MX2022012816A - Sistema de prueba de chip por aire (ota). - Google Patents
Sistema de prueba de chip por aire (ota).Info
- Publication number
- MX2022012816A MX2022012816A MX2022012816A MX2022012816A MX2022012816A MX 2022012816 A MX2022012816 A MX 2022012816A MX 2022012816 A MX2022012816 A MX 2022012816A MX 2022012816 A MX2022012816 A MX 2022012816A MX 2022012816 A MX2022012816 A MX 2022012816A
- Authority
- MX
- Mexico
- Prior art keywords
- dut
- extender
- retractor
- hold
- place
- Prior art date
Links
- 239000004606 Fillers/Extenders Substances 0.000 abstract 6
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/10—Radiation diagrams of antennas
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/045—Sockets or component fixtures for RF or HF testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/125—Means for positioning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/303—Contactless testing of integrated circuits
Abstract
Se describe un aparato de prueba para evaluar el dispositivo bajo prueba (DUT) que tiene una antena ubicada en el DUT. El aparato de prueba incluye: una carcasa, un enchufe configurado para conectar eléctricamente el DUT a una placa de carga, un conjunto de agarre configurado para sujetar el DUT en su lugar, un retractor configurado para liberar el DUT del conjunto de agarre, y un placa de alineación configurada para alinear el DUT con el enchufe. El conjunto de agarre incluye una base y un extensor, la base está unida a la carcasa y el extensor está configurado para mantener el DUT en su lugar. Cuando el retractor se desacopla del extensor, el extensor está configurado para mantener el DUT en su lugar. Cuando el retractor está acoplado con el extensor, el extensor está configurado para liberar el DUT en la placa de alineación.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202063009836P | 2020-04-14 | 2020-04-14 | |
PCT/US2021/027207 WO2021211666A1 (en) | 2020-04-14 | 2021-04-14 | Over the air (ota) chip testing system |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2022012816A true MX2022012816A (es) | 2023-01-16 |
Family
ID=78084680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2022012816A MX2022012816A (es) | 2020-04-14 | 2021-04-14 | Sistema de prueba de chip por aire (ota). |
Country Status (8)
Country | Link |
---|---|
US (1) | US11879925B1 (es) |
EP (1) | EP4136464A4 (es) |
KR (1) | KR20230002669A (es) |
CN (1) | CN115427819A (es) |
CA (1) | CA3175399A1 (es) |
MX (1) | MX2022012816A (es) |
TW (1) | TW202210840A (es) |
WO (1) | WO2021211666A1 (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI807847B (zh) * | 2022-06-06 | 2023-07-01 | 川升股份有限公司 | 初次反射抑制的天線量測暗室 |
CN117637516B (zh) * | 2024-01-25 | 2024-04-16 | 中国科学院长春光学精密机械与物理研究所 | 一种硅通孔的测试结构 |
Family Cites Families (23)
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US5205132A (en) | 1992-06-12 | 1993-04-27 | Thermonics Incorporated | Computer-implemented method and system for precise temperature control of a device under test |
US5584717A (en) * | 1994-11-18 | 1996-12-17 | Wells Electronics, Inc. | Slide lock carrier |
US6040702A (en) * | 1997-07-03 | 2000-03-21 | Micron Technology, Inc. | Carrier and system for testing bumped semiconductor components |
JP4451992B2 (ja) * | 2001-02-28 | 2010-04-14 | 株式会社アドバンテスト | 試験用電子部品搬送媒体、電子部品試験装置および試験方法 |
US6839029B2 (en) | 2002-03-15 | 2005-01-04 | Etenna Corporation | Method of mechanically tuning antennas for low-cost volume production |
