MY148226A - Photosensitive resin composition, insulating film, protective film, and electronic equipment - Google Patents

Photosensitive resin composition, insulating film, protective film, and electronic equipment

Info

Publication number
MY148226A
MY148226A MYPI20091337A MYPI20091337A MY148226A MY 148226 A MY148226 A MY 148226A MY PI20091337 A MYPI20091337 A MY PI20091337A MY PI20091337 A MYPI20091337 A MY PI20091337A MY 148226 A MY148226 A MY 148226A
Authority
MY
Malaysia
Prior art keywords
resin composition
photosensitive resin
insulating film
present
protective film
Prior art date
Application number
MYPI20091337A
Inventor
Toyoda Hideyuki
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of MY148226A publication Critical patent/MY148226A/en

Links

Classifications

    • H10P14/683—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • H10P14/6342—
    • H10P95/08—
    • H10W20/071—
    • H10W20/093—
    • H10W74/137—
    • H10W72/20—
    • H10W72/9223—
    • H10W72/923—
    • H10W72/9415—
    • H10W72/942—
    • H10W72/952—
    • H10W74/129—

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Formation Of Insulating Films (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

THE PHOTOSENSITIVE RESIN COMPOSITION OF THE PRESENT INVENTION INCLUDES AN ALKALI SOLUBILITY RESIN INCLUDING MOLECULES EACH COMPOSED OF A MAIN CHAIN HAVING ONE END AND THE OTHER END OPPOSITE TO THE ONE END, AN ORGANIC GROUP BONDED TO THE ONE END THEREOF, THE ORGANIC GROUP HAVING AT LEAST ONE UNSATURATED GROUP, AND A SUBSTITUENT GROUP BONDED TO AT LEAST ONE OF THE OTHER END OF THE MAIN CHAIN AND A BRANCH THEREOF, THE SUBSTITUENT GROUP HAVING A CYCLIC CHEMICAL STRUCTURE CONTAINING NITROGEN ATOMS, AND A PHOTOSENSITIVE AGENT. FURTHER, THE INSULATING FILM OF THE PRESENT INVENTION IS COMPOSED OF A CURED PRODUCT OF THE ABOVE PHOTOSENSITIVE RESIN COMPOSITION. FURTHERMORE, THE PROTECTIVE FILM OF THE PRESENT INVENTION IS COMPOSED OF A CURED PRODUCT OF THE ABOVE PHOTOSENSI TIVE RESIN COMPOSI TION. MOREOVER, THE ELECTRONIC EQUIPMENT OF THE PRESENT INVENTION IS PROVIDED WITH THE ABOVE PROTECTIVE FILM AND INSULATING FILM.
MYPI20091337A 2006-11-15 2007-11-13 Photosensitive resin composition, insulating film, protective film, and electronic equipment MY148226A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006309287 2006-11-15

Publications (1)

Publication Number Publication Date
MY148226A true MY148226A (en) 2013-03-29

Family

ID=39401616

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20091337A MY148226A (en) 2006-11-15 2007-11-13 Photosensitive resin composition, insulating film, protective film, and electronic equipment

Country Status (9)

