MY116826A - Solder alloy. - Google Patents

Solder alloy.

Info

Publication number
MY116826A
MY116826A MYPI9403119A MY116826A MY 116826 A MY116826 A MY 116826A MY PI9403119 A MYPI9403119 A MY PI9403119A MY 116826 A MY116826 A MY 116826A
Authority
MY
Malaysia
Prior art keywords
alloy
soft
soldered
weight
solder alloy
Prior art date
Application number
Other languages
English (en)
Inventor
Toshihiko Taguchi
Rikiya Katoh
Osamu Munekata
Yoshitaka Toyoda
Original Assignee
Senju Metal Industry Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Company Ltd filed Critical Senju Metal Industry Company Ltd
Publication of MY116826A publication Critical patent/MY116826A/en

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
MYPI9403119 1994-05-06 1994-11-23 Solder alloy. MY116826A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11608594A JP3254901B2 (ja) 1994-05-06 1994-05-06 はんだ合金

Publications (1)

Publication Number Publication Date
MY116826A true MY116826A (en) 2004-04-30

Family

ID=14678345

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9403119 MY116826A (en) 1994-05-06 1994-11-23 Solder alloy.

Country Status (3)

Country Link
JP (1) JP3254901B2 (member.php)
MY (1) MY116826A (member.php)
TW (1) TW323304B (member.php)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6033488A (en) * 1996-11-05 2000-03-07 Samsung Electronics Co., Ltd. Solder alloy
JP3752064B2 (ja) * 1997-05-23 2006-03-08 内橋エステック株式会社 半田材料及びそれを用いた電子部品
CN101279406B (zh) 2008-05-27 2011-04-13 重庆理工大学 一种抑制铅挥发污染环境的含铅钎料
CN108788511A (zh) * 2018-06-25 2018-11-13 深圳市博士达焊锡制品有限公司 一种具有高抗氧化能力的有铅焊料及其制备方法

Also Published As

Publication number Publication date
JPH07299585A (ja) 1995-11-14
JP3254901B2 (ja) 2002-02-12
TW323304B (member.php) 1997-12-21

Similar Documents

Publication Publication Date Title
DK1333957T3 (da) Blyfrie loddemetaller
KR20170031769A (ko) 솔더링용 저온 고신뢰성 주석 합금
TW360578B (en) Lead-free solder used for connecting electronic parts on organic substrate
MY116826A (en) Solder alloy.
TW528638B (en) Lead-free solders
JPH04224645A (ja) 電子部品用銅合金
TW371276B (en) A lead-free tin-silver-based soldering alloy
SG46442A1 (en) Use of silver alloys as cadmium-free brazing solder
DE50003135D1 (de) Wärmeausdehnungsarme eisen-nickel-legierung mit besonderen mechanischen eigenschaften
PL305673A1 (en) Fe-al alloy
EA200100837A1 (ru) Алюминиевое изделие и способ его производства
EP1381066A3 (en) Alloy type thermal fuse and wire member for a thermal fuse element
ES8502167A1 (es) Un metodo de fabricar un producto forjado a base de una aleacion de niquel-cromo-molibdeno de alto indice elastico y resistente a la corrosion.
JPH06269983A (ja) Ａｇ系はんだ
CA2122376A1 (en) Solder alloy having decreased fatigue rupture occurring on soldered joints exposed to heat cycle stress
JPH06269981A (ja) Ａｇ系はんだ
US3414964A (en) Method for the production of a soldered joint
Nestler et al. Diffusion Welding of Chip Carriers for Components Used in Power Electronics
JP2002153990A (ja) はんだボール用合金
JPH0671480A (ja) はんだ合金
Foley et al. Analysis of ring and plug shear strengths for comparison of lead free solders designed for structural applications
SU118460A1 (ru) Теплостойкий припой
Adile et al. Effect of the geometry of soldered joints on mechanical fatigue behavior in the soldering of surface mounted electronic devices
SU118690A1 (ru) Жаропрочный припой
Duret et al. Presentation of a" User's Guide to Materials for Gas Turbine Corrosion Prevention"