MY197343A - A method for inspecting a skeleton wafer - Google Patents
A method for inspecting a skeleton waferInfo
- Publication number
- MY197343A MY197343A MYPI2019002407A MYPI2019002407A MY197343A MY 197343 A MY197343 A MY 197343A MY PI2019002407 A MYPI2019002407 A MY PI2019002407A MY PI2019002407 A MYPI2019002407 A MY PI2019002407A MY 197343 A MY197343 A MY 197343A
- Authority
- MY
- Malaysia
- Prior art keywords
- wafer image
- skeleton
- skeleton wafer
- inspecting
- image
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
- G01N2021/8893—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques providing a video image and a processed signal for helping visual decision
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Quality & Reliability (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Theoretical Computer Science (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
Abstract
The present invention relates to a method for inspecting a skeleton wafer (1), comprising the steps of (i) performing template matching of at least one skeleton wafer image and at least one processed wafer image (101); (ii) rescaling said skeleton wafer image to match the processed wafer image's size (103); and (iii) computing differences between said skeleton wafer image and said processed wafer image (107); Gaussian mask convolution is performed on at least one electronic component of said skeleton wafer image to suppress weight on at least one edge of said skeleton wafer image (105), said step is done after step (ii) and prior to step (iii).
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2019002407A MY197343A (en) | 2019-04-29 | 2019-04-29 | A method for inspecting a skeleton wafer |
PH12020050118A PH12020050118A1 (en) | 2019-04-29 | 2020-04-28 | A method for inspecting a skeleton wafer |
KR1020200051550A KR102383577B1 (en) | 2019-04-29 | 2020-04-28 | A method for inspecting a skeleton wafer |
TW109114254A TWI747257B (en) | 2019-04-29 | 2020-04-29 | A method for inspecting a skeleton wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2019002407A MY197343A (en) | 2019-04-29 | 2019-04-29 | A method for inspecting a skeleton wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
MY197343A true MY197343A (en) | 2023-06-14 |
Family
ID=73429742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2019002407A MY197343A (en) | 2019-04-29 | 2019-04-29 | A method for inspecting a skeleton wafer |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR102383577B1 (en) |
MY (1) | MY197343A (en) |
PH (1) | PH12020050118A1 (en) |
TW (1) | TWI747257B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112991332A (en) * | 2021-04-21 | 2021-06-18 | 视睿(杭州)信息科技有限公司 | Polycrystalline defect detection method and device for wafer defects |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7155052B2 (en) * | 2002-06-10 | 2006-12-26 | Tokyo Seimitsu (Israel) Ltd | Method for pattern inspection |
JP4229767B2 (en) * | 2003-06-30 | 2009-02-25 | 株式会社東京精密 | Image defect inspection method, image defect inspection apparatus, and appearance inspection apparatus |
CN102662309B (en) * | 2005-09-09 | 2014-10-01 | Asml荷兰有限公司 | System and method for mask verification using individual mask error model |
US8103086B2 (en) * | 2007-01-11 | 2012-01-24 | Kla-Tencor Corporation | Reticle defect inspection with model-based thin line approaches |
JP4629086B2 (en) * | 2007-12-05 | 2011-02-09 | 株式会社東芝 | Image defect inspection method and image defect inspection apparatus |
CN101620039B (en) * | 2008-07-01 | 2011-06-22 | 中芯国际集成电路制造(上海)有限公司 | Sample positioning template of precision cutting machine table |
EP2339611B1 (en) * | 2009-12-23 | 2015-11-11 | ISMECA Semiconductor Holding SA | Wafer handler comprising a vision system |
US9311698B2 (en) * | 2013-01-09 | 2016-04-12 | Kla-Tencor Corp. | Detecting defects on a wafer using template image matching |
CN105408990B (en) * | 2013-06-07 | 2017-10-10 | 联达科技控股有限公司 | For examining the correct system and method for removing crystal grain from film frame automatically |
US10186028B2 (en) * | 2015-12-09 | 2019-01-22 | Kla-Tencor Corporation | Defect signal to noise enhancement by reducing die to die process noise |
CN108171688B (en) * | 2017-12-19 | 2021-01-08 | 浙江大学 | Wafer surface defect detection method based on Gabor characteristics and random dimensionality reduction |
-
2019
- 2019-04-29 MY MYPI2019002407A patent/MY197343A/en unknown
-
2020
- 2020-04-28 PH PH12020050118A patent/PH12020050118A1/en unknown
- 2020-04-28 KR KR1020200051550A patent/KR102383577B1/en active IP Right Grant
- 2020-04-29 TW TW109114254A patent/TWI747257B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI747257B (en) | 2021-11-21 |
PH12020050118A1 (en) | 2021-04-26 |
KR102383577B1 (en) | 2022-04-05 |
KR20200126921A (en) | 2020-11-09 |
TW202113303A (en) | 2021-04-01 |
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