MY104547A - Method of forming a solder layer on pad board of a circuit board and method of mounting an electron circuit board. - Google Patents
Method of forming a solder layer on pad board of a circuit board and method of mounting an electron circuit board.Info
- Publication number
- MY104547A MY104547A MYPI90002101A MYPI19902101A MY104547A MY 104547 A MY104547 A MY 104547A MY PI90002101 A MYPI90002101 A MY PI90002101A MY PI19902101 A MYPI19902101 A MY PI19902101A MY 104547 A MY104547 A MY 104547A
- Authority
- MY
- Malaysia
- Prior art keywords
- circuit board
- paste
- composition
- pads
- board
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 abstract 6
- 239000007788 liquid Substances 0.000 abstract 2
- 238000001556 precipitation Methods 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 150000007524 organic acids Chemical class 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A PASTE- LIKE COMPOSITION CONTAINING A LEAD SALT OF AN ORGANIC ACID AND TIN POWDER IS APPLIED ON A PAD ARRAY PORTION OF A CIRCUIT BOARD. THEN, THE PASTE- LIKE COMPOSITION IS HEATED SO AS TO CAUSE PRECIPITATION , THEREBY FORMING A SOLDER LAYER FORMED OF AN SN- PB ALLOY SUBSTANTIALLY ONLY ON PADS. THIS PRECIPITATION IS PERFORMED IN A STATE THAT A LIQUID POOL IS FORMED ON THE PAD ARRAY PORTION WHEN THE PASTE- LIKE COMPOSITION IS LIQUEFIED BY HEATING AND THE TIN POWDER IS SETTLED IN THE LIQUID POOL. WHEN AN ELECTRONIC PART IS TO BE MOUNTED ON THE PADS. FIRST PREPARATORY SOLDER LAYERS ARE FORMED ON THE PADS BY THE ABOVE- MENTIONAL PRECIPTATION PROCESS. AFTER A PASTE- LIKE COMPOSITIONS IS APPLIED ON THE PREPARATORY SOLDER LAYERS, THE ELECTRONIC PART IS PUT ON THE PASTE- LIKE COMPOSITION. THEN, THE PASTE-LIKE COMPOSITION IS HEATED THEREBY SOLDERING LEADS OF THE ELECTRONIC PART WITH THE PADS.(FIG. 2)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1309056A JPH03171792A (en) | 1989-11-30 | 1989-11-30 | Method of forming solder layer on pad of circuit board |
| JP30905789 | 1989-11-30 | ||
| JP2222687A JPH03193388A (en) | 1980-10-31 | 1990-08-27 | Record medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY104547A true MY104547A (en) | 1994-04-30 |
Family
ID=79553825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI90002101A MY104547A (en) | 1989-11-30 | 1990-11-27 | Method of forming a solder layer on pad board of a circuit board and method of mounting an electron circuit board. |
Country Status (1)
| Country | Link |
|---|---|
| MY (1) | MY104547A (en) |
-
1990
- 1990-11-27 MY MYPI90002101A patent/MY104547A/en unknown
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