MY124505A - Copper bath and method of depositing a matt copper coating - Google Patents

Copper bath and method of depositing a matt copper coating

Info

Publication number
MY124505A
MY124505A MYPI20014834A MYPI20014834A MY124505A MY 124505 A MY124505 A MY 124505A MY PI20014834 A MYPI20014834 A MY PI20014834A MY PI20014834 A MYPI20014834 A MY PI20014834A MY 124505 A MY124505 A MY 124505A
Authority
MY
Malaysia
Prior art keywords
copper
matt
bath
layers
poly
Prior art date
Application number
MYPI20014834A
Other languages
English (en)
Inventor
Gonzalo Urrutia Desmaison Dr
Kretschmer Stefan
Senge Gerd
Ross Thorsten
Kussner Torsten
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of MY124505A publication Critical patent/MY124505A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Laminated Bodies (AREA)
MYPI20014834A 2000-10-19 2001-10-17 Copper bath and method of depositing a matt copper coating MY124505A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10052987 2000-10-19
DE10058896A DE10058896C1 (de) 2000-10-19 2000-11-22 Elektrolytisches Kupferbad, dessen Verwendung und Verfahren zur Abscheidung einer matten Kupferschicht

Publications (1)

Publication Number Publication Date
MY124505A true MY124505A (en) 2006-06-30

Family

ID=7661064

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20014834A MY124505A (en) 2000-10-19 2001-10-17 Copper bath and method of depositing a matt copper coating

Country Status (2)

Country Link
DE (2) DE10058896C1 (de)
MY (1) MY124505A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119221051A (zh) * 2023-06-30 2024-12-31 华为技术有限公司 组合物及其应用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4928571B1 (de) * 1969-11-05 1974-07-27
US3682788A (en) * 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating
US3945894A (en) * 1975-04-11 1976-03-23 Oxy Metal Industries Corporation Bath composition and method of electrodepositing utilizing the same
DE2527701C3 (de) * 1975-06-21 1978-03-30 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Jodophor-Lösung (B)
US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
DE3483078D1 (de) * 1983-09-28 1990-10-04 Blasberg Oberflaechentech Saures galvanisches kupferbad und verfahren zu seiner herstellung.
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
US4781801A (en) * 1987-02-03 1988-11-01 Mcgean-Rohco, Inc. Method of copper plating gravure rolls
DE3836521C2 (de) * 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades
DE4126502C1 (de) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths

Also Published As

Publication number Publication date
DE60103426D1 (de) 2004-06-24
DE60103426T2 (de) 2005-06-09
DE10058896C1 (de) 2002-06-13

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