MY207144A - Manufacturing method for glass substrate and manufacturing method for magnetic disc - Google Patents

Manufacturing method for glass substrate and manufacturing method for magnetic disc

Info

Publication number
MY207144A
MY207144A MYPI2021000409A MYPI2021000409A MY207144A MY 207144 A MY207144 A MY 207144A MY PI2021000409 A MYPI2021000409 A MY PI2021000409A MY PI2021000409 A MYPI2021000409 A MY PI2021000409A MY 207144 A MY207144 A MY 207144A
Authority
MY
Malaysia
Prior art keywords
circumferential portion
manufacturing
glass substrate
outer side
outer circumferential
Prior art date
Application number
MYPI2021000409A
Other languages
English (en)
Inventor
Shuhei Azuma
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of MY207144A publication Critical patent/MY207144A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/007—Other surface treatment of glass not in the form of fibres or filaments by thermal treatment
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
MYPI2021000409A 2018-07-27 2019-07-26 Manufacturing method for glass substrate and manufacturing method for magnetic disc MY207144A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2018/028269 WO2020021705A1 (ja) 2018-07-27 2018-07-27 ガラス基板の製造方法及び磁気ディスクの製造方法
PCT/JP2019/029530 WO2020022510A1 (ja) 2018-07-27 2019-07-26 ガラス基板の製造方法及び磁気ディスクの製造方法

Publications (1)

Publication Number Publication Date
MY207144A true MY207144A (en) 2025-01-31

Family

ID=69181399

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021000409A MY207144A (en) 2018-07-27 2019-07-26 Manufacturing method for glass substrate and manufacturing method for magnetic disc

Country Status (6)

Country Link
US (2) US12084376B2 (enExample)
JP (3) JP6836694B2 (enExample)
CN (1) CN112512741B (enExample)
MY (1) MY207144A (enExample)
SG (1) SG11202100826TA (enExample)
WO (2) WO2020021705A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111630009B (zh) * 2018-01-31 2022-03-01 Hoya株式会社 圆盘形状的玻璃坯板及磁盘用玻璃基板的制造方法
WO2021200512A1 (ja) * 2020-03-31 2021-10-07 Hoya株式会社 中間体ガラス板の製造方法、磁気ディスク用ガラス板の製造方法、および中間体ガラス板の積層体
US11270724B1 (en) * 2021-03-04 2022-03-08 Western Digital Technologies, Inc. Glass substrates for heat assisted magnetic recording (HAMR) and methods and apparatus for use with the glass substrates
JP7441377B2 (ja) * 2021-03-31 2024-02-29 Hoya株式会社 ガラス基板の製造方法、ガラス基板、及び磁気ディスク用ガラス基板の製造方法
JP2024123284A (ja) * 2021-07-05 2024-09-11 Hoya株式会社 ガラス基板の製造方法及び円盤状ガラス基板
CN119952308A (zh) * 2025-02-24 2025-05-09 武汉华日科仪激光科技有限公司 一种玻璃码盘的激光加工方法和系统

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2785906B2 (ja) * 1994-02-14 1998-08-13 日本板硝子株式会社 ガラス板の切断方法
US6829910B1 (en) * 2000-04-25 2004-12-14 Asahi Glass Company, Ltd. Removal of enclosed glass parts after cutting using heating and cooling techniques
JP4786783B2 (ja) 2000-08-18 2011-10-05 日本板硝子株式会社 ガラス板の切断方法及び記録媒体用ガラス円盤
JP4225375B2 (ja) * 2002-03-01 2009-02-18 Ｈｏｙａ株式会社 ガラス基板の製造方法
JP5126351B2 (ja) 2009-12-25 2013-01-23 旭硝子株式会社 円盤状ガラス基板及び円盤状ガラス基板の製造方法
WO2013043173A1 (en) * 2011-09-21 2013-03-28 Raydiance, Inc. Systems and processes that singulate materials
MY198411A (en) 2012-09-28 2023-08-28 Hoya Corp Magnetic-Disk Glass Substrate and Magnetic Disk
JP6140047B2 (ja) * 2013-09-30 2017-05-31 Hoya株式会社 磁気ディスク用ガラス基板の製造方法
US10017410B2 (en) 2013-10-25 2018-07-10 Rofin-Sinar Technologies Llc Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses
US11053156B2 (en) * 2013-11-19 2021-07-06 Rofin-Sinar Technologies Llc Method of closed form release for brittle materials using burst ultrafast laser pulses
KR101972466B1 (ko) * 2015-01-13 2019-04-25 로핀-시나르 테크놀로지스 엘엘씨 취성 재료를 묘각하고 화학 식각하는 방법 및 시스템
EP3848334A1 (en) * 2015-03-24 2021-07-14 Corning Incorporated Alkaline earth boro-aluminosilicate glass article with laser cut edge
JP6654813B2 (ja) 2015-06-02 2020-02-26 川崎重工業株式会社 面取り加工装置および面取り加工方法
DE102015111490A1 (de) 2015-07-15 2017-01-19 Schott Ag Verfahren und Vorrichtung zum lasergestützten Abtrennen eines Teilstücks von einem flächigen Glaselement
CN108292510B (zh) 2015-12-28 2019-11-01 Hoya株式会社 圆环状的玻璃坯板及制造方法、圆环状的玻璃基板的制造方法和磁盘用玻璃基板的制造方法
MY194570A (en) * 2016-05-06 2022-12-02 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
JP2021516159A (ja) 2019-02-12 2021-07-01 ハンズ レーザー テクノロジー インダストリー グループ カンパニー リミテッド 硬脆材料製品の加工方法、装置及びシステム

Also Published As

Publication number Publication date
CN112512741B (zh) 2023-08-11
JP7458335B2 (ja) 2024-03-29
US12084376B2 (en) 2024-09-10
CN112512741A (zh) 2021-03-16
WO2020022510A1 (ja) 2020-01-30
JP7727036B2 (ja) 2025-08-20
US20210230042A1 (en) 2021-07-29
JPWO2020022510A1 (ja) 2021-03-11
JP6836694B2 (ja) 2021-03-03
WO2020021705A1 (ja) 2020-01-30
JP2024079731A (ja) 2024-06-11
SG11202100826TA (en) 2021-03-30
US20240425403A1 (en) 2024-12-26
JP2021075459A (ja) 2021-05-20

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