MY126628A - Gold alloy thin wire and gold alloy bump - Google Patents

Gold alloy thin wire and gold alloy bump

Info

Publication number
MY126628A
MY126628A MYPI96001016A MYPI19961016A MY126628A MY 126628 A MY126628 A MY 126628A MY PI96001016 A MYPI96001016 A MY PI96001016A MY PI19961016 A MYPI19961016 A MY PI19961016A MY 126628 A MY126628 A MY 126628A
Authority
MY
Malaysia
Prior art keywords
gold alloy
thin wire
ppm
weight
alloy thin
Prior art date
Application number
MYPI96001016A
Other languages
English (en)
Inventor
Uno Tomohiro
Tatsumi Kohei
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Publication of MY126628A publication Critical patent/MY126628A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • H—ELECTRICITY
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D10/00—Modifying the physical properties by methods other than heat treatment or deformation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
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    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13144—Gold [Au] as principal constituent
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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    • H01L2224/43—Manufacturing methods
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Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
MYPI96001016A 1995-03-24 1996-03-20 Gold alloy thin wire and gold alloy bump MY126628A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06659195A JP3571793B2 (ja) 1995-03-24 1995-03-24 金合金細線および金合金バンプ

Publications (1)

Publication Number Publication Date
MY126628A true MY126628A (en) 2006-10-31

Family

ID=13320337

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI96001016A MY126628A (en) 1995-03-24 1996-03-20 Gold alloy thin wire and gold alloy bump

Country Status (5)

Country Link
JP (1) JP3571793B2 (ko)
KR (1) KR0185194B1 (ko)
MY (1) MY126628A (ko)
SG (1) SG52603A1 (ko)
TW (1) TW379254B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030096985A (ko) * 2002-06-18 2003-12-31 헤라우스오리엔탈하이텍 주식회사 본딩용 금합금 세선

Also Published As

Publication number Publication date
JPH08264544A (ja) 1996-10-11
SG52603A1 (en) 1998-09-28
KR960034441A (ko) 1996-10-22
TW379254B (en) 2000-01-11
KR0185194B1 (ko) 1999-04-01
JP3571793B2 (ja) 2004-09-29

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