MY192447A - Copper alloy for electrical and electronic parts and semiconductors with high strength and high electrical conductivity and method of preparing the same - Google Patents

Copper alloy for electrical and electronic parts and semiconductors with high strength and high electrical conductivity and method of preparing the same

Info

Publication number
MY192447A
MY192447A MYPI2019000594A MYPI2019000594A MY192447A MY 192447 A MY192447 A MY 192447A MY PI2019000594 A MYPI2019000594 A MY PI2019000594A MY PI2019000594 A MYPI2019000594 A MY PI2019000594A MY 192447 A MY192447 A MY 192447A
Authority
MY
Malaysia
Prior art keywords
electrical
copper alloy
semiconductors
preparing
electrical conductivity
Prior art date
Application number
MYPI2019000594A
Inventor
Won Shin Kwak
Min Jae Jeong
Jun Young Choi
Original Assignee
Poongsan Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Poongsan Corp filed Critical Poongsan Corp
Publication of MY192447A publication Critical patent/MY192447A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005Copper or its alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

Disclosed are a copper alloy for electrical and electronic parts and semiconductors having high strength and high electrical conductivity and a method of preparing the same. The copper alloy includes 0.09 to 0.20% by mass of iron (Fe), 0.05 to 0.09% by mass of phosphorous (P), 0.05 to 0.20% by mass of manganese (Mn), the remaining amount of copper (Cu) and 0.05% by mass or less of inevitable impurities, and has tensile strength of 470 MPa or more, hardness of 145 Hv or more, electrical conductivity of 75%IACS or more and a softening resistant temperature of 400?( or higher. (Figure 3)
MYPI2019000594A 2017-11-02 2018-08-17 Copper alloy for electrical and electronic parts and semiconductors with high strength and high electrical conductivity and method of preparing the same MY192447A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170145414A KR101834335B1 (en) 2017-11-02 2017-11-02 Copper alloy for electrical and electronic parts and semiconductor with high strength and high electrical conductivity and a method of preparing same
PCT/KR2018/009428 WO2019088419A1 (en) 2017-11-02 2018-08-17 Copper alloy having high strength and high electrical conductivity characteristics for electrical and electronic component and semiconductor, and method for manufacturing same

Publications (1)

Publication Number Publication Date
MY192447A true MY192447A (en) 2022-08-21

Family

ID=61974037

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019000594A MY192447A (en) 2017-11-02 2018-08-17 Copper alloy for electrical and electronic parts and semiconductors with high strength and high electrical conductivity and method of preparing the same

Country Status (7)

Country Link
US (1) US20210332459A1 (en)
JP (1) JP6837541B2 (en)
KR (1) KR101834335B1 (en)
CN (1) CN109996898A (en)
MY (1) MY192447A (en)
TW (1) TWI681933B (en)
WO (1) WO2019088419A1 (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000328157A (en) * 1999-05-13 2000-11-28 Kobe Steel Ltd Copper alloy sheet excellent in bending workability
JP4041803B2 (en) * 2004-01-23 2008-02-06 株式会社神戸製鋼所 High strength and high conductivity copper alloy
WO2006019035A1 (en) * 2004-08-17 2006-02-23 Kabushiki Kaisha Kobe Seiko Sho Copper alloy plate for electric and electronic parts having bending workability
CN101124345B (en) * 2005-03-02 2011-02-09 古河电气工业株式会社 Copper alloy and method for production thereof
US20090084473A1 (en) * 2005-07-07 2009-04-02 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel Ltd) Copper alloy with high strength and excellent processability in bending and process for producing copper alloy sheet
KR101260911B1 (en) * 2010-02-08 2013-05-06 주식회사 풍산 Copper alloy having high strength, high conductivity and method of manufacture for the same
KR20130136183A (en) * 2012-06-04 2013-12-12 박효주 Copper alloy element and the method for production same

Also Published As

Publication number Publication date
US20210332459A1 (en) 2021-10-28
TW201922619A (en) 2019-06-16
KR101834335B1 (en) 2018-04-13
CN109996898A (en) 2019-07-09
TWI681933B (en) 2020-01-11
WO2019088419A1 (en) 2019-05-09
JP6837541B2 (en) 2021-03-03
JP2020504231A (en) 2020-02-06

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