MY110396A - Resin impregnated laminate for printed wiring board applications - Google Patents

Resin impregnated laminate for printed wiring board applications

Info

Publication number
MY110396A
MY110396A MYPI94000768A MYPI19940768A MY110396A MY 110396 A MY110396 A MY 110396A MY PI94000768 A MYPI94000768 A MY PI94000768A MY PI19940768 A MYPI19940768 A MY PI19940768A MY 110396 A MY110396 A MY 110396A
Authority
MY
Malaysia
Prior art keywords
wiring board
printed wiring
resin impregnated
board applications
impregnated laminate
Prior art date
Application number
MYPI94000768A
Other languages
English (en)
Inventor
Paul Zussman Melvin
Kirayoglu Birol
John Sullivan William
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of MY110396A publication Critical patent/MY110396A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
    • D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
    • D04H1/4326—Condensation or reaction polymers
    • D04H1/4334—Polyamides
    • D04H1/4342—Aromatic polyamides
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
    • D21H13/10—Organic non-cellulose fibres
    • D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H13/26—Polyamides; Polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2861—Coated or impregnated synthetic organic fiber fabric
    • Y10T442/2893—Coated or impregnated polyamide fiber fabric
    • Y10T442/2902—Aromatic polyamide fiber fabric
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/654—Including a free metal or alloy constituent
    • Y10T442/656—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the nonwoven fabric]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Paper (AREA)
  • Reinforced Plastic Materials (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
MYPI94000768A 1993-03-31 1994-03-30 Resin impregnated laminate for printed wiring board applications MY110396A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/041,417 US5314742A (en) 1993-03-31 1993-03-31 Resin impregnated laminate for wiring board applications

Publications (1)

Publication Number Publication Date
MY110396A true MY110396A (en) 1998-04-30

Family

ID=21916409

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI94000768A MY110396A (en) 1993-03-31 1994-03-30 Resin impregnated laminate for printed wiring board applications

Country Status (10)

