MY176722A - Apparatus for manufacturing carrier tape - Google Patents

Apparatus for manufacturing carrier tape

Info

Publication number
MY176722A
MY176722A MYPI2015000336A MYPI2015000336A MY176722A MY 176722 A MY176722 A MY 176722A MY PI2015000336 A MYPI2015000336 A MY PI2015000336A MY PI2015000336 A MYPI2015000336 A MY PI2015000336A MY 176722 A MY176722 A MY 176722A
Authority
MY
Malaysia
Prior art keywords
carrier tape
sheet
roller
manufacturing
melted
Prior art date
Application number
MYPI2015000336A
Inventor
Eiji Okochi
Kazuo Tajiri
Kenichi Nakagoshi
Toshio Sugiyama
Original Assignee
Shinetsu Polymer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Polymer Co filed Critical Shinetsu Polymer Co
Publication of MY176722A publication Critical patent/MY176722A/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07Flat, e.g. panels
    • B29C48/08Flat, e.g. panels flexible, e.g. films
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/88Thermal treatment of the stream of extruded material, e.g. cooling
    • B29C48/911Cooling
    • B29C48/9135Cooling of flat articles, e.g. using specially adapted supporting means
    • B29C48/914Cooling of flat articles, e.g. using specially adapted supporting means cooling drums

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Packages (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Containers And Plastic Fillers For Packaging (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

An apparatus (500) for manufacturing a carrier tape (1) of the present invention is an apparatus (500) for manufacturing a resin carrier tape (1). The resin carrier tape (1) includes a belt-shaped sheet (151) having a first surface (15) and a second surface (13) which is substantially flat and opposed to the first surface (15) and a plurality of concave portions (12) formed on the first surface (15) and arranged along a longitudinal direction of the belt- shaped sheet (151). The apparatus (500) for manufacturing the carrier tape (1) of the present invention includes a sheet feeding portion (900) for feeding a melted sheet (the belt-shaped sheet (151)) (150) whose part at least on a side of the first surface (15) is in a melted state or a softened state; and a molding portion (800) including a first roller (120) for forming the plurality of concave portions (12) on the first surface (15) of the fed melted sheet (150) and a second roller (110) for flattening the second surface (13) of the fed melted sheet (150) and provided so as to face to the first roller (120). The molding portion (800) feeds the fed melted sheet (150) to a clearance between the first roller (120) and the second roller (110) to manufacture the carrier tape (1).
MYPI2015000336A 2012-08-31 2013-08-23 Apparatus for manufacturing carrier tape MY176722A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012192528 2012-08-31
JP2013137462A JP6257934B2 (en) 2012-08-31 2013-06-28 Carrier tape manufacturing apparatus and carrier tape manufacturing sheet manufacturing apparatus

Publications (1)

Publication Number Publication Date
MY176722A true MY176722A (en) 2020-08-19

Family

ID=50183351

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015000336A MY176722A (en) 2012-08-31 2013-08-23 Apparatus for manufacturing carrier tape

Country Status (4)

Country Link
JP (1) JP6257934B2 (en)
MY (1) MY176722A (en)
TW (1) TWI616312B (en)
WO (1) WO2014034537A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY181811A (en) * 2013-05-14 2021-01-07 Shinetsu Polymer Co Carrier tape manufacturing sheet, method for manufacturing carrier tape manufacturing sheet and package
JP6067038B2 (en) * 2015-01-27 2017-01-25 浙江潔美電子科技股▲ふん▼有限公司 Manufacturing method of belt used for mounting and continuous supply of electronic components
CN105014900B (en) * 2015-06-16 2017-06-27 东莞市成同电子科技有限公司 A kind of particle carries production line
JP6809678B2 (en) * 2017-05-15 2021-01-06 信越ポリマー株式会社 Carrier tape molding method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0788949A (en) * 1993-09-24 1995-04-04 Yayoi Kk Production of embossed carrier tape
JP2000185766A (en) * 1998-12-22 2000-07-04 Nec Corp Embossed carrier tape
JP2002308211A (en) * 2001-04-19 2002-10-23 Yayoi Kk Parts transferring member and its manufacturing method
JP2004137080A (en) * 2002-09-26 2004-05-13 Shin Etsu Polymer Co Ltd Method for winding carrier tape
JP2006117250A (en) * 2004-10-19 2006-05-11 International Chemical:Kk Electronic component conveyor and its manufacturing method
US20060157381A1 (en) * 2005-01-20 2006-07-20 Adams James T Component carrier and method for making
JP2007126169A (en) * 2005-11-02 2007-05-24 Shin Etsu Polymer Co Ltd Method for manufacturing electronic part storing member, and electronic part storing member
JP5358510B2 (en) * 2010-04-21 2013-12-04 信越ポリマー株式会社 Embossed carrier tape, method for manufacturing the same, and packaged part wound body

Also Published As

Publication number Publication date
TWI616312B (en) 2018-03-01
JP6257934B2 (en) 2018-01-10
WO2014034537A1 (en) 2014-03-06
TW201417991A (en) 2014-05-16
JP2014061945A (en) 2014-04-10

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