MY172804A - Method for chemical mechanical polishing silicon wafers - Google Patents

Method for chemical mechanical polishing silicon wafers

Info

Publication number
MY172804A
MY172804A MYPI2014703142A MYPI2014703142A MY172804A MY 172804 A MY172804 A MY 172804A MY PI2014703142 A MYPI2014703142 A MY PI2014703142A MY PI2014703142 A MYPI2014703142 A MY PI2014703142A MY 172804 A MY172804 A MY 172804A
Authority
MY
Malaysia
Prior art keywords
polishing
silicon wafer
curative
mechanical polishing
chemical mechanical
Prior art date
Application number
MYPI2014703142A
Other languages
English (en)
Inventor
Itai Yasuyuki
Qian Bainian
Nakano Hiroyuki
B James David
Kawai Naoko
Kawabata Katsumasa
Yoshida Koichi
Miyamoto Kazutaka
Murnane James
Yeh Fengji
W Degroot Marty
Original Assignee
Rohm & Haas Elect Materials Cmp Holdings Inc
Nitta Haas Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Materials Cmp Holdings Inc, Nitta Haas Inc filed Critical Rohm & Haas Elect Materials Cmp Holdings Inc
Publication of MY172804A publication Critical patent/MY172804A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polyurethanes Or Polyureas (AREA)
MYPI2014703142A 2013-10-24 2014-10-23 Method for chemical mechanical polishing silicon wafers MY172804A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/062,060 US8980749B1 (en) 2013-10-24 2013-10-24 Method for chemical mechanical polishing silicon wafers

Publications (1)

Publication Number Publication Date
MY172804A true MY172804A (en) 2019-12-12

Family

ID=52632216

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014703142A MY172804A (en) 2013-10-24 2014-10-23 Method for chemical mechanical polishing silicon wafers

Country Status (8)

Country Link
US (1) US8980749B1 (https=)
JP (1) JP6463618B2 (https=)
KR (1) KR102359116B1 (https=)
CN (1) CN104551977B (https=)
DE (1) DE102014015664A1 (https=)
MY (1) MY172804A (https=)
SG (1) SG10201406877WA (https=)
TW (1) TWI621166B (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9314897B2 (en) * 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259821B2 (en) * 2014-06-25 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
JP6697931B2 (ja) * 2016-04-01 2020-05-27 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法及び研磨方法
US20180281149A1 (en) 2017-03-31 2018-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7113626B2 (ja) * 2018-01-12 2022-08-05 ニッタ・デュポン株式会社 研磨パッド
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
CN110528287B (zh) * 2019-08-08 2022-03-08 安徽安利材料科技股份有限公司 一种毛刷式高耐用化学机械抛光聚氨酯材料及其制备方法
CN110977756B (zh) * 2019-12-27 2021-09-07 万华化学集团电子材料有限公司 一种化学机械抛光垫的抛光层及其应用
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN113214741B (zh) * 2021-04-24 2022-03-11 深圳市撒比斯科技有限公司 一种高稳定的cmp抛光液
CN115816291B (zh) * 2022-12-09 2026-02-06 万华化学集团电子材料有限公司 一种具有改善边缘效应的化学机械抛光垫、制备方法及其应用
CN118456278B (zh) * 2024-07-10 2024-12-03 万华化学集团电子材料有限公司 终点检测窗口、化学机械抛光垫及其应用

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283515A (ja) 1992-03-31 1993-10-29 Nec Kansai Ltd 半導体装置製造方法
JP3055471B2 (ja) 1996-10-03 2000-06-26 日本電気株式会社 半導体基板の製造方法及びその製造装置
JPH11277408A (ja) 1998-01-29 1999-10-12 Shin Etsu Handotai Co Ltd 半導体ウエーハの鏡面研磨用研磨布、鏡面研磨方法ならびに鏡面研磨装置
GB2334205B (en) 1998-02-12 2001-11-28 Shinetsu Handotai Kk Polishing method for semiconductor wafer and polishing pad used therein
DE60038948D1 (de) 1999-08-31 2008-07-03 Shinetsu Handotai Kk Verfahren und vorrichtung zum polieren von halbleiterscheiben
US6189546B1 (en) 1999-12-29 2001-02-20 Memc Electronic Materials, Inc. Polishing process for manufacturing dopant-striation-free polished silicon wafers
JP2002292556A (ja) 2001-03-29 2002-10-08 Sumitomo Osaka Cement Co Ltd シリコンウエハ鏡面研磨用スラリー、砥石、パッド及び研磨液、並びにこれらを用いたシリコンウエハの鏡面研磨方法
JP2003037089A (ja) * 2001-07-26 2003-02-07 Shin Etsu Handotai Co Ltd ウェーハの研磨方法
US6783436B1 (en) 2003-04-29 2004-08-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with optimized grooves and method of forming same
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
KR100709392B1 (ko) * 2005-07-20 2007-04-20 에스케이씨 주식회사 액상의 비닐계 모노머가 상호침투 가교된 형태를 갖는폴리우레탄 연마 패드
JP5019417B2 (ja) * 2006-06-22 2012-09-05 東洋ゴム工業株式会社 研磨パッドの製造方法及び研磨パッド
US7371160B1 (en) * 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
WO2008087797A1 (ja) * 2007-01-15 2008-07-24 Toyo Tire & Rubber Co., Ltd. 研磨パッド及びその製造方法
JP4986129B2 (ja) * 2007-01-15 2012-07-25 東洋ゴム工業株式会社 研磨パッド
JP5297096B2 (ja) 2007-10-03 2013-09-25 富士紡ホールディングス株式会社 研磨布
JP5484145B2 (ja) * 2010-03-24 2014-05-07 東洋ゴム工業株式会社 研磨パッド
JP5534907B2 (ja) * 2010-03-31 2014-07-02 富士紡ホールディングス株式会社 研磨パッドおよび研磨パッドの製造方法
CN102310366B (zh) * 2010-07-08 2014-03-05 罗门哈斯电子材料Cmp控股股份有限公司 具有低缺陷整体窗的化学机械抛光垫
US20120264303A1 (en) 2011-04-15 2012-10-18 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing slurry, system and method
EP2732917A4 (en) * 2011-07-15 2015-04-15 Toray Industries POLISHING CUSHION
US9144880B2 (en) * 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad

Also Published As

Publication number Publication date
KR102359116B1 (ko) 2022-02-08
US8980749B1 (en) 2015-03-17
JP2015109437A (ja) 2015-06-11
SG10201406877WA (en) 2015-05-28
TWI621166B (zh) 2018-04-11
KR20150047444A (ko) 2015-05-04
JP6463618B2 (ja) 2019-02-06
TW201535496A (zh) 2015-09-16
DE102014015664A1 (de) 2015-04-30
CN104551977A (zh) 2015-04-29
CN104551977B (zh) 2018-01-09

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