Country Link
US (1) US5314742A (enExample)
EP (1) EP0692177B1 (enExample)
JP (1) JP3663210B2 (enExample)
CA (1) CA2159182C (enExample)
DE (2) DE69402538T2 (enExample)
HK (1) HK1000272A1 (enExample)
MY (1) MY110396A (enExample)
SG (1) SG42994A1 (enExample)
TW (1) TW285678B (enExample)
WO (1) WO1994023553A1 (enExample)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0740013A4 (en) * 1994-11-15 1998-07-08 Mitsubishi Gas Chemical Co LAYER MATERIAL FOR COMPOSITES FOR CIRCUIT BOARDS, AND PRINTED CIRCUIT BOARD WITH THIS LAYER MATERIAL
EP0768334B1 (en) * 1995-10-16 2004-02-18 Sumitomo Chemical Company Limited Prepreg, process for producing the same and printed circuit substrate using the same
JP3324437B2 (ja) * 1997-04-04 2002-09-17 松下電器産業株式会社 多層プリント配線板の製造方法
US6323436B1 (en) * 1997-04-08 2001-11-27 International Business Machines Corporation High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer
US5998309A (en) * 1997-07-17 1999-12-07 E. I. Du Pont De Nemours And Company Molded aramid sheets
US5910231A (en) * 1997-07-22 1999-06-08 E. I. Du Pont De Nemours And Company Aramid papers of improved solvent resistance and dimensionally stable laminates made therefrom
JP4067604B2 (ja) * 1997-08-20 2008-03-26 松下電器産業株式会社 回路形成基板および回路形成基板の製造方法
JPH11131385A (ja) 1997-11-05 1999-05-18 Oji Paper Co Ltd 積層板用基材及びその製造法ならびにプリプレグ及び積層板
JP3869559B2 (ja) 1998-09-28 2007-01-17 新神戸電機株式会社 電気絶縁用不織布ならびにプリプレグ及び積層板
JP3631385B2 (ja) * 1998-11-18 2005-03-23 王子製紙株式会社 積層板用基材およびその製造方法
US6671951B2 (en) 1999-02-10 2004-01-06 Matsushita Electric Industrial Co., Ltd. Printed wiring board, and method and apparatus for manufacturing the same
US6224965B1 (en) 1999-06-25 2001-05-01 Honeywell International Inc. Microfiber dielectrics which facilitate laser via drilling
US6245696B1 (en) 1999-06-25 2001-06-12 Honeywell International Inc. Lasable bond-ply materials for high density printed wiring boards
JP2002160316A (ja) * 2000-11-27 2002-06-04 Daikin Ind Ltd 電気絶縁板、プリプレグ積層体及びこれらの製造方法
US20020142689A1 (en) * 2001-01-23 2002-10-03 Levit Mikhail R. Non-woven sheet of aramid floc
JP2002293979A (ja) 2001-03-30 2002-10-09 Sumitomo Chem Co Ltd 多孔質パラ配向芳香族ポリアミドフィルム、そのプリプレグならびにプリプレグを使用するプリント回路用基材
JP2005523976A (ja) * 2002-04-26 2005-08-11 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー プリント回路基板および集積回路チップパッケージ用低損失誘電材料
FR2848994B1 (fr) * 2002-12-20 2005-02-25 Seb Sa Moyen de transport et de positionnement de recipients gigognes
AU2003304706A1 (en) 2003-12-31 2005-08-03 E.I. Du Pont De Nemours And Company High temperature microwave susceptor structure
US7470990B2 (en) * 2004-03-31 2008-12-30 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US7455750B2 (en) * 2004-06-25 2008-11-25 E.I. Du Pont De Nemours And Company Meta- and para-aramid pulp and processes of making same
US7646098B2 (en) * 2005-03-23 2010-01-12 Endicott Interconnect Technologies, Inc. Multilayered circuitized substrate with p-aramid dielectric layers and method of making same
US8084863B2 (en) * 2005-03-23 2011-12-27 Endicott Interconnect Technologies, Inc. Circuitized substrate with continuous thermoplastic support film dielectric layers
KR20080083167A (ko) * 2005-12-21 2008-09-16 이 아이 듀폰 디 네모아 앤드 캄파니 Ｐｉｐｄ 플록을 포함하는 종이 및 이의 제조 방법
US7687722B2 (en) * 2006-10-03 2010-03-30 Endicott Interconnect Technologies, Inc. Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same
US7785520B2 (en) * 2006-12-15 2010-08-31 E.I. Du Pont De Nemours And Company Processes for making shaped honeycomb and honeycombs made thereby
US20080145602A1 (en) 2006-12-15 2008-06-19 Gary Lee Hendren Processes for making shaped honeycomb and honeycombs made thereby
US7771809B2 (en) * 2006-12-15 2010-08-10 E. I. Du Pont De Nemours And Company Shaped honeycomb
US7771811B2 (en) * 2006-12-15 2010-08-10 E.I. Du Pont De Nemours And Company Honeycomb from controlled porosity paper
US7771810B2 (en) * 2006-12-15 2010-08-10 E.I. Du Pont De Nemours And Company Honeycomb from paper having a high melt point thermoplastic fiber
US8025949B2 (en) 2006-12-15 2011-09-27 E.I. Du Pont De Nemours And Company Honeycomb containing poly(paraphenylene terephthalamide) paper with aliphatic polyamide binder and articles made therefrom
US20080286522A1 (en) * 2006-12-15 2008-11-20 Subhotosh Khan Honeycomb having a low coefficient of thermal expansion and articles made from same
US7815993B2 (en) * 2006-12-15 2010-10-19 E.I. Du Pont De Nemours And Company Honeycomb from paper having flame retardant thermoplastic binder
US8268434B2 (en) * 2007-11-30 2012-09-18 E I Du Pont De Nemours And Company Honeycomb having a high compression strength and articles made from same
US20090214818A1 (en) * 2008-02-26 2009-08-27 E. I. Du Pont De Nemours And Company Core having a high shear strength and articles made from same
US20090258161A1 (en) * 2008-04-10 2009-10-15 Japp Robert M Circuitized substrate with P-aramid dielectric layers and method of making same
US7665149B2 (en) * 2008-05-14 2010-02-23 E.I. Du Pont De Nemours And Company Ballistic resistant body armor articles
US8292027B2 (en) 2009-04-21 2012-10-23 E I Du Pont De Nemours And Company Composite laminate for a thermal and acoustic insulation blanket
US8607927B2 (en) * 2009-04-21 2013-12-17 E I Du Pont De Nemours And Company Composite flame barrier laminate for a thermal and acoustic insulation blanket
US8607926B2 (en) * 2009-04-21 2013-12-17 E I Du Pont De Nemours And Company Composite flame barrier laminate for a thermal and acoustic insulation blanket
US8607928B2 (en) 2009-04-21 2013-12-17 E I Du Pont De Nemours And Company Composite flame barrier laminate for a thermal and acoustic insulation blanket
US20110281063A1 (en) 2009-11-20 2011-11-17 E. I. Du Pont De Nemours And Company Honeycomb core based on carbon fiber paper and articles made from same
US20110281080A1 (en) 2009-11-20 2011-11-17 E. I. Du Pont De Nemours And Company Folded Core Based on Carbon Fiber Paper and Articles Made from Same
CN102296488B (zh) * 2011-07-07 2013-09-11 民丰特种纸股份有限公司 一种低翘曲纸基层压线路板原纸生产方法及纸基层压线路板原纸
CA2868103A1 (en) 2012-04-18 2013-10-24 E. I. Du Pont De Nemours And Company Multilayered sheet
BR112014025974A2 (pt) 2012-04-18 2017-06-27 Du Pont folha em camadas.
CA2868060A1 (en) 2012-04-18 2013-10-24 E. I. Du Pont De Nemours And Company Multilayered sheet
WO2014088742A1 (en) 2012-12-03 2014-06-12 E. I. Du Pont De Nemours And Company Composite sheet and cargo container comprising same
KR101458996B1 (ko) * 2013-06-21 2014-11-07 주식회사 휴비스 경량의 방검용 직물 및 이를 이용한 방검용 보호복
US10457013B2 (en) 2014-05-27 2019-10-29 Dupont Safety & Construction, Inc. Composite sheet and cargo container comprising same
US9976258B2 (en) 2014-10-03 2018-05-22 E I Du Pont De Nemours And Company Honeycomb core having a high compression strength
CN104674594A (zh) * 2015-01-14 2015-06-03 深圳昊天龙邦复合材料有限公司 具有负热膨胀系数和高耐热的电路板用合成纤维纸及其制备方法与应用
US20220290375A1 (en) 2021-03-09 2022-09-15 Dupont Safety & Construction, Inc. Multilayered fire-resistant sheet

