MY197838A - Semiconductor-processing temporary-adhesive tape - Google Patents
Semiconductor-processing temporary-adhesive tapeInfo
- Publication number
- MY197838A MY197838A MYPI2019005133A MYPI2019005133A MY197838A MY 197838 A MY197838 A MY 197838A MY PI2019005133 A MYPI2019005133 A MY PI2019005133A MY PI2019005133 A MYPI2019005133 A MY PI2019005133A MY 197838 A MY197838 A MY 197838A
- Authority
- MY
- Malaysia
- Prior art keywords
- semiconductor
- adhesive tape
- layer
- processing temporary
- base
- Prior art date
Links
- 239000002390 adhesive tape Substances 0.000 title abstract 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 abstract 1
- 229920001903 high density polyethylene Polymers 0.000 abstract 1
- 239000004700 high-density polyethylene Substances 0.000 abstract 1
- 229920000092 linear low density polyethylene Polymers 0.000 abstract 1
- 239000004707 linear low-density polyethylene Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017046435A JP6667468B2 (ja) | 2017-03-10 | 2017-03-10 | 半導体加工用粘着テープ |
PCT/JP2018/008737 WO2018164175A1 (ja) | 2017-03-10 | 2018-03-07 | 半導体加工用粘着テープ |
Publications (1)
Publication Number | Publication Date |
---|---|
MY197838A true MY197838A (en) | 2023-07-20 |
Family
ID=63448766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2019005133A MY197838A (en) | 2017-03-10 | 2018-03-07 | Semiconductor-processing temporary-adhesive tape |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6667468B2 (ja) |
KR (1) | KR102267114B1 (ja) |
CN (1) | CN110073470B (ja) |
MY (1) | MY197838A (ja) |
SG (1) | SG11201907365RA (ja) |
TW (1) | TWI705119B (ja) |
WO (1) | WO2018164175A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102417467B1 (ko) * | 2019-05-10 | 2022-07-06 | 쇼와덴코머티리얼즈가부시끼가이샤 | 픽업성의 평가 방법, 다이싱·다이본딩 일체형 필름, 다이싱·다이본딩 일체형 필름의 평가 방법과 선별 방법, 및 반도체 장치의 제조 방법 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1140520A (ja) | 1997-07-23 | 1999-02-12 | Toshiba Corp | ウェーハの分割方法及び半導体装置の製造方法 |
JP2001240842A (ja) | 2000-02-28 | 2001-09-04 | Nitto Denko Corp | 紫外線硬化型粘着剤組成物とその粘着シ―ト類 |
JP3408805B2 (ja) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
TW568825B (en) * | 2001-07-10 | 2004-01-01 | Rung-Wei Jeng | Intelligent iterative learning method for controlling filling and pressure-maintaining of injection molding device |
WO2013136897A1 (ja) * | 2012-03-12 | 2013-09-19 | リンテック株式会社 | バックグラインドシート用基材および粘着シート、当該基材およびシートの製造方法、ならびにワークの製造方法 |
JP6253327B2 (ja) * | 2013-09-27 | 2017-12-27 | グンゼ株式会社 | ダイシング用基体フィルム |
-
2017
- 2017-03-10 JP JP2017046435A patent/JP6667468B2/ja active Active
-
2018
- 2018-03-07 MY MYPI2019005133A patent/MY197838A/en unknown
- 2018-03-07 SG SG11201907365RA patent/SG11201907365RA/en unknown
- 2018-03-07 CN CN201880005072.1A patent/CN110073470B/zh active Active
- 2018-03-07 WO PCT/JP2018/008737 patent/WO2018164175A1/ja active Application Filing
- 2018-03-07 KR KR1020197017291A patent/KR102267114B1/ko active IP Right Grant
- 2018-03-09 TW TW107107983A patent/TWI705119B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO2018164175A1 (ja) | 2018-09-13 |
KR20190085059A (ko) | 2019-07-17 |
TW201833276A (zh) | 2018-09-16 |
CN110073470B (zh) | 2023-10-17 |
JP2018152420A (ja) | 2018-09-27 |
TWI705119B (zh) | 2020-09-21 |
CN110073470A (zh) | 2019-07-30 |
KR102267114B1 (ko) | 2021-06-21 |
SG11201907365RA (en) | 2019-09-27 |
JP6667468B2 (ja) | 2020-03-18 |
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