MY187110A - Method for manufacturing carrier tape for receiving electronic component - Google Patents

Method for manufacturing carrier tape for receiving electronic component

Info

Publication number
MY187110A
MY187110A MYPI2015000337A MYPI2015000337A MY187110A MY 187110 A MY187110 A MY 187110A MY PI2015000337 A MYPI2015000337 A MY PI2015000337A MY PI2015000337 A MYPI2015000337 A MY PI2015000337A MY 187110 A MY187110 A MY 187110A
Authority
MY
Malaysia
Prior art keywords
belt
shaped sheet
carrier tape
electronic component
receiving electronic
Prior art date
Application number
MYPI2015000337A
Inventor
Eiji Okochi
Kazuo Tajiri
Kenichi Nakagoshi
Toshio Sugiyama
Original Assignee
Shinetsu Polymer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Polymer Co filed Critical Shinetsu Polymer Co
Publication of MY187110A publication Critical patent/MY187110A/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00Packages comprising articles attached to cards, sheets or webs
    • B65D73/02Articles, e.g. small electrical components, attached to webs

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)

Abstract

A method for manufacturing a carrier tape (1) for receiving an electronic component (40) of the present invention is a method for manufacturing a resin carrier tape (1) including a belt-shaped sheet (151) having a first surface (15) and a second surface (13) which is substantially flat and opposed to the first surface (15) and a plurality of first concave portions (12) formed on the first surface (15) and arranged along a longitudinal direction of the belt-shaped sheet (151). The method includes heating the belt- shaped sheet (151) to melt or soften a part of the belt-shaped sheet (151) at least on a side of the first surface (15); and forming the plurality of first concave portions (12) on the first surface (15) of the belt-shaped sheet (151) by pressing a roll molding die (200) onto the first surface (15) of the belt-shaped sheet (151) with flattening the second surface (13) of the belt- shaped sheet (151) by pressing a touch roller (110) onto the second surface (13) of the belt-shaped sheet (151). (Figure 7)
MYPI2015000337A 2012-08-31 2013-08-23 Method for manufacturing carrier tape for receiving electronic component MY187110A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012192527 2012-08-31
JP2013137461A JP6257933B2 (en) 2012-08-31 2013-06-28 Method for manufacturing carrier tape for storing electronic component and method for manufacturing sheet for producing carrier tape
PCT/JP2013/072505 WO2014034536A1 (en) 2012-08-31 2013-08-23 Method for manufacturing carrier tape for storing electronic component

Publications (1)

Publication Number Publication Date
MY187110A true MY187110A (en) 2021-08-31

Family

ID=50183350

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015000337A MY187110A (en) 2012-08-31 2013-08-23 Method for manufacturing carrier tape for receiving electronic component

Country Status (4)

Country Link
JP (1) JP6257933B2 (en)
MY (1) MY187110A (en)
TW (1) TWI581944B (en)
WO (1) WO2014034536A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108820549B (en) * 2018-07-17 2024-02-27 珠海格力电器股份有限公司 Capacitor braid structure and manufacturing method thereof
WO2020246940A1 (en) * 2019-06-07 2020-12-10 C-Pak Pte Ltd Sharp pocket carrier tape
CN110641836A (en) * 2019-09-29 2020-01-03 芜湖德锐电子技术有限公司 Chip buffer packaging counting strip
CN112092426B (en) * 2020-09-01 2022-07-19 无锡佳欣电子产品有限公司 Automatic carrier tape forming equipment with correcting and rectifying functions

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2798727B2 (en) * 1989-08-30 1998-09-17 大日本印刷株式会社 Bottom material of conductive carrier for electronic parts
JP2000185766A (en) * 1998-12-22 2000-07-04 Nec Corp Embossed carrier tape
JP2002308211A (en) * 2001-04-19 2002-10-23 Yayoi Kk Parts transferring member and its manufacturing method
JP2004137080A (en) * 2002-09-26 2004-05-13 Shin Etsu Polymer Co Ltd Method for winding carrier tape
JP2006117250A (en) * 2004-10-19 2006-05-11 International Chemical:Kk Electronic component conveyor and its manufacturing method
US20060157381A1 (en) * 2005-01-20 2006-07-20 Adams James T Component carrier and method for making
JP5358510B2 (en) * 2010-04-21 2013-12-04 信越ポリマー株式会社 Embossed carrier tape, method for manufacturing the same, and packaged part wound body

Also Published As

Publication number Publication date
WO2014034536A1 (en) 2014-03-06
TW201417992A (en) 2014-05-16
JP6257933B2 (en) 2018-01-10
JP2014061944A (en) 2014-04-10
TWI581944B (en) 2017-05-11

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