MY168337A - Pressure-sensitive adhesive sheet and method of manufacturing electronic component using the same - Google Patents

Pressure-sensitive adhesive sheet and method of manufacturing electronic component using the same

Info

Publication number
MY168337A
MY168337A MYPI2014701391A MYPI2014701391A MY168337A MY 168337 A MY168337 A MY 168337A MY PI2014701391 A MYPI2014701391 A MY PI2014701391A MY PI2014701391 A MYPI2014701391 A MY PI2014701391A MY 168337 A MY168337 A MY 168337A
Authority
MY
Malaysia
Prior art keywords
pressure
same
electronic component
sensitive adhesive
adhesive sheet
Prior art date
Application number
MYPI2014701391A
Other languages
English (en)
Inventor
Takeshi Saito
Tomoya TSUKUI
Original Assignee
Denka Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Company Ltd filed Critical Denka Company Ltd
Publication of MY168337A publication Critical patent/MY168337A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
MYPI2014701391A 2011-12-02 2012-11-27 Pressure-sensitive adhesive sheet and method of manufacturing electronic component using the same MY168337A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011264440 2011-12-02

Publications (1)

Publication Number Publication Date
MY168337A true MY168337A (en) 2018-10-31

Family

ID=48535430

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014701391A MY168337A (en) 2011-12-02 2012-11-27 Pressure-sensitive adhesive sheet and method of manufacturing electronic component using the same

Country Status (4)

Country Link
JP (1) JP5947313B2 (ja)
MY (1) MY168337A (ja)
TW (1) TWI541314B (ja)
WO (1) WO2013080979A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102215979B1 (ko) * 2013-06-11 2021-02-16 덴카 주식회사 점착 시트 및 점착 시트를 사용한 전자 부품의 제조 방법
JP6624825B2 (ja) * 2014-09-25 2019-12-25 日東電工株式会社 熱剥離型粘着シート
JP6343725B2 (ja) * 2016-02-29 2018-06-13 リンテック株式会社 半導体加工シート用基材フィルムおよび半導体加工シート
WO2017150018A1 (ja) * 2016-02-29 2017-09-08 リンテック株式会社 半導体加工シート
CN114901768A (zh) * 2020-03-30 2022-08-12 琳得科株式会社 粘着片

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07105368B2 (ja) * 1992-08-05 1995-11-13 日本加工製紙株式会社 半導体ウエハダイシング用粘着シート
JP2001089731A (ja) * 1999-09-20 2001-04-03 Lintec Corp 粘着剤組成物及びそれを用いた接着性光学機能部材
JP4593068B2 (ja) * 2002-11-29 2010-12-08 古河電気工業株式会社 半導体ウエハー固定用粘着テープ
JP2007031535A (ja) * 2005-07-26 2007-02-08 Denki Kagaku Kogyo Kk 粘着シートおよびそれを用いた電子部品の製造方法。
JP2011187571A (ja) * 2010-03-05 2011-09-22 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP5479991B2 (ja) * 2010-04-19 2014-04-23 日東電工株式会社 フリップチップ型半導体裏面用フィルム
JP2011236261A (ja) * 2010-05-06 2011-11-24 Furukawa Electric Co Ltd:The 半導体用接着フィルム及び半導体装置の製造方法
WO2011158835A1 (ja) * 2010-06-18 2011-12-22 日立化成工業株式会社 接着シート
JP5898679B2 (ja) * 2011-06-02 2016-04-06 デンカ株式会社 粘着テープおよび半導体ウエハ加工方法

Also Published As

Publication number Publication date
CN103959444A (zh) 2014-07-30
TWI541314B (zh) 2016-07-11
JPWO2013080979A1 (ja) 2015-04-27
JP5947313B2 (ja) 2016-07-06
WO2013080979A1 (ja) 2013-06-06
TW201326351A (zh) 2013-07-01

Similar Documents

Publication Publication Date Title
TWI563058B (en) Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same
EP2862021B8 (en) Electronic eyeglasses and methods of manufacturing
MY168204A (en) Film containing alginate membrane and manufacturing method of the same
EP2641883A4 (en) THIN-PLATED GLASS SUBSTRATE BONDED BODY AND METHOD FOR MANUFACTURING THE SAME
EP2678821A4 (en) TRAINING-BASED ELECTRONIC TEACHING BOOK SYSTEMS AND METHOD THEREFOR
EP2612630A4 (en) ADHESIVE SHEET, USE THEREOF, AND METHOD OF ADHESIVE SHEET ADHESION
EP2778205A4 (en) ADHESIVE TAPE AND MASK
EP2868298A4 (en) ADHESIVE TAPE WITH NON-ADHESIVE PART AND METHOD OF USE
EP3040443A4 (en) Substrate structure and method of manufacturing same
EP2794799A4 (en) HAFTARTIKEL WITH A PRIMER LAYER AND METHOD OF MANUFACTURING THEREFOR
EP2871220A4 (en) PRESSURE-SENSITIVE ADHESIVE SHEET
EP3020776A4 (en) Adhesive sheet and use thereof
EP2915766A4 (en) METHOD FOR FIXING ADHESIVE FOILS AND DEVICE FOR FIXING ADHESIVE FOILS
MY168166A (en) Polymer and Composition Including Same, and Adhesive Composition
IL225467A0 (en) Adhesive tape and method for producing adhesive tape
EP3026089A4 (en) Transparent pressure-sensitive adhesive sheet
EP2990454A4 (en) ADHESIVE ADHESIVE COMPOSITION AND ADHESIVE ADHESIVE FILM THEREWITH
EP2817145A4 (en) Pressure sensitive adhesive sheet and method of producing thereof
EP2925089B8 (en) Substrate for flexible devices and method for producing the same
EP2905318A4 (en) EASILY REMOVABLE DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE FOIL AND PULL-OFF PROCESS THEREFOR
EP2680678A4 (en) METAL CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREFOR
MY168394A (en) Apparatus and Method of Using the Same
TWI561603B (en) Adhesive composition, adhesive film and electronic component
EP2898147A4 (en) CHLOROFLUORPOLYMER-COATED SUBSTRATES AND METHOD FOR THE PRODUCTION THEREOF
MY168337A (en) Pressure-sensitive adhesive sheet and method of manufacturing electronic component using the same