MY152137A - Epoxy resin composition for encapsulating semiconductor chip and semiconductor device - Google Patents

Epoxy resin composition for encapsulating semiconductor chip and semiconductor device

Info

Publication number
MY152137A
MY152137A MYPI20060367A MY152137A MY 152137 A MY152137 A MY 152137A MY PI20060367 A MYPI20060367 A MY PI20060367A MY 152137 A MY152137 A MY 152137A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
resin composition
encapsulating
improved
semiconductor chip
Prior art date
Application number
Inventor
Norihisa Hoshika
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of MY152137A publication Critical patent/MY152137A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

THE PRESENT INVENTION PROVIDES AN EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR CHIP HAVING AN IMPROVED FLOWABILITY, AN IMPROVED SEQUENTIAL MOLDABILITY AND THE LIKE, AND ADDITIONALLY HAVING IMPROVED CHARACTERISTICS OF A CURED PRODUCT THEREOF, SUCH AS AN IMPROVED MOLD-RELEASEABILITY, AN IMPROVED RESISTANCE TO REFLOW SOLDERING HEAT AND THE LIKE, AND A SEMICONDUCTOR DEVICE THAT IS FORMED BY ENCAPSULATING A SEMICONDUCTOR CHIP WITH THE EPOXY RESIN COMPOSITION. AN EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR CHIP ACCORDING TO THE PRESENT INVENTION CONTAINS ESSENTIAL COMPONENTS OF: (A) AN EPOXY RESIN, (B) A PHENOLIC RESIN, (C) A CURE ACCELERATOR, (D) AN INORGANIC FILLER, (E) A MOLD RELEASING AGENT, (F) A SILANE COUPLING AGENT AND (G) A CHEMICAL COMPOUND HAVING AROMATIC RING THAT HAS HYDROXYL GROUPS, EACH OF WHICH IS BOUND TO RESPECTIVE TWO OR MORE ADJACENT CARBON ATOMS THAT COMPOSES THE AROMATIC RING. AT LEAST ONE OF SAID (A) EPOXY RESIN AND SAID (B) PHENOLIC RESIN CONTAINS RESIN OF NOVOLAC STRUCTURE, IN WHICH BIPHENYLENE SKELETON IS INCLUDED IN ITS MAIN CHAIN, AND SAID (E) MOLD RELEASING AGENT INCLUDES ONE OR MORE CHEMICAL COMPOUND(S) SELECTED FROM A GROUP CONSISTING OF (E1) OXIDIZED POLYETHYLENE WAX, (E2) GLYCERIN TRI-FATTY ACID ESTER AND (E3) OXIDIZED PARAFFIN WAX, AND FURTHER, SAID (E) MOLD RELEASING AGENT IS CONTAINED IN THE AMOUNT OF 0.01 WT% 1 WT% BOTH INCLUSIVE, AND SAID (G) CHEMICAL COMPOUND IS CONTAINED IN THE AMOUND OF 0.01 WT% BOTH INCLUSIVE, IN THE TOTAL EPOXY RESIN COMPOSITION.
MYPI20060367 2005-01-28 2006-01-26 Epoxy resin composition for encapsulating semiconductor chip and semiconductor device MY152137A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005021016 2005-01-28
JP2005021015 2005-01-28

Publications (1)

Publication Number Publication Date
MY152137A true MY152137A (en) 2014-08-15

Family

ID=36740328

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20060367 MY152137A (en) 2005-01-28 2006-01-26 Epoxy resin composition for encapsulating semiconductor chip and semiconductor device

Country Status (6)

Country Link
JP (2) JP5205964B2 (en)
KR (1) KR101090608B1 (en)
MY (1) MY152137A (en)
SG (2) SG158093A1 (en)
TW (2) TW200634089A (en)
WO (1) WO2006080297A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5141132B2 (en) * 2006-08-31 2013-02-13 住友ベークライト株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device
JP2008063371A (en) * 2006-09-05 2008-03-21 Sumitomo Bakelite Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device
JP5332097B2 (en) * 2006-10-31 2013-11-06 住友ベークライト株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device
WO2009154058A1 (en) * 2008-06-20 2009-12-23 出光興産株式会社 Epoxy resin molding material for semiconductor sealing purposes, epoxy resin sheet for semiconductor sealing purposes, and method for the production thereof
JP5488394B2 (en) * 2009-11-16 2014-05-14 住友ベークライト株式会社 Semiconductor sealing resin composition and semiconductor device
JP5868573B2 (en) * 2010-03-02 2016-02-24 住友ベークライト株式会社 Semiconductor sealing resin composition and semiconductor device
JP5651968B2 (en) * 2010-03-02 2015-01-14 住友ベークライト株式会社 Semiconductor sealing resin composition and semiconductor device
JP5547680B2 (en) * 2011-03-23 2014-07-16 パナソニック株式会社 Epoxy resin composition for sealing and semiconductor device
JP5799694B2 (en) 2011-09-12 2015-10-28 日立化成株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
CN105358623B (en) * 2013-07-03 2017-09-22 住友电木株式会社 Phenolic resin moulding material

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000273285A (en) * 1999-03-24 2000-10-03 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP5008222B2 (en) * 2001-01-26 2012-08-22 住友ベークライト株式会社 Epoxy resin composition and semiconductor device
JP2002322347A (en) * 2001-04-26 2002-11-08 Toray Ind Inc Epoxy resin composition for sealing semiconductor and semiconductor device
JP2003128759A (en) 2001-10-23 2003-05-08 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
US7157313B2 (en) * 2003-01-17 2007-01-02 Sumitomo Bakelite Co., Ltd. Epoxy resin composition and semiconductor device using thereof
KR100697937B1 (en) * 2003-03-11 2007-03-20 스미토모 베이클라이트 가부시키가이샤 Resin composition for encapsulating semiconductor chip and semiconductor device therewith
JP4569137B2 (en) * 2003-03-17 2010-10-27 住友ベークライト株式会社 Semiconductor sealing resin composition and semiconductor device
JP4250987B2 (en) * 2003-03-25 2009-04-08 住友ベークライト株式会社 Epoxy resin composition and semiconductor device
KR100697938B1 (en) * 2003-03-25 2007-03-20 스미토모 베이클라이트 가부시키가이샤 Resin composition for sealing semiconductor and semiconductor device using the same

Also Published As

Publication number Publication date
JP5205964B2 (en) 2013-06-05
TW201245321A (en) 2012-11-16
JP5605394B2 (en) 2014-10-15
TW200634089A (en) 2006-10-01
KR101090608B1 (en) 2011-12-08
TWI503369B (en) 2015-10-11
JP2012162744A (en) 2012-08-30
WO2006080297A1 (en) 2006-08-03
JPWO2006080297A1 (en) 2008-06-19
KR20070104627A (en) 2007-10-26
SG158093A1 (en) 2010-01-29
SG191630A1 (en) 2013-07-31

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