MY119737A - Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms - Google Patents

Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms

Info

Publication number
MY119737A
MY119737A MYPI98004835A MYPI9804835A MY119737A MY 119737 A MY119737 A MY 119737A MY PI98004835 A MYPI98004835 A MY PI98004835A MY PI9804835 A MYPI9804835 A MY PI9804835A MY 119737 A MY119737 A MY 119737A
Authority
MY
Malaysia
Prior art keywords
thermal
dynamics
peltier
sub
heat transfer
Prior art date
Application number
MYPI98004835A
Inventor
Uttam Shyamalindu Ghoshal
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of MY119737A publication Critical patent/MY119737A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006—Thermal coupling structure or interface
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0212—Control thereof of electric power, current or voltage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/15—Microelectro-mechanical devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Control Of Temperature (AREA)

Abstract

APPARATUS AND METHOD FOR SUB-AMBIENT COOLING USING THERMOELECTRIC ELEMENT DYNAMICS IN CONJUNCTION WITH PULSED ELECTRICAL POWER AND MULTIPLE SELECTIVELY ENABLED THERMAL SWITCHES (7,8,23,24). IN ONE FORM, PELTIER DEVICES (1) ARE DYNAMICALLY ENABLED USING PULSES OF ELECTRICAL POWER WHILE THE THERMAL PATHS, BETWEEN THE COLD AND HOT SIDES (12,11) OF THE DEVICE (1) ARE SELECTIVELY SWITCHED CONDUCTION STATE RESPONSIVE TO THE TEMPERATURE DYNAMICS WITHIN THE PELTIER DEVICE (1). SWITCHED COUPLING OF THE THERMAL CONNECTIONS IN RELATIVE SYNCHRONISM TO THE PELTIER DEVICE ELECTRICAL AND THERMAL DYNAMICS MATERIALLY IMPROVES EFFICIENCY BY DECOUPLING JOULE HEATING AND CONDUCTIVE HEAT TRANSFER LOSSES OTHERWISE AFFECTING THE NET HEAT TRANSFER. PREFERABLE IMPLEMENTATIONS UTILIZES MEMS TO ACCOMPLISH THE SELECTIVE SWITCHING, WHEREBY SUB-AMBIENT COOLING CAPACITY IS INCREASED BY PARALLEL OPERATION OF MULTIPLE PELTIER DEVICES (21) AND MEMS SWITCHES (23,24).
MYPI98004835A 1997-12-10 1998-10-23 Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms MY119737A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/988,429 US5867990A (en) 1997-12-10 1997-12-10 Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms

Publications (1)

Publication Number Publication Date
MY119737A true MY119737A (en) 2005-07-29

Family

ID=25534107

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI98004835A MY119737A (en) 1997-12-10 1998-10-23 Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms

Country Status (8)

Country Link
US (1) US5867990A (en)
EP (1) EP0922915A3 (en)
JP (1) JP3117430B2 (en)
KR (1) KR100313352B1 (en)
CN (1) CN1110666C (en)
MY (1) MY119737A (en)
SG (1) SG67582A1 (en)
TW (1) TW420972B (en)