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4729921A (en) * 1984-10-19 1988-03-08 E. I. Du Pont De Nemours And Company High density para-aramid papers
DE3688798T2 (de) * 1985-01-23 1993-12-23 Toyo Boseki Mittels einer nichtgewobenen Stoffbahn aus Polyaramid verstärkte biegsame Folie und Verwendung derselben.
US4751146A (en) * 1985-07-09 1988-06-14 Showa Denko Kabushiki Kaisha Printed circuit boards

Also Published As

Publication number Publication date
HK1000272A1 (en) 1998-02-13
CA2159182A1 (en) 1994-10-13
DE692177T1 (de) 1996-10-10
TW285678B (enExample) 1996-09-11
JP3663210B2 (ja) 2005-06-22
EP0692177B1 (en) 1997-04-09
SG42994A1 (en) 1997-10-17
JPH08508549A (ja) 1996-09-10
US5314742A (en) 1994-05-24
DE69402538D1 (de) 1997-05-15
CA2159182C (en) 2005-04-05
EP0692177A1 (en) 1996-01-17
WO1994023553A1 (en) 1994-10-13
DE69402538T2 (de) 1997-11-06

Similar Documents

Publication Publication Date Title
MY110396A (en) Resin impregnated laminate for printed wiring board applications
EP0307123A3 (en) A composite sheet material
DE68918159D1 (de) Schichtstoffplatte aus Polyolefinschaum und ihre beidseitige Vakuumformung.
CA2057016A1 (en) Heat barrier laminate
AU569300B2 (en) Sandwich board construction
CA2079922A1 (en) Hdpe/polypropylene film laminates
MY113910A (en) Resin-coated copper foil for use in multilayer printed wiring board and multilayer printed wiring board using said copper foil
HUT73029A (en) Bulkhead with gypsumsheet
GB2238283B (en) The protection of aircraft structures
SG108282A1 (en) Imcombustible resin composition, prepreg, laminated plate, meta-clad laminated plate, printed wiring board and multi-layer printed wiring board
EP1178074A4 (en) PREMIX, LAMINATE WITH METAL COATING AND PRINTED CIRCUIT BOARD OBTAINED THEREFROM
CA1273279C (en) POLYMER AND FIBER COMPOSITE SHEET COVERED FOAM INSULATION PANEL
ES2178161T3 (es) Laminado para cuadros de circuitos impresos.
SG85102A1 (en) Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same
UA37254C2 (uk) Багатошаровий папір
EP0988966A3 (en) Micro-cellular polyester film
ZA894701B (en) Multilayered carrier web
NZ510854A (en) Thermoformable multi-layer polypropylene foam sheet
IL132204A0 (en) Arrangement for supporting a circuit board
ATE145858T1 (de) Matter film
JPS53124589A (en) Manufacture of unsaturated polyester resin copper clad laminate
JPS5326879A (en) Laminated sheet
Gower Laminates
Schafer et al. Foil for Laminating to Aluminum or Steel Sheets
DE69631287D1 (de) Vibrationsdämpfendes verbundmaterial