MY193023A - Socket for testing electronic components and test site arrangement - Google Patents

Socket for testing electronic components and test site arrangement

Info

Publication number
MY193023A
MY193023A MYPI2017703301A MYPI2017703301A MY193023A MY 193023 A MY193023 A MY 193023A MY PI2017703301 A MYPI2017703301 A MY PI2017703301A MY PI2017703301 A MYPI2017703301 A MY PI2017703301A MY 193023 A MY193023 A MY 193023A
Authority
MY
Malaysia
Prior art keywords
contact spring
socket
force
sense
electronic components
Prior art date
Application number
MYPI2017703301A
Other languages
English (en)
Inventor
Gerhard Gschwendtberger
Manuel Petermann
Volker Leikermoser
Gerald Staniszewski
Original Assignee
Multitest Elektronische Systeme Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Multitest Elektronische Systeme Gmbh filed Critical Multitest Elektronische Systeme Gmbh
Publication of MY193023A publication Critical patent/MY193023A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
MYPI2017703301A 2016-09-08 2017-09-07 Socket for testing electronic components and test site arrangement MY193023A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP16187905 2016-09-08

Publications (1)

Publication Number Publication Date
MY193023A true MY193023A (en) 2022-09-22

Family

ID=56893823

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017703301A MY193023A (en) 2016-09-08 2017-09-07 Socket for testing electronic components and test site arrangement

Country Status (3)

Country Link
CN (1) CN107807256B (zh)
DE (1) DE102017120837B4 (zh)
MY (1) MY193023A (zh)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11233216A (ja) * 1998-02-16 1999-08-27 Nippon Denki Factory Engineering Kk テスト用ｉｃソケット
JP2005339894A (ja) * 2004-05-25 2005-12-08 Three M Innovative Properties Co ボールグリッドアレイ集積回路装置の試験用ソケット
US7256593B2 (en) * 2005-06-10 2007-08-14 Delaware Capital Formation, Inc. Electrical contact probe with compliant internal interconnect
CN201141874Y (zh) * 2007-05-10 2008-10-29 曹宏国 陶瓷四边引线片式载体元器件老化测试插座
CN101334425A (zh) * 2007-06-29 2008-12-31 京元电子股份有限公司 集成电路元件测试插座、插座基板、测试机台及其制造方法
WO2009149949A1 (de) * 2008-06-12 2009-12-17 Multitest Elektronische Systeme Gmbh Kontaktsockel
JP5486866B2 (ja) * 2009-07-29 2014-05-07 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN201955353U (zh) * 2010-11-12 2011-08-31 安拓锐高新测试技术（苏州）有限公司 一种半导体芯片测试插座
CN202145214U (zh) * 2011-06-30 2012-02-15 上海韬盛电子科技有限公司 一种基于开尔文原理的半导体芯片测试插座
US9429591B1 (en) * 2013-03-15 2016-08-30 Johnstech International Corporation On-center electrically conductive pins for integrated testing
CN203350289U (zh) * 2013-06-28 2013-12-18 中国电子科技集团公司第四十研究所 带浮动支架的cqfp封装件老炼测试插座
US9354251B2 (en) * 2014-02-25 2016-05-31 Titan Semiconductor Tool, LLC Integrated circuit (IC) test socket using Kelvin bridge
DE102015117354B4 (de) 2015-10-12 2020-02-20 Multitest Elektronische Systeme Gmbh Kragarmkontaktfeder und Verfahren zur Herstellung einer Kragarmkontaktfeder

Also Published As

Publication number Publication date
CN107807256B (zh) 2021-05-25
CN107807256A (zh) 2018-03-16
DE102017120837B4 (de) 2019-10-17
DE102017120837A1 (de) 2018-03-08

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