MY160322A - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- MY160322A MY160322A MYPI2011001940A MYPI2011001940A MY160322A MY 160322 A MY160322 A MY 160322A MY PI2011001940 A MYPI2011001940 A MY PI2011001940A MY PI2011001940 A MYPI2011001940 A MY PI2011001940A MY 160322 A MY160322 A MY 160322A
- Authority
- MY
- Malaysia
- Prior art keywords
- acid
- ammonium
- reducing agent
- polishing composition
- polishing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 5
- BDAGIHXWWSANSR-UHFFFAOYSA-N Formic acid Chemical compound OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 abstract 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 abstract 3
- 239000003638 chemical reducing agent Substances 0.000 abstract 3
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 abstract 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 abstract 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 abstract 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 abstract 2
- XZXYQEHISUMZAT-UHFFFAOYSA-N 2-[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenol Chemical compound CC1=CC=C(O)C(CC=2C(=CC=C(C)C=2)O)=C1 XZXYQEHISUMZAT-UHFFFAOYSA-N 0.000 abstract 1
- PQUCIEFHOVEZAU-UHFFFAOYSA-N Diammonium sulfite Chemical compound [NH4+].[NH4+].[O-]S([O-])=O PQUCIEFHOVEZAU-UHFFFAOYSA-N 0.000 abstract 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract 1
- 239000002211 L-ascorbic acid Substances 0.000 abstract 1
- 235000000069 L-ascorbic acid Nutrition 0.000 abstract 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 abstract 1
- 239000004280 Sodium formate Substances 0.000 abstract 1
- GJYJYFHBOBUTBY-UHFFFAOYSA-N alpha-camphorene Chemical compound CC(C)=CCCC(=C)C1CCC(CCC=C(C)C)=CC1 GJYJYFHBOBUTBY-UHFFFAOYSA-N 0.000 abstract 1
- VZTDIZULWFCMLS-UHFFFAOYSA-N ammonium formate Chemical compound [NH4+].[O-]C=O VZTDIZULWFCMLS-UHFFFAOYSA-N 0.000 abstract 1
- 229940107816 ammonium iodide Drugs 0.000 abstract 1
- VBIXEXWLHSRNKB-UHFFFAOYSA-N ammonium oxalate Chemical compound [NH4+].[NH4+].[O-]C(=O)C([O-])=O VBIXEXWLHSRNKB-UHFFFAOYSA-N 0.000 abstract 1
- 229960005070 ascorbic acid Drugs 0.000 abstract 1
- 235000019253 formic acid Nutrition 0.000 abstract 1
- 229940074391 gallic acid Drugs 0.000 abstract 1
- 235000004515 gallic acid Nutrition 0.000 abstract 1
- 235000006408 oxalic acid Nutrition 0.000 abstract 1
- 239000007800 oxidant agent Substances 0.000 abstract 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 abstract 1
- 229940079877 pyrogallol Drugs 0.000 abstract 1
- 229910052708 sodium Inorganic materials 0.000 abstract 1
- 239000011734 sodium Substances 0.000 abstract 1
- HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 abstract 1
- 235000019254 sodium formate Nutrition 0.000 abstract 1
- 235000010265 sodium sulphite Nutrition 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003191307A JP4202201B2 (ja) | 2003-07-03 | 2003-07-03 | 研磨用組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY160322A true MY160322A (en) | 2017-02-28 |
Family
ID=32844734
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20042628A MY144568A (en) | 2003-07-03 | 2004-07-01 | Polishing composition |
| MYPI2011001940A MY160322A (en) | 2003-07-03 | 2004-07-01 | Polishing composition |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20042628A MY144568A (en) | 2003-07-03 | 2004-07-01 | Polishing composition |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4202201B2 (ja) |
| CN (1) | CN1576339B (ja) |
| GB (1) | GB2403954B (ja) |
| MY (2) | MY144568A (ja) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8025808B2 (en) | 2003-04-25 | 2011-09-27 | Saint-Gobain Ceramics & Plastics, Inc. | Methods for machine ceramics |
| US7776230B2 (en) * | 2006-08-30 | 2010-08-17 | Cabot Microelectronics Corporation | CMP system utilizing halogen adduct |
| WO2008079704A2 (en) * | 2006-12-20 | 2008-07-03 | Saint-Gobain Ceramics & Plastics, Inc. | Methods for machining inorganic, non-metallic workpieces |
| JP4614981B2 (ja) * | 2007-03-22 | 2011-01-19 | Ｊｓｒ株式会社 | 化学機械研磨用水系分散体および半導体装置の化学機械研磨方法 |
