MX341506B - Método de recubrimiento de hipims homogéneo. - Google Patents
Método de recubrimiento de hipims homogéneo.Info
- Publication number
- MX341506B MX341506B MX2014007668A MX2014007668A MX341506B MX 341506 B MX341506 B MX 341506B MX 2014007668 A MX2014007668 A MX 2014007668A MX 2014007668 A MX2014007668 A MX 2014007668A MX 341506 B MX341506 B MX 341506B
- Authority
- MX
- Mexico
- Prior art keywords
- homogeneous
- coating method
- height
- hipims coating
- hipims
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3464—Operating strategies
- H01J37/3467—Pulsed operation, e.g. HIPIMS
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3485—Sputtering using pulsed power to the target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3492—Variation of parameters during sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3417—Arrangements
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Physical Vapour Deposition (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Pretreatment Of Seeds And Plants (AREA)
Abstract
La presente invención se refiere a un método de HIPIMS a través del cual se pueden depositar capas homogéneas a lo largo de la altura de una cámara de recubrimiento. Se utilizan dos cátodos parciales para dicho propósito. De acuerdo con la presente invención, se eligen individualmente la longitud de los intervalos de pulsación de energía individuales aplicados a los cátodos parciales, y por lo tanto, se logra un perfil de grosor de recubrimiento requerido a lo largo de la altura de la cámara de recubrimiento.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011121770A DE102011121770A1 (de) | 2011-12-21 | 2011-12-21 | Homogenes HIPIMS-Beschichtungsverfahren |
PCT/EP2012/004847 WO2013091761A1 (de) | 2011-12-21 | 2012-11-23 | Homogenes hipims-beschichtungsverfahren |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2014007668A MX2014007668A (es) | 2014-11-25 |
MX341506B true MX341506B (es) | 2016-08-22 |
Family
ID=47520875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2014007668A MX341506B (es) | 2011-12-21 | 2012-11-23 | Método de recubrimiento de hipims homogéneo. |
Country Status (13)
Country | Link |
---|---|
US (1) | US10982321B2 (es) |
EP (1) | EP2795658A1 (es) |
JP (1) | JP6180431B2 (es) |
KR (1) | KR101934141B1 (es) |
CN (1) | CN104160470B (es) |
BR (1) | BR112014014793B1 (es) |
CA (1) | CA2859747C (es) |
DE (1) | DE102011121770A1 (es) |
MX (1) | MX341506B (es) |
PH (1) | PH12014501435B1 (es) |
RU (1) | RU2633516C2 (es) |
SG (1) | SG11201403396SA (es) |
WO (1) | WO2013091761A1 (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011117177A1 (de) * | 2011-10-28 | 2013-05-02 | Oerlikon Trading Ag, Trübbach | Verfahren zur Bereitstellung sequenzieller Leistungspulse |
US11473189B2 (en) | 2019-02-11 | 2022-10-18 | Applied Materials, Inc. | Method for particle removal from wafers through plasma modification in pulsed PVD |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4515668A (en) * | 1984-04-25 | 1985-05-07 | Honeywell Inc. | Method of forming a dielectric layer comprising a gettering material |
JPS6141766A (ja) * | 1984-08-06 | 1986-02-28 | Hitachi Ltd | スパツタリング方法およびスパツタ−装置 |
DE3700633C2 (de) * | 1987-01-12 | 1997-02-20 | Reinar Dr Gruen | Verfahren und Vorrichtung zum schonenden Beschichten elektrisch leitender Gegenstände mittels Plasma |
JPH07116596B2 (ja) * | 1989-02-15 | 1995-12-13 | 株式会社日立製作所 | 薄膜形成方法、及びその装置 |
DE19651615C1 (de) * | 1996-12-12 | 1997-07-10 | Fraunhofer Ges Forschung | Verfahren zum Aufbringen von Kohlenstoffschichten durch reaktives Magnetron-Sputtern |
US20050103620A1 (en) * | 2003-11-19 | 2005-05-19 | Zond, Inc. | Plasma source with segmented magnetron cathode |
