MY130885A - Method for storing carrier for polishing wafer - Google Patents
Method for storing carrier for polishing waferInfo
- Publication number
- MY130885A MY130885A MYPI99005694A MYPI9905694A MY130885A MY 130885 A MY130885 A MY 130885A MY PI99005694 A MYPI99005694 A MY PI99005694A MY PI9905694 A MYPI9905694 A MY PI9905694A MY 130885 A MY130885 A MY 130885A
- Authority
- MY
- Malaysia
- Prior art keywords
- carrier
- polishing wafer
- polishing
- storing carrier
- silicon wafer
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000005498 polishing Methods 0.000 title abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 3
- 229910052710 silicon Inorganic materials 0.000 abstract 3
- 239000010703 silicon Substances 0.000 abstract 3
- 239000007788 liquid Substances 0.000 abstract 2
- 239000008367 deionised water Substances 0.000 abstract 1
- 229910021641 deionized water Inorganic materials 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Prevention Of Fouling (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36687398A JP2000190208A (ja) | 1998-12-24 | 1998-12-24 | 研磨用キャリアーの保管方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY130885A true MY130885A (en) | 2007-07-31 |
Family
ID=18487905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI99005694A MY130885A (en) | 1998-12-24 | 1999-12-23 | Method for storing carrier for polishing wafer |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1142003A1 (ja) |
| JP (1) | JP2000190208A (ja) |
| KR (1) | KR20010080964A (ja) |
| CN (1) | CN1331838A (ja) |
| MY (1) | MY130885A (ja) |
| TW (1) | TW439137B (ja) |
| WO (1) | WO2000039841A1 (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10060697B4 (de) | 2000-12-07 | 2005-10-06 | Siltronic Ag | Doppelseiten-Polierverfahren mit reduzierter Kratzerrate und Vorrichtung zur Durchführung des Verfahrens |
| CN101797717B (zh) * | 2009-02-10 | 2011-12-07 | 和舰科技(苏州)有限公司 | 侦测化学机械研磨机台水槽上/下位置的装置及方法 |
| JP6977657B2 (ja) * | 2018-05-08 | 2021-12-08 | 信越半導体株式会社 | 両面研磨装置用キャリアの保管方法及びウェーハの両面研磨方法 |
| JP7349352B2 (ja) * | 2019-12-27 | 2023-09-22 | グローバルウェーハズ・ジャパン株式会社 | シリコンウェーハの研磨方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06226618A (ja) * | 1993-01-27 | 1994-08-16 | Hitachi Cable Ltd | 半導体ウエハの研磨方法 |
| US5520205A (en) * | 1994-07-01 | 1996-05-28 | Texas Instruments Incorporated | Apparatus for wafer cleaning with rotation |
| JP2832171B2 (ja) * | 1995-04-28 | 1998-12-02 | 信越半導体株式会社 | 半導体基板の洗浄装置および洗浄方法 |
| US6045624A (en) * | 1996-09-27 | 2000-04-04 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
-
1998
- 1998-12-24 JP JP36687398A patent/JP2000190208A/ja not_active Withdrawn
-
1999
- 1999-12-08 KR KR1020017005828A patent/KR20010080964A/ko not_active Application Discontinuation
- 1999-12-08 EP EP99964166A patent/EP1142003A1/en not_active Withdrawn
- 1999-12-08 CN CN99814852A patent/CN1331838A/zh active Pending
- 1999-12-08 WO PCT/US1999/029078 patent/WO2000039841A1/en not_active Application Discontinuation
- 1999-12-23 MY MYPI99005694A patent/MY130885A/en unknown
- 1999-12-24 TW TW088122945A patent/TW439137B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20010080964A (ko) | 2001-08-25 |
| EP1142003A1 (en) | 2001-10-10 |
| JP2000190208A (ja) | 2000-07-11 |
| CN1331838A (zh) | 2002-01-16 |
| TW439137B (en) | 2001-06-07 |
| WO2000039841A1 (en) | 2000-07-06 |
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