| US20100243950A1 (en) * | 2008-06-11 | 2010-09-30 | Harada Daijitsu | Polishing agent for synthetic quartz glass substrate |
| US8226841B2 (en) * | 2009-02-03 | 2012-07-24 | Cabot Microelectronics Corporation | Polishing composition for nickel-phosphorous memory disks |
| CN101955732B (zh) * | 2009-07-13 | 2016-06-15 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| CN102516887B (zh) * | 2011-11-24 | 2014-01-08 | 珠海承鸥卫浴用品有限公司 | 抛光液与等离子抛光工艺 |
| CN102746795B (zh) * | 2012-06-18 | 2013-12-18 | 工业和信息化部电子第五研究所华东分所 | 一种印制电路金相切片用抛光液及其制备方法 |
| CN103102811B (zh) * | 2013-01-18 | 2014-07-09 | 上海森博新材料科技有限公司 | 机械研磨液及采用该研磨液的金属表面处理方法 |
| JP2014101518A (ja) * | 2014-01-06 | 2014-06-05 | Fujimi Inc | 研磨用組成物、研磨方法、及び研磨パッドの弾力性低下抑制方法 |
| KR101943704B1 (ko) * | 2016-06-27 | 2019-01-29 | 삼성에스디아이 주식회사 | 금속막용 cmp 슬러리 조성물 및 연마 방법 |
| GB2562776A (en) * | 2017-05-25 | 2018-11-28 | Weatherford Uk Ltd | Pressure integrity testing of one-trip completion assembly |
| CN110629227A (zh) * | 2019-08-14 | 2019-12-31 | 沈阳造币有限公司 | 一种造币铜合金坯饼电解质等离子抛光液及抛光工艺 |
| CN111574927A (zh) * | 2020-06-22 | 2020-08-25 | 宁波日晟新材料有限公司 | 一种含还原剂的碳化硅抛光液及其制备方法和应用 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY124578A (en) * | 1997-06-17 | 2006-06-30 | Showa Denko Kk | Magnetic hard disc substrate and process for manufacturing the same |
| TW486514B (en) * | 1999-06-16 | 2002-05-11 | Eternal Chemical Co Ltd | Chemical mechanical abrasive composition for use in semiconductor processing |
| CN1288927A (zh) * | 1999-09-21 | 2001-03-28 | 长兴化学工业股份有限公司 | 化学机械研磨组合物 |
| US6258140B1 (en) * | 1999-09-27 | 2001-07-10 | Fujimi America Inc. | Polishing composition |
| JP4238951B2 (ja) * | 1999-09-28 | 2009-03-18 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびそれを用いたメモリーハードディスクの製造方法 |
| US6471884B1 (en) * | 2000-04-04 | 2002-10-29 | Cabot Microelectronics Corporation | Method for polishing a memory or rigid disk with an amino acid-containing composition |
| TW528645B (en) * | 2000-04-17 | 2003-04-21 | Showa Denko Kk | Composition for polishing magnetic disk substrate |
| US6569215B2 (en) * | 2000-04-17 | 2003-05-27 | Showa Denko Kabushiki Kaisha | Composition for polishing magnetic disk substrate |
| US6976905B1 (en) * | 2000-06-16 | 2005-12-20 | Cabot Microelectronics Corporation | Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system |
| JP2002198331A (ja) * | 2000-12-26 | 2002-07-12 | Jsr Corp | 研磨方法 |
| JP4231632B2 (ja) * | 2001-04-27 | 2009-03-04 | 花王株式会社 | 研磨液組成物 |
| JP4462599B2 (ja) * | 2001-08-21 | 2010-05-12 | 花王株式会社 | 研磨液組成物 |
| US20050028449A1 (en) * | 2001-09-03 | 2005-02-10 | Norihiko Miyata | Polishing composition |
| JP4074126B2 (ja) * | 2001-09-03 | 2008-04-09 | 昭和電工株式会社 | 研磨用組成物 |
| JP3680022B2 (ja) * | 2001-12-07 | 2005-08-10 | 東洋鋼鈑株式会社 | 磁気ディスク基板研磨液 |
| US6755721B2 (en) * | 2002-02-22 | 2004-06-29 | Saint-Gobain Ceramics And Plastics, Inc. | Chemical mechanical polishing of nickel phosphorous alloys |
| JP2003286477A (ja) * | 2002-03-28 | 2003-10-10 | Sumitomo Bakelite Co Ltd | 研磨用組成物並びに研磨方法 |
| JP2004175904A (ja) * | 2002-11-27 | 2004-06-24 | Sumitomo Bakelite Co Ltd | 研磨用組成物 |
| JP3997152B2 (ja) * | 2002-12-26 | 2007-10-24 | 花王株式会社 | 研磨液組成物 |
| TWI254741B (en) * | 2003-02-05 | 2006-05-11 | Kao Corp | Polishing composition |
| JP4202172B2 (ja) * | 2003-03-31 | 2008-12-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
-
2003
- 2003-07-03 JP JP2003191307A patent/JP4202201B2/ja not_active Expired - Lifetime
-
2004
- 2004-06-30 GB GB0414656A patent/GB2403954B/en not_active Expired - Fee Related
- 2004-07-01 MY MYPI20042628A patent/MY144568A/en unknown
- 2004-07-01 MY MYPI2011001940A patent/MY160322A/en unknown
- 2004-07-02 CN CN2004100628680A patent/CN1576339B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| MY144568A (en) | 2011-10-14 |
| JP2005023228A (ja) | 2005-01-27 |
| GB2403954B (en) | 2008-01-02 |
| CN1576339A (zh) | 2005-02-09 |
| GB0414656D0 (en) | 2004-08-04 |
| JP4202201B2 (ja) | 2008-12-24 |
| GB2403954A (en) | 2005-01-19 |
| CN1576339B (zh) | 2012-03-28 |
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