MY161736A - Bonding capillary - Google Patents

Bonding capillary

Info

Publication number
MY161736A
MY161736A MYPI2013700491A MYPI2013700491A MY161736A MY 161736 A MY161736 A MY 161736A MY PI2013700491 A MYPI2013700491 A MY PI2013700491A MY PI2013700491 A MYPI2013700491 A MY PI2013700491A MY 161736 A MY161736 A MY 161736A
Authority
MY
Malaysia
Prior art keywords
bonding capillary
bonding
aluminum oxide
capillary
wire
Prior art date
Application number
MYPI2013700491A
Other languages
English (en)
Inventor
Motomura Kenichi
Uchimura Takeshi
Onishi Jumpei
Goto Tatsuya
Tabata Kenji
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Publication of MY161736A publication Critical patent/MY161736A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78309—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78321—Material

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Ceramic Products (AREA)
MYPI2013700491A 2013-01-25 2013-03-28 Bonding capillary MY161736A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013012465A JP5376413B1 (ja) 2013-01-25 2013-01-25 ボンディングキャピラリ

Publications (1)

Publication Number Publication Date
MY161736A true MY161736A (en) 2017-05-15

Family

ID=49955002

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013700491A MY161736A (en) 2013-01-25 2013-03-28 Bonding capillary

Country Status (6)

Country Link
JP (1) JP5376413B1 (ja)
KR (3) KR20140095939A (ja)
CN (3) CN108422075A (ja)
MY (1) MY161736A (ja)
PH (1) PH12013000093B1 (ja)
TW (1) TWI466751B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5614603B1 (ja) * 2013-12-03 2014-10-29 Toto株式会社 ボンディングキャピラリ
USD771168S1 (en) 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD753739S1 (en) 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
CN106995308B (zh) * 2017-04-21 2020-05-05 潮州三环（集团）股份有限公司 一种陶瓷劈刀材料及其制备方法
EP3667710B1 (en) 2017-08-09 2022-01-05 NIPPON STEEL Chemical & Material Co., Ltd. Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
CN110497166A (zh) * 2019-08-13 2019-11-26 成都精蓉创科技有限公司 一种用于全自动丝焊机的深腔焊劈刀及其生产工艺
CN110842339B (zh) * 2019-11-12 2023-11-07 苏州三环科技有限公司 一种陶瓷劈刀
CN113862670B (zh) * 2021-09-24 2022-11-01 深圳市盛元半导体有限公司 一种劈刀防粘铝涂层电镀处理系统

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0267741A (ja) * 1988-09-01 1990-03-07 Showa Denko Kk ワイヤボンディング用キャピラリー
JPH0645389A (ja) * 1992-07-21 1994-02-18 Shinagawa Refract Co Ltd ボンディングツール
JP3722606B2 (ja) * 1997-12-25 2005-11-30 京セラ株式会社 耐摩耗性アルミナ焼結体
US7032802B2 (en) * 1999-02-25 2006-04-25 Reiber Steven F Bonding tool with resistance
US7389905B2 (en) * 1999-02-25 2008-06-24 Reiber Steven F Flip chip bonding tool tip
US6497356B2 (en) * 2000-04-28 2002-12-24 Kulicke & Soffa Investments, Inc. Controlled attenuation capillary with planar surface
US6321969B1 (en) * 2000-04-28 2001-11-27 Kulicke & Soffa Investments Efficient energy transfer capillary
US6729527B2 (en) * 2001-01-30 2004-05-04 Kulicke & Soffa Investments, Inc. Bonding tool with polymer coating
JP3566678B2 (ja) 2001-08-28 2004-09-15 京セラ株式会社 ワイヤーボンディング用キャピラリー
JP4269910B2 (ja) * 2003-11-27 2009-05-27 Ｔｏｔｏ株式会社 ボンディングキャピラリー
KR100612611B1 (ko) * 2004-04-09 2006-08-14 비아이 이엠티 주식회사 반도체 조립용 캐필러리의 제조방법
SG133508A1 (en) * 2005-12-06 2007-07-30 Asm Tech Singapore Pte Ltd Capillary for a bonding tool
KR100932636B1 (ko) * 2007-12-26 2009-12-21 비아이 이엠티 주식회사 알루미나 복합체 캐필러리의 제조방법
JP2011097042A (ja) * 2009-09-30 2011-05-12 Toto Ltd ボンディングキャピラリー

Also Published As

Publication number Publication date
CN103962713A (zh) 2014-08-06
KR102006176B1 (ko) 2019-08-01
KR101930305B1 (ko) 2018-12-18
KR20140095939A (ko) 2014-08-04
JP5376413B1 (ja) 2013-12-25
KR20180134806A (ko) 2018-12-19
CN108436251A (zh) 2018-08-24
TW201429600A (zh) 2014-08-01
TWI466751B (zh) 2015-01-01
PH12013000093A1 (en) 2014-11-24
CN108422075A (zh) 2018-08-21
JP2014146622A (ja) 2014-08-14
PH12013000093B1 (en) 2014-11-24
KR20150035924A (ko) 2015-04-07

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