MY181638A - Abrasive grain dispersion, polishing composition kit containing the same, preparation method of polishing composition using polishing composition kit, polishing composition, polishing method, and manufacturing method of substrate for magnetic disk - Google Patents

Abrasive grain dispersion, polishing composition kit containing the same, preparation method of polishing composition using polishing composition kit, polishing composition, polishing method, and manufacturing method of substrate for magnetic disk

Info

Publication number
MY181638A
MY181638A MYPI2017703212A MYPI2017703212A MY181638A MY 181638 A MY181638 A MY 181638A MY PI2017703212 A MYPI2017703212 A MY PI2017703212A MY PI2017703212 A MYPI2017703212 A MY PI2017703212A MY 181638 A MY181638 A MY 181638A
Authority
MY
Malaysia
Prior art keywords
polishing composition
polishing
abrasive grain
grain dispersion
less
Prior art date
Application number
MYPI2017703212A
Inventor
Kamiya Tomohide
Yokomichi Noritaka
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of MY181638A publication Critical patent/MY181638A/en

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

An object of the present invention is to provide a means capable of decreasing micro-scratches of a polishing target after polishing. An abrasive grain dispersion according to the present invention is an abrasive grain dispersion containing abrasive grains having an average primary particle size measured by a BET method in a range of 1 nm or more to 50 nm or less and a dispersing medium, and having a pH value of 7 or more to 12 or less, wherein when a content of the abrasive grains is converted to 30 mass% with respect to a total mass of the abrasive grain dispersion, the number of abrasive grains having a particle size in a range of 0.2 ?m or more to less than 0.3 ?m, measured by a number counting type particle size distribution meter, is equal to or less than 25,000,000 grains/cm3.
MYPI2017703212A 2016-09-08 2017-08-30 Abrasive grain dispersion, polishing composition kit containing the same, preparation method of polishing composition using polishing composition kit, polishing composition, polishing method, and manufacturing method of substrate for magnetic disk MY181638A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016175964A JP6680652B2 (en) 2016-09-08 2016-09-08 Abrasive dispersion, polishing composition kit containing the same, and method for producing polishing composition, polishing composition, polishing method, and method for producing magnetic disk substrate using the same

Publications (1)

Publication Number Publication Date
MY181638A true MY181638A (en) 2020-12-30

Family

ID=61625351

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017703212A MY181638A (en) 2016-09-08 2017-08-30 Abrasive grain dispersion, polishing composition kit containing the same, preparation method of polishing composition using polishing composition kit, polishing composition, polishing method, and manufacturing method of substrate for magnetic disk

Country Status (2)

Country Link
JP (1) JP6680652B2 (en)
MY (1) MY181638A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7240123B2 (en) * 2018-09-28 2023-03-15 株式会社フジミインコーポレーテッド Polishing composition, polishing composition preparation kit, and magnetic disk substrate manufacturing method
US10907074B2 (en) * 2019-07-03 2021-02-02 Fujifilm Electronic Materials U.S.A., Inc. Polishing compositions for reduced defectivity and methods of using the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001271058A (en) * 2000-03-27 2001-10-02 Rodel Nitta Co Method of producing polishing slurry
JP4214107B2 (en) * 2004-08-09 2009-01-28 花王株式会社 Polishing liquid composition
JP4907317B2 (en) * 2006-11-30 2012-03-28 日揮触媒化成株式会社 Kinpe sugar-like inorganic oxide sol, method for producing the same, and abrasive containing the sol
JP5437571B2 (en) * 2006-12-26 2014-03-12 花王株式会社 Polishing fluid kit
JP5833390B2 (en) * 2010-09-24 2015-12-16 花王株式会社 Method for producing polishing composition
JP2014239228A (en) * 2014-06-27 2014-12-18 日立化成株式会社 Cmp polishing liquid

Also Published As

Publication number Publication date
JP6680652B2 (en) 2020-04-15
JP2018039934A (en) 2018-03-15

Similar Documents

Publication Publication Date Title
MY171840A (en) Composition for polishing purposes,polishing method using same,and method for producing substrate
IN2014MN02238A (en)
MY164370A (en) Fe-pt-based sputtering target with dispersed c grains
JP2015143838A5 (en)
MY167952A (en) Magnetic toner
CN104261811A (en) High-performance permanent magnetic ferrite and manufacturing method thereof
CN101948639B (en) Method for preparing high floating value floating aluminum silver paste
JP2016138278A5 (en)
MY181638A (en) Abrasive grain dispersion, polishing composition kit containing the same, preparation method of polishing composition using polishing composition kit, polishing composition, polishing method, and manufacturing method of substrate for magnetic disk
MY185133A (en) Magnetic toner
MY175221A (en) Magnetic toner
MXPA06000251A (en) Abrasive particles for chemical mechanical polishing.
MY169090A (en) Polishing composition for magnetic disk substrate
TW200729177A (en) Polishing composition for hard disk substrate
SG11201805718RA (en) Polishing composition and method for polishing silicon substrate
TW201612284A (en) Polishing composition
MY184290A (en) Polishing liquid composition for magnetic disk substrate
JP2017145185A5 (en)
MX2020007729A (en) Powder for coating an etch chamber.
MY187526A (en) Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
SG170807A1 (en) Fine particles of oxide crystal and slurry for polishing which contains the fine particles
SG11201806891QA (en) Fept-c-based sputtering target
MY165736A (en) Sputtering target
MY178171A (en) Sputtering target containing co or fe
WO2013049526A3 (en) Abrasive products and methods for finishing hard surfaces