MXPA02005702A - Metodo y sistema para evitar la corrosion de estructuras conductoras. - Google Patents

Metodo y sistema para evitar la corrosion de estructuras conductoras.

Info

Publication number
MXPA02005702A
MXPA02005702A MXPA02005702A MXPA02005702A MXPA02005702A MX PA02005702 A MXPA02005702 A MX PA02005702A MX PA02005702 A MXPA02005702 A MX PA02005702A MX PA02005702 A MXPA02005702 A MX PA02005702A MX PA02005702 A MXPA02005702 A MX PA02005702A
Authority
MX
Mexico
Prior art keywords
interest
gas
flow
sterilizing
sterilization
Prior art date
Application number
MXPA02005702A
Other languages
English (en)
Inventor
David B Dowling
Original Assignee
Applied Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Semiconductor Inc filed Critical Applied Semiconductor Inc
Publication of MXPA02005702A publication Critical patent/MXPA02005702A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/60—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only artificial stone
    • C04B41/61—Coating or impregnation
    • C04B41/65—Coating or impregnation with inorganic materials
    • C04B41/68—Silicic acid; Silicates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/5024—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/08—Anti-corrosive paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/08—Anti-corrosive paints
    • C09D5/10—Anti-corrosive paints containing metal dust
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/62—Treatment of iron or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F15/00—Other methods of preventing corrosion or incrustation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/90—Electrical properties
    • C04B2111/94—Electrically conducting materials

Abstract

Un sistema para evitar la corrosion de una superficie de una estructura metalica en contacto con un ambiente corrosivo el cual comprende: un recubrimiento (4) semiconductor en contacto conductor con por lo menos parte de la superficie; y un filtro (17) electronico para filtrar el ruido corrosivo y un metodo para evitar la corrosion utilizando el sistema.
MXPA02005702A 1999-12-09 2000-12-07 Metodo y sistema para evitar la corrosion de estructuras conductoras. MXPA02005702A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US45732899A 1999-12-09 1999-12-09
US09/585,397 US6325915B1 (en) 1999-12-09 2000-06-02 Method and system of preventing corrosion of conductive structures
PCT/US2000/032439 WO2001043173A1 (en) 1999-12-09 2000-12-07 Method and system of preventing corrosion of conductive structures

Publications (1)

Publication Number Publication Date
MXPA02005702A true MXPA02005702A (es) 2004-09-10

Family

ID=27038557

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA02005702A MXPA02005702A (es) 1999-12-09 2000-12-07 Metodo y sistema para evitar la corrosion de estructuras conductoras.

Country Status (13)

Country Link
US (1) US6325915B1 (es)
EP (1) EP1236223A4 (es)
JP (1) JP5198702B2 (es)
KR (1) KR100765589B1 (es)
CN (1) CN1195591C (es)
AU (1) AU784620B2 (es)
CA (1) CA2393611C (es)
EA (1) EA004487B1 (es)
HK (1) HK1034480A1 (es)
MX (1) MXPA02005702A (es)
NO (1) NO20022726D0 (es)
TW (1) TW556278B (es)
WO (1) WO2001043173A1 (es)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6325915B1 (en) * 1999-12-09 2001-12-04 Applied Semiconductor, Inc. Method and system of preventing corrosion of conductive structures
US6551491B2 (en) * 2000-06-02 2003-04-22 Applied Semiconductor, Inc. Method and system of preventing corrosion of conductive structures
US6524466B1 (en) * 2000-07-18 2003-02-25 Applied Semiconductor, Inc. Method and system of preventing fouling and corrosion of biomedical devices and structures
US6562201B2 (en) * 2001-06-08 2003-05-13 Applied Semiconductor, Inc. Semiconductive polymeric system, devices incorporating the same, and its use in controlling corrosion
US6402933B1 (en) * 2001-06-08 2002-06-11 Applied Semiconductor, Inc. Method and system of preventing corrosion of conductive structures
AU2005227402B2 (en) * 2001-06-08 2007-01-04 Applied Semiconductor, Inc. Semiconductive polymeric system, devices incorporating the same, and its use in controlling corrosion
CN100390323C (zh) * 2002-10-17 2008-05-28 应用半导体国际有限公司 半导体腐蚀和污染控制设备,系统和方法
US6811681B2 (en) * 2002-11-12 2004-11-02 Applied Semiconductor International Ltd. Semiconductive corrosion and fouling control apparatus, system, and method
AU2006227443B2 (en) * 2005-03-17 2011-06-16 David B. Dowling Control apparatus, system, and method for reduction and/or prevention of space weather induced corrosion
US7318889B2 (en) * 2005-06-02 2008-01-15 Applied Semiconductor International, Ltd. Apparatus, system and method for extending the life of sacrificial anodes on cathodic protection systems
US20060272909A1 (en) * 2005-06-02 2006-12-07 Fuller Brian K Brake assembly and coating
AU2008296143A1 (en) * 2007-09-07 2009-03-12 Applied Semiconductor International Ltd. Method of preparing high density metal oxide layers and the layers produced thereby
CN104502981B (zh) * 2014-12-30 2017-10-27 中国科学院电子学研究所 一种海洋电容性电极
JP7119823B2 (ja) 2018-09-19 2022-08-17 昭和電工マテリアルズ株式会社 封止用エポキシ樹脂組成物及び電子部品装置

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
CH507882A (de) * 1967-12-06 1971-05-31 Repla Sa Verfahren zur Herstellung kunstharzgebundener Platten
US3620784A (en) * 1968-01-24 1971-11-16 Nasa Potassium silicate-zinc coatings
US3562124A (en) * 1968-08-02 1971-02-09 Hooker Chemical Corp Composition for corrosion protection
US3864234A (en) * 1973-05-08 1975-02-04 Smith Corp A O Cathodic Protection System for Water Heaters with Sealant
GB2004560B (en) * 1977-09-13 1982-08-18 Dainippon Toryo Kk Anti-corrosion coating composition
US4381981A (en) * 1980-12-17 1983-05-03 S. A. Texaco Belgium N.V. Sacrificial cathodic protection system
FR2502001B1 (fr) * 1981-03-19 1985-07-12 Beghin Say Sa Articles d'hygiene pour l'absorption des liquides corporels
US4528460A (en) * 1982-12-23 1985-07-09 Brunswick Corporation Cathodic protection controller
GB8427138D0 (en) * 1984-10-26 1984-12-05 Wilson A D Coated substrates
US4957612A (en) * 1987-02-09 1990-09-18 Raychem Corporation Electrodes for use in electrochemical processes
US5009757A (en) * 1988-01-19 1991-04-23 Marine Environmental Research, Inc. Electrochemical system for the prevention of fouling on steel structures in seawater
US4863578A (en) * 1988-04-25 1989-09-05 Corrosion Service Company Limited Corrodible link for cathodic protection systems
GB9106218D0 (en) * 1991-03-23 1991-05-08 Capcis March Ltd Electrochemical impedance monitoring
JPH05256809A (ja) * 1991-03-29 1993-10-08 Osaka Gas Co Ltd 外部電源法による被防食物体の対地電位測定方法
US5352342A (en) * 1993-03-19 1994-10-04 William J. Riffe Method and apparatus for preventing corrosion of metal structures
US5500629A (en) * 1993-09-10 1996-03-19 Meyer Dennis R Noise suppressor
US5371695A (en) * 1993-10-14 1994-12-06 Ford Motor Company Method for automatically controlling the bandwidth of a digital filter and adaptive filter utilizing same
US5888374A (en) * 1997-05-08 1999-03-30 The University Of Chicago In-situ process for the monitoring of localized pitting corrosion
US6325915B1 (en) * 1999-12-09 2001-12-04 Applied Semiconductor, Inc. Method and system of preventing corrosion of conductive structures

Also Published As

Publication number Publication date
CN1298770A (zh) 2001-06-13
WO2001043173A1 (en) 2001-06-14
NO20022726L (no) 2002-06-07
US6325915B1 (en) 2001-12-04
KR100765589B1 (ko) 2007-10-09
AU784620B2 (en) 2006-05-18
NO20022726D0 (no) 2002-06-07
CA2393611C (en) 2010-10-19
EA004487B1 (ru) 2004-04-29
TW556278B (en) 2003-10-01
EA200200653A1 (ru) 2003-06-26
KR20020071884A (ko) 2002-09-13
HK1034480A1 (en) 2001-10-26
JP5198702B2 (ja) 2013-05-15
CN1195591C (zh) 2005-04-06
EP1236223A4 (en) 2009-11-18
EP1236223A1 (en) 2002-09-04
CA2393611A1 (en) 2001-06-14
AU1931301A (en) 2001-06-18
JP2003519725A (ja) 2003-06-24

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