/921,311 US10165667B1 (en) 2018-03-14 2018-03-14 Computing system with superconducting and non-superconducting components located on a common substrate
PCT/US2018/063509 WO2019177673A1 (en) 2018-03-14 2018-12-01 Computing system with superconducting and non-superconducting components located on a common substrate

Publications (1)

Publication Number Publication Date
MY209223A true MY209223A (en) 2025-06-29

Family

ID=64692269

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020004613A MY209223A (en) 2018-03-14 2018-12-01 Computing system with superconducting and non-superconducting components located on a common substrate

Country Status (14)

Country Link
US (1) US10165667B1 (en)
EP (1) EP3765939B1 (en)
JP (1) JP7304872B2 (en)
KR (1) KR102609929B1 (en)
CN (1) CN111837093B (en)
AU (1) AU2018413356B2 (en)
BR (1) BR112020016789A2 (en)
CA (1) CA3092180A1 (en)
IL (1) IL277082B2 (en)
MX (1) MX2020009402A (en)
MY (1) MY209223A (en)
PH (1) PH12020551509A1 (en)
SG (1) SG11202008357XA (en)
WO (1) WO2019177673A1 (en)

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US12253205B1 (en) 2018-09-28 2025-03-18 Montana Instruments Corporation Thermal transfer line assemblies, methods of manufacturing thermal transfer line assemblies, and thermal transfer methods
US12071998B2 (en) 2018-10-09 2024-08-27 Montana Instruments Corporation Cryocooler assemblies and methods
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Also Published As

Publication number Publication date
US10165667B1 (en) 2018-12-25
IL277082A (en) 2020-10-29
IL277082B1 (en) 2024-03-01
CN111837093A (en) 2020-10-27
KR20200131233A (en) 2020-11-23
JP2021517294A (en) 2021-07-15
IL277082B2 (en) 2024-07-01
CN111837093B (en) 2022-07-15
EP3765939B1 (en) 2025-11-12
SG11202008357XA (en) 2020-09-29
AU2018413356B2 (en) 2023-08-17
KR102609929B1 (en) 2023-12-04
WO2019177673A1 (en) 2019-09-19
EP3765939A1 (en) 2021-01-20
JP7304872B2 (en) 2023-07-07
CA3092180A1 (en) 2019-09-19
PH12020551509A1 (en) 2021-09-06
AU2018413356A1 (en) 2020-08-20
RU2020133484A (en) 2022-04-14
BR112020016789A2 (en) 2020-12-15
MX2020009402A (en) 2020-10-28

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