WO2019011506A3 - Power electronic packaging - Google Patents

Power electronic packaging Download PDF

Info

Publication number
WO2019011506A3
WO2019011506A3 PCT/EP2018/062382 EP2018062382W WO2019011506A3 WO 2019011506 A3 WO2019011506 A3 WO 2019011506A3 EP 2018062382 W EP2018062382 W EP 2018062382W WO 2019011506 A3 WO2019011506 A3 WO 2019011506A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic packaging
power electronic
power electronics
cooling system
power
Prior art date
Application number
PCT/EP2018/062382
Other languages
French (fr)
Other versions
WO2019011506A2 (en
Inventor
Wei Liu
Xiaoguang Liang
Original Assignee
Zf Friedrichshafen Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zf Friedrichshafen Ag filed Critical Zf Friedrichshafen Ag
Priority to EP18724541.0A priority Critical patent/EP3631853A2/en
Publication of WO2019011506A2 publication Critical patent/WO2019011506A2/en
Publication of WO2019011506A3 publication Critical patent/WO2019011506A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change

Abstract

Power electronic packaging comprising: A cooling System exhibiting a first part, at least one second part connecting the first and a third part, the first and the third part being in parallel. - A first part of the power electronics being connected to at least one side of the at least one second part of the cooling System. - A second part of the power electronics being mounted on the at least one second part of the cooling System, so that the first part of the power electronics is perpendicular to the second part of the power electronics.
PCT/EP2018/062382 2017-05-29 2018-05-14 Power electronic packaging WO2019011506A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP18724541.0A EP3631853A2 (en) 2017-05-29 2018-05-14 Power electronic packaging

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017208925.3 2017-05-29
DE102017208925.3A DE102017208925A1 (en) 2017-05-29 2017-05-29 Power electronics packaging

Publications (2)

Publication Number Publication Date
WO2019011506A2 WO2019011506A2 (en) 2019-01-17
WO2019011506A3 true WO2019011506A3 (en) 2019-12-19

Family

ID=62165573

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2018/062382 WO2019011506A2 (en) 2017-05-29 2018-05-14 Power electronic packaging

Country Status (3)

Country Link
EP (1) EP3631853A2 (en)
DE (1) DE102017208925A1 (en)
WO (1) WO2019011506A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019200011A1 (en) * 2019-01-02 2020-07-02 Rolls-Royce Deutschland Ltd & Co Kg Electrical circuit with cooling, in particular for applications in aircraft
US11923716B2 (en) 2019-09-13 2024-03-05 Milwaukee Electric Tool Corporation Power converters with wide bandgap semiconductors

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120001341A1 (en) * 2010-06-30 2012-01-05 Denso Corporation Semiconductor device
EP2578982A1 (en) * 2010-05-28 2013-04-10 Toyota Jidosha Kabushiki Kaisha Heat exchanger and method for manufacturing same
WO2015159141A1 (en) * 2014-04-15 2015-10-22 Toyota Jidosha Kabushiki Kaisha Power converter and method for manufacturing power converter
US20160104654A1 (en) * 2013-09-10 2016-04-14 Mitsubishi Electric Corporation Semiconductor device and semiconductor module
US20160234975A1 (en) * 2013-09-12 2016-08-11 Hanon Systems Heat exchanger for cooling electric element

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335454A (en) 1992-04-03 1993-12-17 Fuji Electric Co Ltd Cooler for electronic apparatus
DE9314286U1 (en) 1993-09-22 1993-12-16 Honeywell Ag Converter
FR2775416B1 (en) 1998-02-23 2000-06-23 Gec Alsthom Transport Sa COOLING ELEMENT FOR ELECTRONIC POWER DEVICE AND ELECTRONIC POWER DEVICE COMPRISING SUCH AN ELEMENT
US7999369B2 (en) 2006-08-29 2011-08-16 Denso Corporation Power electronic package having two substrates with multiple semiconductor chips and electronic components
US9030822B2 (en) 2011-08-15 2015-05-12 Lear Corporation Power module cooling system
EP2648495B1 (en) 2012-04-04 2015-02-25 Inmotion Technologies AB Switched power converter
US10178805B2 (en) 2014-05-23 2019-01-08 Tesla, Inc. Heatsink with internal cavity for liquid cooling
JP6286543B2 (en) 2014-06-25 2018-02-28 株式会社日立製作所 Power module device, power conversion device, and method of manufacturing power module device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2578982A1 (en) * 2010-05-28 2013-04-10 Toyota Jidosha Kabushiki Kaisha Heat exchanger and method for manufacturing same
US20120001341A1 (en) * 2010-06-30 2012-01-05 Denso Corporation Semiconductor device
US20160104654A1 (en) * 2013-09-10 2016-04-14 Mitsubishi Electric Corporation Semiconductor device and semiconductor module
US20160234975A1 (en) * 2013-09-12 2016-08-11 Hanon Systems Heat exchanger for cooling electric element
WO2015159141A1 (en) * 2014-04-15 2015-10-22 Toyota Jidosha Kabushiki Kaisha Power converter and method for manufacturing power converter

Also Published As

Publication number Publication date
EP3631853A2 (en) 2020-04-08
DE102017208925A1 (en) 2018-11-29
WO2019011506A2 (en) 2019-01-17

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