MY141022A - Compositions for the electroless deposition of ternary materials for the semiconductor industry - Google Patents
Compositions for the electroless deposition of ternary materials for the semiconductor industryInfo
- Publication number
- MY141022A MY141022A MYPI20041657A MY141022A MY 141022 A MY141022 A MY 141022A MY PI20041657 A MYPI20041657 A MY PI20041657A MY 141022 A MY141022 A MY 141022A
- Authority
- MY
- Malaysia
- Prior art keywords
- compositions
- semiconductor industry
- electroless deposition
- ternary materials
- deposited
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 230000008021 deposition Effects 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229910001092 metal group alloy Inorganic materials 0.000 abstract 2
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
- H01L21/76849—Barrier, adhesion or liner layers formed in openings in a dielectric the layer being positioned on top of the main fill metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
- H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10321113 | 2003-05-09 | ||
DE10347809A DE10347809A1 (de) | 2003-05-09 | 2003-10-10 | Zusammensetzungen zur stromlosen Abscheidung ternärer Materialien für die Halbleiterindustrie |
Publications (1)
Publication Number | Publication Date |
---|---|
MY141022A true MY141022A (en) | 2010-02-25 |
Family
ID=33394463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20041657 MY141022A (en) | 2003-05-09 | 2004-05-05 | Compositions for the electroless deposition of ternary materials for the semiconductor industry |
Country Status (4)
Country | Link |
---|---|
CN (1) | CN1784507B (zh) |
DE (1) | DE10347809A1 (zh) |
MY (1) | MY141022A (zh) |
TW (1) | TWI342591B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101889333B (zh) * | 2007-12-17 | 2012-08-08 | 日矿金属株式会社 | 基板和其制造方法 |
US20100310775A1 (en) | 2009-06-09 | 2010-12-09 | International Business Machines Corporation | Spalling for a Semiconductor Substrate |
TWI550643B (zh) * | 2012-03-30 | 2016-09-21 | Taiyo Holdings Co Ltd | Conductive paste and conductive circuit |
CN102925861A (zh) * | 2012-11-20 | 2013-02-13 | 大连理工大学 | 具有高导电性和高热稳定性的Cu-Ni-Sn合金薄膜及其制备工艺 |
SG11201610662QA (en) | 2014-07-25 | 2017-01-27 | Intel Corp | Tungsten alloys in semiconductor devices |
CN104328392A (zh) * | 2014-10-30 | 2015-02-04 | 广东电网有限责任公司电力科学研究院 | 一种基于低温镀液的涂布式化学镀方法 |
CN107104076B (zh) * | 2016-09-18 | 2019-02-05 | 云南大学 | 一种化学镀制备ULSI-Cu布线扩散阻挡层NiCoB薄膜的方法 |
CN113026005B (zh) * | 2021-03-04 | 2022-02-01 | 珠海市创智成功科技有限公司 | 一种应用在柔性线路板化学镀镍钯金镀层的化学镀溶液及工艺 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001355074A (ja) * | 2000-04-10 | 2001-12-25 | Sony Corp | 無電解メッキ処理方法およびその装置 |
US6528409B1 (en) * | 2002-04-29 | 2003-03-04 | Advanced Micro Devices, Inc. | Interconnect structure formed in porous dielectric material with minimized degradation and electromigration |
-
2003
- 2003-10-10 DE DE10347809A patent/DE10347809A1/de not_active Withdrawn
-
2004
- 2004-04-22 CN CN200480012649.XA patent/CN1784507B/zh not_active Expired - Fee Related
- 2004-05-05 MY MYPI20041657 patent/MY141022A/en unknown
- 2004-05-05 TW TW93112665A patent/TWI342591B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1784507B (zh) | 2010-04-28 |
TWI342591B (en) | 2011-05-21 |
DE10347809A1 (de) | 2004-11-25 |
TW200512833A (en) | 2005-04-01 |
CN1784507A (zh) | 2006-06-07 |
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