US9771648B2 (en) * | 2004-08-13 | 2017-09-26 | Zond, Inc. | Method of ionized physical vapor deposition sputter coating high aspect-ratio structures |
US7718042B2 (en) * | 2004-03-12 | 2010-05-18 | Oc Oerlikon Balzers Ag | Method for manufacturing sputter-coated substrates, magnetron source and sputtering chamber with such source |
JP2006124753A (ja) * | 2004-10-27 | 2006-05-18 | Bridgestone Corp | Cu2O膜、その成膜方法及び太陽電池 |
DE102006017382A1 (de) * | 2005-11-14 | 2007-05-16 | Itg Induktionsanlagen Gmbh | Verfahren und Vorrichtung zum Beschichten und/oder zur Behandlung von Oberflächen |
DE102006021565A1 (de) * | 2005-12-20 | 2007-06-28 | Itg Induktionsanlagen Gmbh | Verfahren und Vorrichtung zum Erzeugen eines Magnetfeldsystems |
US7691544B2 (en) * | 2006-07-21 | 2010-04-06 | Intel Corporation | Measurement of a scattered light point spread function (PSF) for microelectronic photolithography |
WO2008050618A1 (fr) * | 2006-10-24 | 2008-05-02 | Ulvac, Inc. | Procédé de fabrication d'un film mince et dispositif de fabrication d'un film mince |
US20080197015A1 (en) * | 2007-02-16 | 2008-08-21 | Terry Bluck | Multiple-magnetron sputtering source with plasma confinement |
JP5037475B2 (ja) * | 2008-11-11 | 2012-09-26 | 株式会社神戸製鋼所 | スパッタ装置 |
DE202010001497U1 (de) * | 2010-01-29 | 2010-04-22 | Hauzer Techno-Coating B.V. | Beschichtungsvorrichtung mit einer HIPIMS-Leistungsquelle |
DE102010007515A1 (de) * | 2010-02-11 | 2011-08-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80686 | Verfahren zum Betreiben einer großflächigen Kathode für Plasmaprozesse mit hohem Ionisierungsgrad |
DE102010007516A1 (de) * | 2010-02-11 | 2011-08-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80686 | Großflächige Kathode für Plasmaprozesse mit hohem Ionisierungsgrad |
DE102011117177A1 (de) * | 2011-10-28 | 2013-05-02 | Oerlikon Trading Ag, Trübbach | Verfahren zur Bereitstellung sequenzieller Leistungspulse |
DE102011018363A1 (de) * | 2011-04-20 | 2012-10-25 | Oerlikon Trading Ag, Trübbach | Hochleistungszerstäubungsquelle |
-
2011
- 2011-12-21 DE DE102011121770A patent/DE102011121770A1/de not_active Withdrawn
-
2012
- 2012-11-23 US US14/367,354 patent/US10982321B2/en active Active
- 2012-11-23 KR KR1020147019513A patent/KR101934141B1/ko active IP Right Grant
- 2012-11-23 CN CN201280063780.3A patent/CN104160470B/zh active Active
- 2012-11-23 SG SG11201403396SA patent/SG11201403396SA/en unknown
- 2012-11-23 MX MX2014007668A patent/MX341506B/es active IP Right Grant
- 2012-11-23 JP JP2014547731A patent/JP6180431B2/ja active Active
- 2012-11-23 WO PCT/EP2012/004847 patent/WO2013091761A1/de active Application Filing
- 2012-11-23 RU RU2014129572A patent/RU2633516C2/ru active
- 2012-11-23 BR BR112014014793-0A patent/BR112014014793B1/pt active IP Right Grant
- 2012-11-23 CA CA2859747A patent/CA2859747C/en active Active
- 2012-11-23 EP EP12812516.8A patent/EP2795658A1/de not_active Withdrawn
-
2014
- 2014-06-20 PH PH12014501435A patent/PH12014501435B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
PH12014501435A1 (en) | 2014-09-22 |
CN104160470A (zh) | 2014-11-19 |
PH12014501435B1 (en) | 2014-09-22 |
JP2015508448A (ja) | 2015-03-19 |
CA2859747A1 (en) | 2013-06-27 |
US10982321B2 (en) | 2021-04-20 |
MX2014007668A (es) | 2014-11-25 |
KR20140116102A (ko) | 2014-10-01 |
RU2014129572A (ru) | 2016-02-10 |
CN104160470B (zh) | 2017-01-18 |
BR112014014793B1 (pt) | 2021-08-10 |
DE102011121770A1 (de) | 2013-06-27 |
EP2795658A1 (de) | 2014-10-29 |
SG11201403396SA (en) | 2014-12-30 |
JP6180431B2 (ja) | 2017-08-16 |
KR101934141B1 (ko) | 2018-12-31 |
US20150001063A1 (en) | 2015-01-01 |
CA2859747C (en) | 2019-12-31 |
BR112014014793A2 (pt) | 2017-06-13 |
RU2633516C2 (ru) | 2017-10-13 |
WO2013091761A1 (de) | 2013-06-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |