MXPA97006314A - Method for fixing parts of the driver and the armor box to the printed circuit board, and method for fixing parts of the integrated circuit, driver parts and the armor box to the circuit board print - Google Patents
Method for fixing parts of the driver and the armor box to the printed circuit board, and method for fixing parts of the integrated circuit, driver parts and the armor box to the circuit board printInfo
- Publication number
- MXPA97006314A MXPA97006314A MXPA/A/1997/006314A MX9706314A MXPA97006314A MX PA97006314 A MXPA97006314 A MX PA97006314A MX 9706314 A MX9706314 A MX 9706314A MX PA97006314 A MXPA97006314 A MX PA97006314A
- Authority
- MX
- Mexico
- Prior art keywords
- circuit board
- printed circuit
- conductor
- welding
- box
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims abstract description 127
- 238000003466 welding Methods 0.000 claims abstract description 54
- 229910000679 solder Inorganic materials 0.000 claims abstract description 39
- 239000011248 coating agent Substances 0.000 claims abstract description 31
- 238000000576 coating method Methods 0.000 claims abstract description 31
- 230000001808 coupling Effects 0.000 claims abstract description 16
- 238000010168 coupling process Methods 0.000 claims abstract description 16
- 238000005859 coupling reaction Methods 0.000 claims abstract description 16
- 238000002844 melting Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 42
- 239000000969 carrier Substances 0.000 description 13
- 230000000875 corresponding Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000006071 cream Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 102100016006 SLIT1 Human genes 0.000 description 1
- 101700052317 SLIT1 Proteins 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Abstract
The present invention relates to a method for securing a portion of the conductor and a shielding box to prevent a high frequency signal from leaking to a printed circuit board, in accordance with the invention, includes a step of coating with solder coating so that the weld should cover the entire opening that is provided through a printed circuit board into which a conductor is inserted from the driver's side, and so that the weld must cover a part of an opening that is provides through the printed circuit board, in which a coupling portion of the shielding box is inserted, a mounting step for inserting the conductor of the driver's part into the coupling portion of the shielding box in the openings respectively to mount a part of the conductor and the shielding box on the printed circuit board, and a welding step to insert the circuit board Printed package assembled with the driver's part and the shielding box in a reflow oven and melt the welding to in this way carry out the welding operation
Description
"METHOD FOR FIXING PARTS OF THE DRIVER AND THE BOX OF
SHIELDING TO PRINTED CIRCUIT BOARD, AND METHOD FOR
FIX PARTS OF THE INTEGRATED CIRCUIT, PARTS OF THE DRIVER AND
THE SHIELD BOX, TO THE 'PRINTED' CIRCUIT BOARD
BACKGROUND
FIELD OF THE INVENTION
The present invention relates to a method for securing a part of the conductor and a shielding box to a printed circuit board, and a method for fixing a part of the integrated circuit, a part of the conductor and a shielding box for a control board. printed circuit.
2. BACKGROUND OF THE INVENTION
A conventional method for fixing a part of the conductor and its shielding box to a printed circuit board, and a conventional method for fixing a part of the integrated circuit, a part of the conductor and a shielding box to a printed circuit board, is will now describe referring to Figures IA to 1J. First, a process shown in Figure IA will be explained. The reference number 1 designates a printed circuit board. A conductor network (not shown) is formed on at least one face (a top side face in Figure IA) of the printed circuit board. The opening lh and a slit ls are formed in this printed circuit board 1. A conductor 4L of each of the multiple conductor parts 4 (only a part 4 of the conductor is shown in Figures IA to 1J) described below is inserted into the opening 1. The printed circuit board 1 is cut and the parts 4 of the multiple conductor and the parts 2 of the integrated circuit corresponding to these parts 4 of the multiple conductor are soldered to the individual printed circuit board 1. A portion of a shielding box 5 fits within slot ls. A cream weld is printed on a portion of predetermined multiple pairs of conductor networks on the face of this printed circuit board 1, using a welding printer. The multiple integral circuit parts 2 (only a part of the integral circuit is shown in Figures IA to 1J) is mounted on each printed cream solder (not shown in the figure) using a mounting device. The printed circuit board 1 mounting these multiple integral circuit parts 2 in it is placed in a reflow oven and heated. The solder is melted and then cooled. In this way, the parts 2 of the multiple integral circuit are soldered to a portion of the multiple pairs of the conductor networks of the printed circuit board 1. Next, the processes of Figures IB and 1C will be explained. In the process of Figure IB, a weld 3 is coated with a portion of the conductor networks on one face of the printed circuit board 1, using a welding coating device in the vicinity of the opening lh, within which the multiple conductor parts 4 are inserted. In the process of Figure 1C, the printed circuit board 1 is inverted in such a way that one face of the printed circuit board 1 is placed on a lower side as shown in Figure 1C. In a process of FIG. ID, the multiple conductor parts 4 are mounted on the other side (a top side face in FIG. ID) of the printed circuit board 1 such that the conductor 4L of each of the parts 4 Multiple conductor is inserted into the opening lh of the printed circuit board 1 manually using a mounting insertion device. Each conductor 4L enters the weld 3 on one side of the board 1 of the printed circuit. In a process of Figure 5E, the printed circuit board 1 on which the multiple conductor parts 4 are mounted, is placed in a reflow oven and heated. Therefore, the weld 3 melts and then cools. In this way, the multiple conductor portions 4 are welded to a portion of the predetermined conductor networks of the printed circuit board 1, together with the parts 2 of the multiple integral circuit. In a process of Figure 1F, the printed circuit board 1 is cut and divided using a substrate splitter in each of the multiple conductor parts 4 and the integrated circuit parts 2, corresponding respectively to these driver parts multiple In a process of Figure 1G, a shielding box 5 is fitted and fixed to an individual printed circuit board 1 in which respectively the driver parts 4 and the integral circuit parts 2 corresponding to these parts are welded. of the driver. After the process of Figure 1G, the individual multiple mounting blocks each fixing the shielding box 5 thereto are placed in a predetermined position of a carrier, and fixed so that the mounting blocks are formed. This process is not shown in Figure 5.
In a process of Figure 1H, a portion and a 5N grapple to be described later with a portion of the armor box 5 of each of the multiple individual printed circuit boards 1 on the carrier, and a portion of a projection constructed by the conductive layer on one face of each of the individual printed circuit boards 1, they are respectively coated with the solder 6 using the solder coating device. In a process of Figure II, the hook 5N of the shielding box 5 of each of the individual multiple printed circuit boards 1 on the carrier is folded on one side of each of the individual printed circuit boards 5, using a riveter. After the process of Figure II, the multiple individual mounting blocks are separated from the carrier, even though this separation is not illustrated in this figure. In a process of Figure 1J, the individual mounting blocks are inverted and placed in the reflow oven and heated. In this way, the solder 6 melts and then cools. Therefore, it is possible to obtain a circuit block in which the shielding box 5 is soldered to each of the individual printed circuit boards 1 having welded integrated parts 2 of the integrated circuit and conductor parts 4. In addition to the welding of the shielding box, the conductors of a capacitor of a box assembly, the terminals of the conductor etc. They are also welded similarly. For example, this block in the circuit is a high frequency block formed of a tuner and an intermediate frequency amplifier. This conventional method for fixing the conductor part and its shielding box on the printed circuit board has the following disadvantages. The process of welding the conductors of the conductor parts in the network of conductors of the printed circuit board and the shielding box to it using the reflow oven in a separate process, so that the number of processes is increased. Each of the individual printed circuit boards should be fixed to the carrier when a portion between the hook of a shielding box portion and the protrusion of each of the printed circuit boards is coated with the welding by the welding coating device for welding the shielding box on each of the individual printed circuit boards. In addition, each of the individual printed circuit boards can be separated from the carrier, when each of the printed circuit boards and the shield box are placed in the reflow oven to melt the weld. Therefore, the number of processes is increased. When each of the individual multiple printed circuit boards that it fixes to the shielding box is fixed to the carrier, and the portion between the hook and a portion of the shielding box and the snap on one side of the slot ls of Each of the printed circuit boards is coated with the solder by the solder coating device, there are inconveniences since it is difficult to set the fixing and coating conditions and a coating accuracy is low. An angled cutting nozzle or a special nozzle is required as a nozzle for coating the solder around the shielding box in the welding liner. Accordingly, there is also an inconvenience of an increase in the price of the solder coating device. A portion between the protrusion of a printed circuit board and the hook of the shielding box is coated with the solder by inserting the nozzle to coat the solder in the shielding box. In addition, the portions between the network of conductors of the printed circuit board and the conductors of a capacitor, the terminals of the connector, etc. They are coated with solder in such a way that the conductors and terminals etc. they are inserted in the mouthpiece. Consequently, the nozzle floats, it is damaged, etc. Therefore there are problems since repair work should be required and a manufacturing line is stopped and so on.
COMPENDIUM OF THE INVENTION
In view of these aspects, an object of the present invention is to provide a method for fixing a part of the conductor and a shielding box to a printed circuit board, and a method for fixing a part of the integrating circuit, a portion of the conductor and a shielding box to a printed circuit board, where the numbers of processes and jobs can be reduced compared to the conventional setting method, and an accuracy or precision of the welding coating can be improved for welding the printed circuit board and the shield box. In accordance with one aspect of the present invention, a method for securing a conductor portion and a shielding box to prevent a high frequency signal from leaking to a printed circuit board includes a welding solder coating step. of coating so that the weld must cover an entire opening that is provided through a printed circuit board where a conductor is inserted from the driver's side and so that the weld must cover a part of an opening that is provided through the printed circuit board where a coupling portion of the shielding box is inserted, a mounting step of inserting the conductor of the conductor part and the coupling portion of the shielding box into the respective openings, for in this way assemble the conductor parts and the shielding box on the printed circuit board, and a welding step to insert the circuit board printed with the driver's part and the shielding box, in a reflow oven, and melt the solder in order to carry out the welding operation. According to this construction of the present invention, the multiple conductor parts and the multiple shield boxes are simultaneously welded on the printed circuit board by the reflow oven. The first invention includes a process in which a weld is coated on a portion of the conductor network in the vicinity of each opening of a printed circuit board, to insert each conductor of the multiple conductor parts therein and into a projection formed from a conductive layer in the vicinity of a slot for inserting a portion of each of the multiple shielding boxes corresponding respectively to the multiple conductor portions therein; a process in which each conductor of the multiple conductor parts extends through each opening of the printed circuit board, a portion of each of the multiple shield boxes extending through the slot of the printed circuit board to In order to surround each of the multiple driver parts and the driver parts and the shield boxes are mounted on the printed circuit board; a process in which the printed circuit board that mounts the multiple conductor parts and the multiple armor boxes in it is placed in a reflow oven, the solder is melted and then cooled, and each conductor of the conductor parts multiples and the portion of each of the multiple shield boxes are welded to a portion of the conductor network of the printed circuit board and the projection; and a process for obtaining multiple individual circuit blocks by cutting and amusing the printed circuit board in each set of each of the driver's parts and each of the armor boxes. Therefore, compared to the conventional setting method, no carrier is used at the time of coating the weld prior to reflow. In addition, the solder coating for welding the multiple conductor parts and the multiple shielding boxes on the printed circuit board, and the melting of the solder using the reflow oven, are carried out simultaneously in a respective manner. Therefore, the number of processes and work can be reduced. Since no carrier is used, it is possible to obtain a method of fixing a part of the conductor and a shielding box on the printed circuit board, where a welding coating accuracy for welding the printed circuit board and the box of shielding can be improved. Therefore, the scale of a fixing plant is reduced and the workspace can be reduced. Also, since no carrier is used, a nozzle used in the welding liner for welding the shield box on the printed circuit board can be constructed by a flat nozzle, wherein an opening is approximately perpendicular to a longitudinal direction of the mouthpiece Accordingly, the price of a solder coating device can be reduced. According to the second invention, a connector is placed in each of the multiple shield boxes in the method of fixing a part of the conductor and a shielding box to the printed circuit board in the first invention. Also, multiple circuit blocks constructed by multiple conductor parts, multiple shield boxes and multiple connectors are placed in each pair so that the circumferential faces of the respective connectors can be placed in close proximity to one another, and pairs of circuit blocks are fixed to the printed circuit board in order to place the pairs of circuit blocks in a zigzag fashion, approximately in parallel with one another. Accordingly, effects similar to those in the first invention are obtained. Furthermore, it is possible to obtain a method of fixing a part of the conductor and a shielding box to the printed circuit board, wherein the efficiency of the printed circuit board with respect to the circuit blocks constructed by the driver's parts, the boxes of shielding and connectors, can be improved. The third invention includes a process for welding a part of the integrated circuit to a portion of the conductor network of a printed circuit board; a process wherein a solder is encased in a portion of the conductor network in the vicinity of each opening of the printed circuit board, in order to insert each conductor of the multiple conductor parts therein and into a protrusion produced from a conductive layer in a vicinity of a slit, for inserting a portion of each of the multiple shield boxes corresponding respectively to the multiple conductor portions therein; a process in which each conductor of the multiple conductor parts extends through each opening of the printed circuit board, a portion of each of the multiple shielding boxes extending through the slot of the printed circuit board to so as to surround each of the multiple conductor parts, and the conductor parts and the shield boxes are mounted on the printed circuit board; a process in which the printed circuit board that mounts the multiple conductor parts and the multiple shield boxes in it, is placed in a reflow oven, the solder is melted and then cooled, and each conductor of the parts of the multiple conductor and a portion of each of the multiple shield boxes are respectively welded to a portion of the printed circuit board conductor network; and a process for obtaining multiple individual circuit blocks by cutting and dividing the printed circuit board in each set of each of the driver's parts and each of the armor boxes.
Therefore, compared to the conventional setting method, no carrier is used at the time of coating the weld prior to reflow. Also, the welding liner for welding the multiple conductor parts and the multiple shielding boxes on the printed circuit board, and melting the solder using the reflow oven, are simultaneously carried out respectively. Therefore, the number of processes and jobs can be reduced. Since no carrier is used, it is possible to obtain a method of fixing a part of the integral circuit, a part of the conductor and a shielding box on the printed circuit board, where the accuracy of the welding coating for welding the board Printed circuit boards and shielding can be improved. In addition, the scale of a fixing plant is reduced and a work space can be reduced. Also, since it is not used in any carrier, a nozzle used in the welding coating for welding the shielding box on the printed circuit board can be constructed by a flat nozzle, wherein an opening is approximately perpendicular to a longitudinal direction of the nozzle, therefore, the price of a solder coating device can be reduced.
According to the fourth invention, a connector is provided in each of the multiple shield boxes in the method of fixing a part of the integrated circuit, a part of the conductor and a shielding box to the printed circuit board in the third invention. . Likewise, multiple circuit blocks constructed by multiple integrated circuit parts, multiple conductor parts, multiple shield boxes and multiple conductors are placed on each pair in order to place the circumferential faces of the respective conductors one in proximity to the other, and the pairs of circuit blocks are fixed to the printed circuit board in order to place the pairs of circuit blocks in a zigzag fashion approximately in parallel with respect to each other. Accordingly, effects similar to those in the third invention are obtained. Furthermore, it is possible to obtain a method of fixing a part of the integrated circuit, a part of the conductor and a shielding box to the printed circuit board where the efficiency of the printed circuit board with respect to the circuit blocks constructed by the parts of the integrated circuit, the driver parts and the shield boxes and the connectors can be improved.
BRIEF DESCRIPTION OF THE DRAWINGS Figures IA to 1J are diagrams used to explain a conventional fixation method; Figures 2A to 2H are diagrams used to explain the processes in accordance with one embodiment of the present invention; Figure 3A is a plan view showing a surface of a printed circuit board, in which a network of conductors (not shown) is formed; Figure 3B is a plan view showing the printed circuit board shown in Figure 3A in a state where a box and a connector are inserted therein; Figures 3C and 3D are schematic diagrams showing the shape of a hook of an armor box; Figures 4A to 4F are diagrams showing the process, each showing a portion of the amplified scale mode; and Figure 5 is a schematic diagram showing a printed circuit board where the circuit blocks are placed in the mode. DESCRIPTION OF THE PREFERRED MODALITY A method for fixing a part of the conductor and a shielding box on a printed circuit board, and a method for fixing a part of the integral circuit, a part of the conductor and a shielding box to a circuit board printed in accordance with the embodiment of the present invention will be described below with reference to Figures 2A to 2H. HE will first explain a process of Figure 2A. The reference number 1 designates a printed circuit board. A network of conductors (not shown) is formed on at least one face (an upper side face of Figure 2A) of the printed circuit board 1. An opening lh and a slot ls are drilled through this printed circuit board 1. A conductor 4L of each of the multiple conductor parts 4 (shown in Figures 2A to 2H only a part 4 of the conductor) described below is inserted into the opening lh (each opening is formed in each portion of the multiple conductor networks). A portion of each of the multiple shielding boxes 5 corresponding respectively to the multiple conductor portions 4 and which will be described below, it is inserted into the slot ls. A cream weld is printed on a portion of the predetermined multiple pairs of the conductor networks on one face of the printed circuit board 1, using a welding printer. The multiple integrated circuit parts 2 (only one part 2 of the integrated circuit is shown in Figures 2A to 2H) are mounted on each printed cream weld (not shown in the Figure) using a mounting device. The board 1 of the printed circuit that mounts these multiple integral circuit parts 2 to it is placed in a reflow oven and heated. The solder melts and then cools. In this way, the parts 2 of the multiple integral circuit are soldered in a portion of the predetermined conductor networks of the board 1 of the printed circuit. The processes of the
Figures 2B and 2C. In the process of Figure 2B, the welds 3 and 6 are respectively coated on a portion of the conductor network on one side of the printed circuit board having an opening lh into which each of the part conductors is inserted. 4 of the multiple conductor and as shown in Figures 4A and 4B, in a projection (an island-shaped conductive layer formed on the printed circuit board 1 (see Figure 4B) so as to project slightly into the slot ls on an inner side of the slit ls for inserting therein a portion of a shielding box 5 which will be described below, using the welding liner device In the process of Figure 1C, the printed circuit board 1 it reverses in such a way that one face of the printed circuit board is placed on a lower side in this figure (see Figure 4C), then, in the process of Figure 2D, parts 4 of the multiple conductor are mounted on the other side. a (upper side face in Figure ID) of the printed circuit board 1 manually, or using a mounting device in such a way that each of the conductors 4L of the parts 4 of the multiple conductor is inserted into the opening lh of the board 1 of printed circuit. Each of the conductors 4L enters the weld 3 on one face of the printed circuit board 1. Then, in a process of Figure 2E, the shielding box 5 is fitted on the printed circuit board 1 such that a portion of a hook 5 is like a portion of the shielding box 5 inserted into the slot ls of printed circuit board 1. As shown in Figure 5, which shows the printed circuit board 1 seen from the side of the conductor parts 4, in this example, a pair of armor boxes 5 are placed in such a way that one of the portions of the circumferential faces of the respective CN connectors are opposite each other and four sets of this pair are placed in a zigzag shape on the printed circuit board 1. Therefore, the efficiency of a printed circuit board 1 is improved and eight armor boxes 5 can be fixed on this printed circuit board 1. The distance between the slits that insert the shielding boxes 5 therein into the printed circuit board 1 and that correspond to the adjacent corner portions of the shielding box 5 on the printed circuit board 1 is secured in such a way that the strength of printed circuit board 1 between the slots is increased. In FIG. 4, the illustrations of the conductor parts 4, the parts 2 of the integrated circuit and a thin form of the printed circuit board 1 are omitted. A hook 5N shown in each of Figures 3C or 3D and Figure 4D is formed in a portion of the shielding box 5 inserted in the slit 1 of the board 1 of the printed circuit. In Figure 3D, a concave portion is formed in which a portion of printed circuit board 1 is inserted, i.e. a connecting portion ICN on one side of the hook 5N of the shield box 5. In Figure 3C, this concave portion in which the connecting portion ICN is inserted is not formed. Figure 3A is a plan view showing a surface of a printed board board ÍA where a network of conductors is formed
(not illustrated). An essentially rectangular slit is formed in which the shield box 5 is inserted through the printed circuit board 1, and the connecting portion ICN of the printed circuit board 1 is formed as part of the slot ls. In Figure 3A, the reference number lh illustrates an opening for a connector. Figure 3B is a plan view showing the printed circuit board 1 in a state where the box 5 is inserted into the slot ls thereof and the connector CN formed integrally with the box 5 is inserted into the opening lh of the connector . In this modality, of the seven hooks 5N, four hooks 5N have respective concave portions into which the ICN portions of the connector shown in Figure 3D are inserted. Then, in a process of Figure 2F, an end portion of the hook 5N is bent inward using a riveter (see Figure 3E). This process is omitted when there is no 5N grapple in a portion of the box 5 of the shield. Then, in a process of Figure 2G, the eight shield boxes 5 are fixed to a printed circuit board 1. The printed circuit board 1 in which at least one of the parts 2 of the integral circuit and at least one part 4 of the conductor are fixed in each of these eight shield boxes 5, is placed in the reflow oven and heats so that welds 3 and 6 are melted. Then, welds 3 and 6 are cooled. In this way, a portion between each of the conductors 4L of the eight parts 4 of the conductor and a portion of each of the conductor networks of the printed circuit board 1 and a portion between the hook 5N (a portion of the box 5 of armoring where there is no hook 5N) as a portion of each of the eight armor boxes 5 and the L protrusion of the printed circuit board, are of course welded. In a process of Figure 2H, the printed circuit board 1 is cut by a substrate divider in the vicinity of the slot ls (see Figure 4F) so that eight circuit blocks each having at least one part 2 of integral circuit, at least one conductor part 4 and the shielding box 5 soldered on the individual printed circuit board 1, can be obtained. For example, each of these circuit blocks is a high frequency block formed of a tuner and an intermediate frequency amplifier. Having described a preferred embodiment of the present invention with reference to the accompanying drawings, it will be understood that the present invention is not limited to the aforementioned embodiment and that various changes and modifications may be made therein by a person skilled in the art. without deviating from the spirit or scope of the present invention as defined in the appended claims.
Claims (12)
1. A method for securing a portion of the conductor and a shielding box to prevent a high frequency signal from leaking to a printed circuit board, comprising the steps of: (a) a solder coating step of the coating solder so that the weld must cover an entire opening that is provided through the printed circuit board where a conductor is inserted from the driver's side and so that the weld must cover a part of an opening that is provided through the printed circuit board where a coupling portion of the shield box is inserted; (b) a mounting step for inserting the conductor of the conductor part and the coupling portion of the shielding box into the respective openings for thereby mounting the conductor part and the shielding box on the printed circuit board; and (c) a welding step for inserting the printed circuit board mounted on the driver's side and the shielding box in a reflow oven, and melting the solder to thereby carry out the welding operation. A fastening method according to claim 1, wherein in the assembly step, multiple sets of conductor parts and shield boxes are mounted