MY164338A - Dicing film - Google Patents

Dicing film

Info

Publication number
MY164338A
MY164338A MYPI2017000684A MYPI2017000684A MY164338A MY 164338 A MY164338 A MY 164338A MY PI2017000684 A MYPI2017000684 A MY PI2017000684A MY PI2017000684 A MYPI2017000684 A MY PI2017000684A MY 164338 A MY164338 A MY 164338A
Authority
MY
Malaysia
Prior art keywords
base material
film
dicing film
dicing
layer
Prior art date
Application number
MYPI2017000684A
Other languages
English (en)
Inventor
Yoshinori Nagao
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of MY164338A publication Critical patent/MY164338A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
MYPI2017000684A 2014-11-19 2015-11-16 Dicing film MY164338A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014234102 2014-11-19

Publications (1)

Publication Number Publication Date
MY164338A true MY164338A (en) 2017-12-15

Family

ID=56013865

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017000684A MY164338A (en) 2014-11-19 2015-11-16 Dicing film

Country Status (5)

Country Link
JP (1) JP6103140B2 (zh)
CN (1) CN107004587A (zh)
MY (1) MY164338A (zh)
TW (1) TWI642717B (zh)
WO (1) WO2016080324A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6804860B2 (ja) * 2016-04-05 2020-12-23 パナック株式会社 キャリアシート及びカット部材の製造方法
JP6875011B2 (ja) * 2016-09-20 2021-05-19 リンテック株式会社 半導体加工用粘着シート
JP7174518B2 (ja) * 2017-11-16 2022-11-17 リンテック株式会社 半導体装置の製造方法
JP7067904B2 (ja) * 2017-11-16 2022-05-16 リンテック株式会社 半導体装置の製造方法
JP7154686B2 (ja) * 2018-06-06 2022-10-18 株式会社ディスコ ウェーハの加工方法
KR102359469B1 (ko) * 2020-01-31 2022-02-08 주식회사 케이비엘러먼트 다이싱 테이프 및 이의 제조 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4744196B2 (ja) * 2005-05-31 2011-08-10 電気化学工業株式会社 粘着シート
JP2009200076A (ja) * 2008-02-19 2009-09-03 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2011210887A (ja) * 2010-03-29 2011-10-20 Furukawa Electric Co Ltd:The 放射線硬化型ウエハ加工用粘着テープ
JP4976522B2 (ja) * 2010-04-16 2012-07-18 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法
JP5210346B2 (ja) * 2010-04-19 2013-06-12 電気化学工業株式会社 粘着シート及び電子部品の製造方法
EP2600391A1 (en) * 2010-07-28 2013-06-05 Du Pont-Mitsui Polychemicals Co., Ltd. Laminate film, and film for use in production of semiconductor comprising same
JP5666875B2 (ja) * 2010-10-21 2015-02-12 アキレス株式会社 半導体製造工程用テープの基材フィルム
JP5889892B2 (ja) * 2011-06-14 2016-03-22 デンカ株式会社 粘着シート及び電子部品の製造方法
JP2015162561A (ja) * 2014-02-27 2015-09-07 住友ベークライト株式会社 ダイシングフィルム

Also Published As

Publication number Publication date
JP6103140B2 (ja) 2017-03-29
JPWO2016080324A1 (ja) 2017-04-27
CN107004587A (zh) 2017-08-01
TW201629141A (zh) 2016-08-16
TWI642717B (zh) 2018-12-01
WO2016080324A1 (ja) 2016-05-26

Similar Documents

Publication Publication Date Title
MY164338A (en) Dicing film
PH12017500284A1 (en) Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating
PH12017500375A1 (en) Maleimide film
TW201611859A (en) Microneedle device
AU358051S (en) Protective glove
BR112017005507A2 (pt) composições que compreendem células recombinantes de bacillus e um fungicida.
BR112017005379A2 (pt) composições que compreendem células recombinantes de bacillus e um fungicida.
EP3502200A4 (en) COMPOSITION FOR FORMING WATERPROOF FILM, WATERPROOF FILM, SUBSTRATE WITH WATERPROOF FILM, AND OBJECT
EP3453733A4 (en) POLYIMIDE RESIN, POLYIMIDE RESIN COMPOSITION, AND POLYIMIDE FILM
MY181207A (en) Dicing sheet
SG11201606994XA (en) Polyimide resin, resin composition using same, and laminated film
EA201700136A1 (ru) Полимерная композиция для слоя элемента слоя
EP3109894A4 (en) Handle substrate of composite substrate for semiconductor, and composite substrate for semiconductor
MX2016013836A (es) Materiales de construccion que incluyen una capa de tela no tejida de adhesivo sensible a la presion.
SG11201701032XA (en) Film-like adhesive, semiconductor package using film-like adhesive, and method for producing the same
EA201700142A1 (ru) Полимерная композиция для слоя элемента слоя
EP3187557A4 (en) Adhesive film and semiconductor package using adhesive film
HUE056469T2 (hu) Katódanyag, katód, amely ezt tartalmazza és lítium akkumulátor, amely tartalmazza a katódot
IN2014CH02223A (zh)
MX2017008182A (es) Estructuras fibrosas para restregado.
MX2017006885A (es) Rueda abrasiva de tela no tejida con capa de barrera contra la humedad.
BR112016029789A2 (pt) película de multicamadas com tiras
SG11201607777UA (en) Die-bonding layer formation film, workpiece having die-bonding layer formation film attached thereto, and semiconductor device
EA201991032A1 (ru) Композиция полипропилена
MX2017003634A (es) Envoltura de lamina con propiedades adhesivas.