Families Citing this family (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6084173A (en) 1997-07-30 2000-07-04 Dimatteo; Robert Stephen Method and apparatus for the generation of charged carriers in semiconductor devices
US6034408A (en) * 1998-05-14 2000-03-07 International Business Machines Corporation Solid state thermal switch
US6098408A (en) * 1998-11-11 2000-08-08 Advanced Micro Devices System for controlling reflection reticle temperature in microlithography
US6161388A (en) * 1998-12-28 2000-12-19 International Business Machines Corporation Enhanced duty cycle design for micro thermoelectromechanical coolers
US6065293A (en) * 1999-02-26 2000-05-23 International Business Machines Corporation Thermoelectric cooling system
US6256996B1 (en) 1999-12-09 2001-07-10 International Business Machines Corporation Nanoscopic thermoelectric coolers
US6282907B1 (en) * 1999-12-09 2001-09-04 International Business Machines Corporation Thermoelectric cooling apparatus and method for maximizing energy transport
US6535342B1 (en) 1999-12-09 2003-03-18 International Business Machines Corporation Apparatus, system and method for writing information onto magnetic media field of the invention
US6222113B1 (en) 1999-12-09 2001-04-24 International Business Machines Corporation Electrically-isolated ultra-thin substrates for thermoelectric coolers
US6614109B2 (en) 2000-02-04 2003-09-02 International Business Machines Corporation Method and apparatus for thermal management of integrated circuits
US6732534B2 (en) * 2000-08-03 2004-05-11 Tellurex Corporation Vehicle temperature-conditioned container with a power control circuit and a defrost circuit
WO2002015289A2 (en) * 2000-08-18 2002-02-21 Genergy Varmaraf Ehf. A thermoelectric electron extractor for thermoelectric power generation
US6437981B1 (en) 2000-11-30 2002-08-20 Harris Corporation Thermally enhanced microcircuit package and method of forming same
US6608250B2 (en) 2000-12-07 2003-08-19 International Business Machines Corporation Enhanced interface thermoelectric coolers using etched thermoelectric material tips
US6467275B1 (en) 2000-12-07 2002-10-22 International Business Machines Corporation Cold point design for efficient thermoelectric coolers
US6384312B1 (en) 2000-12-07 2002-05-07 International Business Machines Corporation Thermoelectric coolers with enhanced structured interfaces
US6403876B1 (en) 2000-12-07 2002-06-11 International Business Machines Corporation Enhanced interface thermoelectric coolers with all-metal tips
US6597544B2 (en) 2000-12-11 2003-07-22 International Business Machines Corporation Thermoelectric microcoolers for cooling write coils and GMR sensors in magnetic heads for disk drives
US6588217B2 (en) 2000-12-11 2003-07-08 International Business Machines Corporation Thermoelectric spot coolers for RF and microwave communication integrated circuits
US6351952B1 (en) 2000-12-19 2002-03-05 Goodfaith Innovations, Inc. Interruptible thermal bridge system
US6622515B2 (en) 2000-12-19 2003-09-23 Itb Solutions Llc Interruptible thermal bridge system
US7273981B2 (en) * 2001-02-09 2007-09-25 Bsst, Llc. Thermoelectric power generation systems
US7942010B2 (en) 2001-02-09 2011-05-17 Bsst, Llc Thermoelectric power generating systems utilizing segmented thermoelectric elements
US6959555B2 (en) * 2001-02-09 2005-11-01 Bsst Llc High power density thermoelectric systems
US7946120B2 (en) 2001-02-09 2011-05-24 Bsst, Llc High capacity thermoelectric temperature control system
US6672076B2 (en) 2001-02-09 2004-01-06 Bsst Llc Efficiency thermoelectrics utilizing convective heat flow
US7231772B2 (en) * 2001-02-09 2007-06-19 Bsst Llc. Compact, high-efficiency thermoelectric systems
US6539725B2 (en) * 2001-02-09 2003-04-01 Bsst Llc Efficiency thermoelectrics utilizing thermal isolation
US7426835B2 (en) * 2001-08-07 2008-09-23 Bsst, Llc Thermoelectric personal environment appliance
US8490412B2 (en) * 2001-08-07 2013-07-23 Bsst, Llc Thermoelectric personal environment appliance
US6812395B2 (en) * 2001-10-24 2004-11-02 Bsst Llc Thermoelectric heterostructure assemblies element
US6712258B2 (en) 2001-12-13 2004-03-30 International Business Machines Corporation Integrated quantum cold point coolers
US6809793B1 (en) 2002-01-16 2004-10-26 Advanced Micro Devices, Inc. System and method to monitor reticle heating
US20040018729A1 (en) * 2002-02-11 2004-01-29 Ghoshal Uttam Shyamalindu Enhanced interface thermoelectric coolers with all-metal tips
US6494048B1 (en) 2002-04-11 2002-12-17 International Business Machines Corporation Assembly of quantum cold point thermoelectric coolers using magnets
US6588216B1 (en) * 2002-04-19 2003-07-08 International Business Machines Corporation Apparatus and methods for performing switching in magnetic refrigeration systems
JP3909755B2 (en) * 2002-04-22 2007-04-25 Ｏｂａｒａ株式会社 Cooling method for resistance welding equipment
US20110209740A1 (en) * 2002-08-23 2011-09-01 Bsst, Llc High capacity thermoelectric temperature control systems
US20050150537A1 (en) * 2004-01-13 2005-07-14 Nanocoolers Inc. Thermoelectric devices
US20050150536A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Method for forming a monolithic thin-film thermoelectric device including complementary thermoelectric materials
US20050150539A1 (en) * 2004-01-13 2005-07-14 Nanocoolers, Inc. Monolithic thin-film thermoelectric device including complementary thermoelectric materials
US8028531B2 (en) * 2004-03-01 2011-10-04 GlobalFoundries, Inc. Mitigating heat in an integrated circuit
US20060076046A1 (en) * 2004-10-08 2006-04-13 Nanocoolers, Inc. Thermoelectric device structure and apparatus incorporating same
WO2006056809A1 (en) * 2004-11-29 2006-06-01 Cambridge University Technical Services Limited Solid state electrocaloric cooling devices and methods
US7296417B2 (en) * 2004-12-23 2007-11-20 Nanocoolers, Inc. Thermoelectric configuration employing thermal transfer fluid flow(s) with recuperator
US7475551B2 (en) 2004-12-23 2009-01-13 Nanocoolers, Inc. System employing temporal integration of thermoelectric action
