MY176347A - A lead frame for selective soldering - Google Patents

A lead frame for selective soldering

Info

Publication number
MY176347A
MY176347A MYPI2015701546A MYPI2015701546A MY176347A MY 176347 A MY176347 A MY 176347A MY PI2015701546 A MYPI2015701546 A MY PI2015701546A MY PI2015701546 A MYPI2015701546 A MY PI2015701546A MY 176347 A MY176347 A MY 176347A
Authority
MY
Malaysia
Prior art keywords
solder
lead frame
features
chip
wettable
Prior art date
Application number
MYPI2015701546A
Inventor
Chee Yang Ng
Original Assignee
Chee Yang Ng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chee Yang Ng filed Critical Chee Yang Ng
Priority to MYPI2015701546A priority Critical patent/MY176347A/en
Priority to JP2017559609A priority patent/JP2018514952A/en
Priority to PCT/MY2016/000015 priority patent/WO2016182425A1/en
Publication of MY176347A publication Critical patent/MY176347A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

The present invention introduced a lead frame (400) with a base (100) that has both solder wettability and non-solder wettability features for single or multiple chip applications for separating chips (500) or isolating at least one chip (500) from electrical conductivity. The lead frame (400) enables a precise and uniform attachment of the chip (500) without affecting the bond line thickness (BLT) height, thus preventing the chip (500) from breaking and tilting. Besides that, the lead frame (400) reduces the capillarity of the solder (550) at the appropriate places during soldering and prevents the solder (550) from overflowing. The lead frame (400) comprises a framework (410); a base (100) with features for selective soldering; a plurality of tie bars (200); and a plurality of leads (300). The features for selective soldering include non solder-wettable region (155), at least one non solder-wettable stripe (160), at least one non solder-wettable patch (170), or a combination of the features.
MYPI2015701546A 2015-05-14 2015-05-14 A lead frame for selective soldering MY176347A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
MYPI2015701546A MY176347A (en) 2015-05-14 2015-05-14 A lead frame for selective soldering
JP2017559609A JP2018514952A (en) 2015-05-14 2016-03-28 Selective soldering lead frame
PCT/MY2016/000015 WO2016182425A1 (en) 2015-05-14 2016-03-28 A lead frame for selective soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2015701546A MY176347A (en) 2015-05-14 2015-05-14 A lead frame for selective soldering

Publications (1)

Publication Number Publication Date
MY176347A true MY176347A (en) 2020-07-29

Family

ID=57248241

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015701546A MY176347A (en) 2015-05-14 2015-05-14 A lead frame for selective soldering

Country Status (3)

Country Link
JP (1) JP2018514952A (en)
MY (1) MY176347A (en)
WO (1) WO2016182425A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6074523B1 (en) 2016-01-29 2017-02-01 大王製紙株式会社 Elastic structure of absorbent articles

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04188660A (en) * 1990-11-19 1992-07-07 Nec Kyushu Ltd Lead frame
JPH0823002A (en) * 1994-07-05 1996-01-23 Hitachi Ltd Semiconductor device and manufacturing method
JPH08148647A (en) * 1994-11-15 1996-06-07 Toshiba Corp Semiconductor device
KR100239750B1 (en) * 1997-06-16 2000-01-15 윤종용 Semiconductor package structure using epoxy molding compound pad and fabrication method thereof
JP2000138335A (en) * 1998-10-30 2000-05-16 Mitsubishi Shindoh Co Ltd Oxidation-resistance treated copper material and its manufacture
JP5834647B2 (en) * 2011-09-07 2015-12-24 大日本印刷株式会社 Lead frame and manufacturing method thereof
US20150001697A1 (en) * 2013-06-28 2015-01-01 Stmicroelectronics Sdn Bhd Selective treatment of leadframe with anti-wetting agent

Also Published As

Publication number Publication date
WO2016182425A1 (en) 2016-11-17
JP2018514952A (en) 2018-06-07

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