Country Link
US (1) US8604113B2 (en)
EP (1) EP2083326B1 (en)
JP (1) JP4893748B2 (en)
KR (1) KR101067056B1 (en)
CN (1) CN101529332B (en)
AT (1) ATE541241T1 (en)
MY (1) MY148226A (en)
TW (1) TWI408497B (en)
WO (1) WO2008059808A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5035094B2 (en) * 2007-08-29 2012-09-26 住友ベークライト株式会社 Photosensitive resin composition, insulating film, protective film and electronic device
JP5169167B2 (en) * 2007-09-06 2013-03-27 住友ベークライト株式会社 Polyamide resin, positive photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device using the same
JP5169169B2 (en) * 2007-11-22 2013-03-27 住友ベークライト株式会社 Polyamide resin, positive photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device using the same
TWI557501B (en) * 2014-12-22 2016-11-11 奇美實業股份有限公司 Photosensitive polysiloxane composition, protecting film, and element having the protecting film
US10388541B2 (en) * 2015-04-20 2019-08-20 Xintec Inc. Wafer coating system and method of manufacturing chip package
KR102127033B1 (en) * 2016-04-26 2020-06-25 주식회사 엘지화학 Negative type photosensitive resin composition and organic light emitting device black matrix comprising the same
JP7056320B2 (en) * 2018-03-30 2022-04-19 住友ベークライト株式会社 Photosensitive resin composition, resin film and electronic device
JP7091881B2 (en) * 2018-06-29 2022-06-28 Ｈｄマイクロシステムズ株式会社 Resin composition, method of manufacturing cured product, cured product, interlayer insulating film, cover coat layer, surface protective film and electronic components
JP7154184B2 (en) * 2019-04-15 2022-10-17 信越化学工業株式会社 Positive type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component
KR20230146065A (en) 2021-03-16 2023-10-18 후지필름 가부시키가이샤 Resin composition, cured product, laminate, method for producing cured product, and semiconductor device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2160293A (en) * 1936-12-05 1939-05-30 Standard Oil Co Lubricant
JP3141145B2 (en) * 1992-12-18 2001-03-05 大塚化学株式会社 anti-rust
JP3679207B2 (en) * 1996-09-12 2005-08-03 富士写真フイルム株式会社 Silver halide photographic material
US6160081A (en) * 1997-10-31 2000-12-12 Nippon Zeon Co., Ltd. Photosensitive polyimide resin composition
TW538138B (en) * 2000-04-27 2003-06-21 Otsuka Kagaku Kk Process for treating and producing the parts made of magnesium and/or magnesium alloy
JP4206709B2 (en) * 2002-08-12 2009-01-14 住友ベークライト株式会社 Positive photosensitive resin composition and semiconductor device
JP4292765B2 (en) * 2002-08-22 2009-07-08 東レ株式会社 Positive photosensitive resin precursor composition, electronic component for semiconductor using the same, and display device for organic electroluminescent element
US7202019B2 (en) * 2002-10-25 2007-04-10 Konica Minolta Holdings, Inc. Photothermographic imaging material
EP2381308B1 (en) * 2003-06-23 2015-07-29 Sumitomo Bakelite Co., Ltd. Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
JP2005173528A (en) 2003-11-19 2005-06-30 Hitachi Chemical Dupont Microsystems Ltd Positive photosensitive resin composition, method for producing relief pattern and electronic component
JP2005336125A (en) 2004-05-28 2005-12-08 Toray Ind Inc Photo acid generator and actinic ray-sensitive polymer composition using the same
JP4543923B2 (en) * 2004-12-28 2010-09-15 住友ベークライト株式会社 Positive photosensitive resin composition and semiconductor device and display element using the same
JP2006309202A (en) * 2005-03-29 2006-11-09 Toray Ind Inc Photosensitive resin composition and semiconductor device using the same
JPWO2008020469A1 (en) * 2006-08-14 2010-01-07 日立化成デュポンマイクロシステムズ株式会社 Positive photosensitive resin composition, pattern manufacturing method, and electronic component

Also Published As

Publication number Publication date
KR101067056B1 (en) 2011-09-22
US20100076156A1 (en) 2010-03-25
WO2008059808A1 (en) 2008-05-22
ATE541241T1 (en) 2012-01-15
TWI408497B (en) 2013-09-11
JP4893748B2 (en) 2012-03-07
CN101529332A (en) 2009-09-09
CN101529332B (en) 2012-12-12
KR20090075841A (en) 2009-07-09
JPWO2008059808A1 (en) 2010-03-04
EP2083326A4 (en) 2009-12-02
EP2083326B1 (en) 2012-01-11
US8604113B2 (en) 2013-12-10
EP2083326A1 (en) 2009-07-29
TW200834235A (en) 2008-08-16

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