US7915909B2 (en) | 2007-12-18 | 2011-03-29 | Sibeam, Inc. | RF integrated circuit test methodology and system |
TWI369084B (en) | 2008-02-15 | 2012-07-21 | King Yuan Electronics Co Ltd | Automatic detecting device for radio frequency environment |
US20120100813A1 (en) | 2010-10-20 | 2012-04-26 | Mow Matt A | System for testing multi-antenna devices using bidirectional faded channels |
US8648752B2 (en) | 2011-02-11 | 2014-02-11 | Pulse Finland Oy | Chassis-excited antenna apparatus and methods |
US9319908B2 (en) | 2011-10-12 | 2016-04-19 | Apple Inc. | Methods for reducing path loss while testing wireless electronic devices with multiple antennas |
US9404965B2 (en) | 2013-12-20 | 2016-08-02 | Apple Inc. | Radio-frequency test system with tunable test antenna circuitry |
US9678127B2 (en) | 2014-06-18 | 2017-06-13 | Ixia | Flexible shielded antenna array for radiated wireless test |
US10114067B2 (en) | 2016-02-04 | 2018-10-30 | Advantest Corporation | Integrated waveguide structure and socket structure for millimeter waveband testing |
US10084416B2 (en) | 2016-03-25 | 2018-09-25 | Skyworks Solutions, Inc. | Apparatus and methods for overload protection of low noise amplifiers |
EP3306327B1 (en) | 2016-10-06 | 2019-06-12 | Rohde & Schwarz GmbH & Co. KG | Antenna array, test system and method for testing a device under test |
DE112017006442T5 (de) | 2016-12-21 | 2019-09-19 | Intel Corporation | Drahtlose kommunikationstechnologie, einrichtungen und verfahren |
US9906315B1 (en) | 2017-05-05 | 2018-02-27 | Rohde & Schwarz Gmbh & Co. Kg | Test arrangement and test method |
US10338099B2 (en) * | 2017-06-19 | 2019-07-02 | Intel Corporation | Low profile edge clamp socket |
WO2019133097A1 (en) | 2017-12-29 | 2019-07-04 | Xcerra Corporation | Test socket assembly with antenna and related methods |
EP3512128B1 (en) | 2018-01-10 | 2020-07-22 | Rohde & Schwarz GmbH & Co. KG | Over-the-air test system as well as method for measuring the over-the-air performance of a device under test |
US10852349B2 (en) * | 2018-04-09 | 2020-12-01 | Mediatek Inc. | Wireless test system for testing microelectronic devices integrated with antenna |
US10536226B1 (en) | 2018-07-16 | 2020-01-14 | Litepoint Corporation | System and method for over-the-air (OTA) testing to detect faulty elements in an active array antenna of an extremely high frequency (EHF) wireless communication device |
US11671144B2 (en) | 2019-03-28 | 2023-06-06 | Intel Corporation | Near-field test apparatus for far-field antenna properties |
-
2021
- 2021-04-14 MX MX2022012816A patent/MX2022012816A/es unknown
- 2021-04-14 US US17/230,092 patent/US11879925B1/en active Active
- 2021-04-14 CA CA3175399A patent/CA3175399A1/en active Pending
- 2021-04-14 TW TW110113475A patent/TW202210840A/zh unknown
- 2021-04-14 CN CN202180028852.XA patent/CN115427819A/zh active Pending
- 2021-04-14 WO PCT/US2021/027207 patent/WO2021211666A1/en unknown
- 2021-04-14 KR KR1020227039529A patent/KR20230002669A/ko not_active Application Discontinuation
- 2021-04-14 EP EP21788691.0A patent/EP4136464A4/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CA3175399A1 (en) | 2021-10-21 |
US11879925B1 (en) | 2024-01-23 |
WO2021211666A9 (en) | 2022-03-03 |
EP4136464A1 (en) | 2023-02-22 |
CN115427819A (zh) | 2022-12-02 |
KR20230002669A (ko) | 2023-01-05 |
TW202210840A (zh) | 2022-03-16 |
EP4136464A4 (en) | 2024-05-15 |
WO2021211666A1 (en) | 2021-10-21 |
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