MY181638A - Abrasive grain dispersion, polishing composition kit containing the same, preparation method of polishing composition using polishing composition kit, polishing composition, polishing method, and manufacturing method of substrate for magnetic disk - Google Patents
Abrasive grain dispersion, polishing composition kit containing the same, preparation method of polishing composition using polishing composition kit, polishing composition, polishing method, and manufacturing method of substrate for magnetic diskInfo
- Publication number
- MY181638A MY181638A MYPI2017703212A MYPI2017703212A MY181638A MY 181638 A MY181638 A MY 181638A MY PI2017703212 A MYPI2017703212 A MY PI2017703212A MY PI2017703212 A MYPI2017703212 A MY PI2017703212A MY 181638 A MY181638 A MY 181638A
- Authority
- MY
- Malaysia
- Prior art keywords
- polishing composition
- polishing
- abrasive grain
- grain dispersion
- less
- Prior art date
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
An object of the present invention is to provide a means capable of decreasing micro-scratches of a polishing target after polishing. An abrasive grain dispersion according to the present invention is an abrasive grain dispersion containing abrasive grains having an average primary particle size measured by a BET method in a range of 1 nm or more to 50 nm or less and a dispersing medium, and having a pH value of 7 or more to 12 or less, wherein when a content of the abrasive grains is converted to 30 mass% with respect to a total mass of the abrasive grain dispersion, the number of abrasive grains having a particle size in a range of 0.2 ?m or more to less than 0.3 ?m, measured by a number counting type particle size distribution meter, is equal to or less than 25,000,000 grains/cm3.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016175964A JP6680652B2 (en) | 2016-09-08 | 2016-09-08 | Abrasive dispersion, polishing composition kit containing the same, and method for producing polishing composition, polishing composition, polishing method, and method for producing magnetic disk substrate using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
MY181638A true MY181638A (en) | 2020-12-30 |
Family
ID=61625351
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2017703212A MY181638A (en) | 2016-09-08 | 2017-08-30 | Abrasive grain dispersion, polishing composition kit containing the same, preparation method of polishing composition using polishing composition kit, polishing composition, polishing method, and manufacturing method of substrate for magnetic disk |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6680652B2 (en) |
MY (1) | MY181638A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7240123B2 (en) * | 2018-09-28 | 2023-03-15 | 株式会社フジミインコーポレーテッド | Polishing composition, polishing composition preparation kit, and magnetic disk substrate manufacturing method |
US10907074B2 (en) * | 2019-07-03 | 2021-02-02 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions for reduced defectivity and methods of using the same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001271058A (en) * | 2000-03-27 | 2001-10-02 | Rodel Nitta Co | Method of producing polishing slurry |
JP4214107B2 (en) * | 2004-08-09 | 2009-01-28 | 花王株式会社 | Polishing liquid composition |
JP4907317B2 (en) * | 2006-11-30 | 2012-03-28 | 日揮触媒化成株式会社 | Kinpe sugar-like inorganic oxide sol, method for producing the same, and abrasive containing the sol |
JP5437571B2 (en) * | 2006-12-26 | 2014-03-12 | 花王株式会社 | Polishing fluid kit |
JP5833390B2 (en) * | 2010-09-24 | 2015-12-16 | 花王株式会社 | Method for producing polishing composition |
JP2014239228A (en) * | 2014-06-27 | 2014-12-18 | 日立化成株式会社 | Cmp polishing liquid |
-
2016
- 2016-09-08 JP JP2016175964A patent/JP6680652B2/en active Active
-
2017
- 2017-08-30 MY MYPI2017703212A patent/MY181638A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP6680652B2 (en) | 2020-04-15 |
JP2018039934A (en) | 2018-03-15 |
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