on the printed circuit board, and the mounting step further comprises a step for Cut the printed circuit board in each shielding box after the welding step. A fastening method according to claim 2, wherein the shield box is provided with a connector, and multiple sets of shield boxes are mounted on the printed circuit board alternately with their surfaces where connectors are provided that are opposite each other. A fastening method according to claim 1, wherein in the welding coating step a hook is provided in the coupling portion of the shielding box used for welding and the welding is coated in a part of an opening which is formed through the printed circuit board and where the hook is inserted. A fastening method according to claim 4, wherein before the welding step, a free end portion of the hook provides an end of the coupling portion of the shield box to be inserted into the board of printed circuit is folded inwards. 6. A method for securing a part of the integrated circuit, a portion of the conductor and a shielding box to prevent a high frequency signal from leaking to a printed circuit board, comprising the steps of: (a) a step of welding of the part of the integral circuit to solder the part of the integral circuit in the printed circuit board; (b) a step of coating welding of the coating welding so that the welding should cover the entire opening that is provided through the printed circuit board where a conductor is inserted from the driver's side and so that the welding it must cover a part of the opening that is provided through the printed circuit board where a coupling portion of the shield box is inserted; (c) a mounting step for inserting the conductors of the conductor part and the coupling portion of the shield box into the respective openings, in order to thereby mount the conductor parts and the shield box on the circuit board printed; and (d) a welding step for inserting the printed circuit board mounted with the driver part and the shield box in a reflow oven and melting the solder to thereby carry out the welding operation. A fixing method according to claim 6, wherein in the assembly step the multiple sets of conductor parts and the shielding boxes are mounted on the printed circuit board, and the assembly step further comprises a step for cutting the printed circuit board in each shield box after the welding step. A fastening method according to claim 7, wherein the shield box is provided with a connector, and multiple sets of shield boxes are mounted on the printed circuit board alternately with their surfaces where connectors are provided that are opposite each other. A fastening method according to claim 6, wherein in the welding coating step, a hook is provided in the coupling portion of the welding shield box, and the welding is coated in a part of a opening that is formed through the printed circuit board and where a grapple is inserted. A fastening method according to claim 9, wherein before the welding step, a free end portion of the hook is provided at one end of the coupling portion of the shield box to be inserted in the printed circuit board, it is folded inwards. 11. An apparatus for securing a portion of the conductor and a shielding box to prevent a high frequency signal from leaking to a printed circuit board, comprising: a solder coating means for coating the solder so that the solder it must cover an entire opening that is provided through a printed circuit board where a conductor is inserted from the driver's side and so that the weld must cover a part of an opening that is provided through the printed circuit board where a coupling portion of the shielding box is inserted; a mounting means for inserting the conductor of the conductor part and the coupling portion of the shield box into the respective openings in order to thereby mount the conductor part and the shield box on the printed circuit board; and a welding means for inserting the printed circuit board mounted with the driver's part and the shielding box in a reflow oven and melting the solder in order to carry out the welding operation in this way. 1