US7293416B2 (en) * 2004-12-23 2007-11-13 Nanocoolers, Inc. Counterflow thermoelectric configuration employing thermal transfer fluid in closed cycle
US7847179B2 (en) * 2005-06-06 2010-12-07 Board Of Trustees Of Michigan State University Thermoelectric compositions and process
JP2008547370A (en) * 2005-06-28 2008-12-25 ビーエスエスティー エルエルシー Thermoelectric generator for fluctuating heat power
WO2007025194A1 (en) * 2005-08-26 2007-03-01 Nanocoolers, Inc. Line voltage-powered thermoelectric device
US7870745B2 (en) 2006-03-16 2011-01-18 Bsst Llc Thermoelectric device efficiency enhancement using dynamic feedback
US7952015B2 (en) 2006-03-30 2011-05-31 Board Of Trustees Of Michigan State University Pb-Te-compounds doped with tin-antimony-tellurides for thermoelectric generators or peltier arrangements
US7788933B2 (en) * 2006-08-02 2010-09-07 Bsst Llc Heat exchanger tube having integrated thermoelectric devices
US8209989B2 (en) * 2007-03-30 2012-07-03 Intel Corporation Microarchitecture control for thermoelectric cooling
WO2008148042A2 (en) * 2007-05-25 2008-12-04 Bsst Llc System and method for distributed thermoelectric heating and colling
US20080289677A1 (en) * 2007-05-25 2008-11-27 Bsst Llc Composite thermoelectric materials and method of manufacture
WO2009091747A2 (en) * 2008-01-14 2009-07-23 The Ohio State University Research Foundation Thermoelectric figure of merit enhancement by modification of the electronic density of states
US20090235969A1 (en) * 2008-01-25 2009-09-24 The Ohio State University Research Foundation Ternary thermoelectric materials and methods of fabrication
US20090269584A1 (en) * 2008-04-24 2009-10-29 Bsst, Llc Thermoelectric materials combining increased power factor and reduced thermal conductivity
CN102105757A (en) 2008-06-03 2011-06-22 Bsst有限责任公司 Thermoelectric heat pump
US20100024859A1 (en) * 2008-07-29 2010-02-04 Bsst, Llc. Thermoelectric power generator for variable thermal power source
US20100101239A1 (en) * 2008-10-23 2010-04-29 Lagrandeur John Multi-mode hvac system with thermoelectric device
US20100258154A1 (en) * 2009-04-13 2010-10-14 The Ohio State University Thermoelectric alloys with improved thermoelectric power factor
US8899052B2 (en) 2010-11-04 2014-12-02 International Business Machines Corporation Thermoelectric-enhanced, refrigeration cooling of an electronic component
US8783052B2 (en) 2010-11-04 2014-07-22 International Business Machines Corporation Coolant-buffered, vapor-compression refrigeration with thermal storage and compressor cycling
US20120111038A1 (en) 2010-11-04 2012-05-10 International Business Machines Corporation Vapor-compression refrigeration apparatus with backup air-cooled heat sink and auxiliary refrigerant heater
US8833096B2 (en) 2010-11-04 2014-09-16 International Business Machines Corporation Heat exchange assembly with integrated heater
US8813515B2 (en) 2010-11-04 2014-08-26 International Business Machines Corporation Thermoelectric-enhanced, vapor-compression refrigeration apparatus facilitating cooling of an electronic component
US8955346B2 (en) 2010-11-04 2015-02-17 International Business Machines Corporation Coolant-buffered, vapor-compression refrigeration apparatus and method with controlled coolant heat load
US8904809B2 (en) * 2011-03-17 2014-12-09 The Aerospace Corporation Methods and systems for solid state heat transfer
EP2505913B1 (en) * 2011-03-30 2016-03-23 Nxp B.V. An active thermal management device and thermal management method
US8795545B2 (en) 2011-04-01 2014-08-05 Zt Plus Thermoelectric materials having porosity
JP5908975B2 (en) 2011-06-06 2016-04-26 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ Cartridge-based thermoelectric system
US9006557B2 (en) 2011-06-06 2015-04-14 Gentherm Incorporated Systems and methods for reducing current and increasing voltage in thermoelectric systems
JP2013050818A (en) * 2011-08-30 2013-03-14 Toshiba Corp Memory system
US9207002B2 (en) 2011-10-12 2015-12-08 International Business Machines Corporation Contaminant separator for a vapor-compression refrigeration apparatus
US8659903B2 (en) * 2011-12-06 2014-02-25 Palo Alto Research Center Incorporated Heat switch array for thermal hot spot cooling
FR2984008B1 (en) 2011-12-13 2014-01-10 Commissariat Energie Atomique ELECTRONIC DEVICE
WO2013099321A1 (en) * 2011-12-26 2013-07-04 Nakanuma Tadashi Thermoelectric generator
KR101312981B1 (en) * 2011-12-30 2013-10-01 한밭대학교 산학협력단 Sensor apparatus
JP5856488B2 (en) * 2012-01-13 2016-02-09 トヨタ自動車株式会社 Temperature control device
US20130291555A1 (en) * 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
WO2014022428A2 (en) 2012-08-01 2014-02-06 Gentherm Incorporated High efficiency thermoelectric generation
CN108400410A (en) 2013-01-30 2018-08-14 詹思姆公司 Heat management system based on thermoelectricity
US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
US20160126442A1 (en) * 2014-11-03 2016-05-05 J Touch Corporation Thermoelectric power generator
US10088697B2 (en) * 2015-03-12 2018-10-02 International Business Machines Corporation Dual-use electro-optic and thermo-optic modulator
US10527871B2 (en) * 2015-03-16 2020-01-07 California Institute Of Technology Differential ring modulator
WO2016191386A1 (en) 2015-05-22 2016-12-01 California Institute Of Technology Optical ring modulator thermal tuning technique
CN106533328B (en) * 2015-09-11 2018-05-25 博立码杰通讯(深圳)有限公司 Integrated solar utilizes apparatus and system
WO2019210923A1 (en) * 2018-05-04 2019-11-07 Aalborg Universitet Temperature management of a semiconductor chip
US20200035898A1 (en) 2018-07-30 2020-01-30 Gentherm Incorporated Thermoelectric device having circuitry that facilitates manufacture
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
US11302857B2 (en) 2019-11-19 2022-04-12 International Business Machines Corporation Cryogenic refrigeration for low temperature devices
US11211542B2 (en) 2019-11-19 2021-12-28 International Business Machines Corporation Cryogenic refrigeration for low temperature devices

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4304294A (en) * 1978-08-17 1981-12-08 Ford Aerospace & Communications Corp. Thermal energy switch

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0539966A (en) * 1991-08-07 1993-02-19 Matsushita Electric Ind Co Ltd Heat pump device
JP2924369B2 (en) * 1991-11-20 1999-07-26 松下電器産業株式会社 Heat pump device
US5720171A (en) * 1996-06-11 1998-02-24 Atoma International, Inc. Device for heating and cooling a beverage

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4304294A (en) * 1978-08-17 1981-12-08 Ford Aerospace & Communications Corp. Thermal energy switch

Also Published As

Publication number Publication date
KR19990062601A (en) 1999-07-26
EP0922915A2 (en) 1999-06-16
TW420972B (en) 2001-02-01
US5867990A (en) 1999-02-09
JP3117430B2 (en) 2000-12-11
KR100313352B1 (en) 2002-01-15
JPH11317481A (en) 1999-11-16
CN1219672A (en) 1999-06-16
CN1110666C (en) 2003-06-04
SG67582A1 (en) 1999-09-21
EP0922915A3 (en) 2000-03-22

Similar Documents

Publication Publication Date Title
MY119737A (en) Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms
PL341158A1 (en) Thermoelectric cooling process involving dynamic switching over intended to isolate specific heat transfer mechanisms
GB2384624A (en) Thermoelectric control of fluid temperature
IL156319A0 (en) Thermoelectric devices
US20070157629A1 (en) Thermoelectric heat pumps
CA2305647A1 (en) Modular thermoelectric unit and cooling system using same
CA2670716A1 (en) Direct thermoelectric chiller assembly
WO2004070852A3 (en) Peltier cooler integrated with electronic device(s)
WO2002065029A8 (en) Improved efficiency thermoelectrics utilizing convective heat flow
SU1142711A1 (en) Non-stationary thermoelectric cooler
JP2000252398A (en) Thermoelectric cooling system
CA2078475A1 (en) Purified liquid storage receptacle and a heat transfer assembly and method of heat transfer
JPH0539966A (en) Heat pump device
Patil et al. Review on thermoelectric devices
KR20120040760A (en) Air-cooled apparatus capable of providing thermotherapy stimulations
Kuan Experimental evaluation of micro heat exchangers fabricated in silicon
JP3087813B2 (en) Temperature control device and method
CN201622742U (en) Semiconductor cooling and heating training device
KR20210080012A (en) Heat conductor with thermoelectric effect and cooling-heating system comprising the same
GB2188163A (en) Testing degradation of a sample under thermal cycling
CN112947622A (en) Temperature control device based on semiconductor
CN109282519A (en) Heat transmits reversible mini thermoelectric heat refrigerator
GB2354637A (en) A differential voltage cell
CN212806215U (en) Water ion refrigerating sheet
RU2282274C2 (en) Thermo-electric battery