2. An apparatus for securing a part of the integrated circuit, a portion of the conductor and a shielding box to prevent a high frequency signal from leaking to a printed circuit board, comprising: a means of welding the circuit part integrated to solder the part of the integrated circuit on the printed circuit board; a solder coating means for coating the solder so that the solder must cover the entire opening that is provided through the printed circuit board where a conductor is inserted from the driver's side and so that the solder must cover a part of the opening that is provided through the printed circuit board where a coupling portion of the shield box is inserted; a mounting means for inserting the conductors of the conductor part and the coupling portion of the shield box into the respective openings for thereby mounting the conductor parts and the shield box on the printed circuit board; and a welding means for inserting the printed circuit board mounted on the driver's side and the shielding box in a reflow oven and melting the solder in order to carry out the welding operation in this way.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8-217557 | 1996-08-19 | ||
| JP21755796 | 1996-08-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MXPA97006314A true MXPA97006314A (en) | 1998-02-01 |
| MX9706314A MX9706314A (en) | 1998-02-28 |
Family
ID=16706134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX9706314A MX9706314A (en) | 1996-08-19 | 1997-08-19 | Method for attaching lead parts and shield case to print substrate, and method for attaching chip parts, lead parts and shield case to print cubstrate. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5911356A (en) |
| KR (1) | KR100491502B1 (en) |
| CN (1) | CN1166266C (en) |
| BR (1) | BR9704427A (en) |
| ID (1) | ID18045A (en) |
| MX (1) | MX9706314A (en) |
| MY (1) | MY116133A (en) |
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| US5906310A (en) * | 1994-11-10 | 1999-05-25 | Vlt Corporation | Packaging electrical circuits |
| JP3714088B2 (en) | 1999-02-18 | 2005-11-09 | 株式会社村田製作所 | Electronic component and manufacturing method thereof |
| JP2001156488A (en) * | 1999-11-26 | 2001-06-08 | Murata Mfg Co Ltd | Electronic component with shield case and its manufacturing method |
| JP2001237585A (en) * | 2000-02-22 | 2001-08-31 | Murata Mfg Co Ltd | Electronic component and manufacturing method thereof |
| US6985341B2 (en) * | 2001-04-24 | 2006-01-10 | Vlt, Inc. | Components having actively controlled circuit elements |
| US7443229B1 (en) | 2001-04-24 | 2008-10-28 | Picor Corporation | Active filtering |
| DE102005048416B3 (en) * | 2005-10-10 | 2007-01-18 | Siemens Ag | Electric apparatus or instrument having through contacts in the electric substrate conductively connecting contacts on either side of the substrate |
| KR101294419B1 (en) | 2006-03-10 | 2013-08-08 | 엘지이노텍 주식회사 | Camera module and manufacturing method thereof |
| CN101217853B (en) * | 2007-12-28 | 2012-07-18 | 联合汽车电子有限公司 | A welding method of chip pin and metal terminals |
| JP5439950B2 (en) * | 2009-05-22 | 2014-03-12 | 千住金属工業株式会社 | Solder-coated component, its manufacturing method and its mounting method |
| KR20170112618A (en) * | 2016-04-01 | 2017-10-12 | 주식회사 만도 | Shielding structure of electro control unit |
| CN107800399B (en) * | 2017-10-23 | 2021-05-25 | 郑州云海信息技术有限公司 | Anti-interference crystal oscillator mounting structure and mounting method |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0541588Y2 (en) * | 1986-12-25 | 1993-10-20 | ||
| JPS63306698A (en) * | 1987-06-09 | 1988-12-14 | Oki Electric Ind Co Ltd | Box for shielding |
| JPH0362595A (en) * | 1989-07-31 | 1991-03-18 | Nec Corp | Shielding structure for electronic device |
| KR910011108A (en) * | 1989-11-29 | 1991-06-29 | 정몽헌 | High Frequency Power Amplifier Shield Case |
| US5160807A (en) * | 1991-08-08 | 1992-11-03 | Elsag International B.V. | Method for RFI/EMI protection of electronic circuitry |
| FI109960B (en) * | 1991-09-19 | 2002-10-31 | Nokia Corp | Electronic device |
| JP3067326B2 (en) * | 1991-09-24 | 2000-07-17 | ソニー株式会社 | Soldering method |
| JPH07147495A (en) * | 1993-11-26 | 1995-06-06 | Nec Corp | Printed board surface mounting shield case |
| JP3240804B2 (en) * | 1994-02-18 | 2001-12-25 | 株式会社村田製作所 | Circuit module manufacturing method |
| JP3621716B2 (en) * | 1994-05-09 | 2005-02-16 | 富士通株式会社 | High frequency printed circuit board unit structure |
| JP3252374B2 (en) * | 1994-07-28 | 2002-02-04 | 矢崎総業株式会社 | Cross-coil indicating instrument |
-
1997
- 1997-08-14 US US08/911,458 patent/US5911356A/en not_active Expired - Fee Related
- 1997-08-18 ID IDP972884A patent/ID18045A/en unknown
- 1997-08-18 KR KR1019970039220A patent/KR100491502B1/en not_active IP Right Cessation
- 1997-08-19 MX MX9706314A patent/MX9706314A/en not_active IP Right Cessation
- 1997-08-19 BR BR9704427A patent/BR9704427A/en active Search and Examination
- 1997-08-19 CN CNB971185883A patent/CN1166266C/en not_active Expired - Fee Related
- 1997-10-22 MY MYPI97003794A patent/MY116133A/en unknown
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