MX2022012031A - Material plateado, metodo para producirlo y componente terminal. - Google Patents

Material plateado, metodo para producirlo y componente terminal.

Info

Publication number
MX2022012031A
MX2022012031A MX2022012031A MX2022012031A MX2022012031A MX 2022012031 A MX2022012031 A MX 2022012031A MX 2022012031 A MX2022012031 A MX 2022012031A MX 2022012031 A MX2022012031 A MX 2022012031A MX 2022012031 A MX2022012031 A MX 2022012031A
Authority
MX
Mexico
Prior art keywords
silver plating
plating material
producing same
terminal component
surface layer
Prior art date
Application number
MX2022012031A
Other languages
English (en)
Inventor
Yosuke Sato
Kentaro Arai
Yutaro Hirai
Original Assignee
Dowa Metaltech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Metaltech Co Ltd filed Critical Dowa Metaltech Co Ltd
Publication of MX2022012031A publication Critical patent/MX2022012031A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B28/00—Production of homogeneous polycrystalline material with defined structure
    • C30B28/04—Production of homogeneous polycrystalline material with defined structure from liquids
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

La presente invención proporciona un elemento plateado con una capa superficial hecha de una capa plateada que se forma en un elemento base, en donde un plano cristalino de la capa superficial tiene una orientación preferencial del plano {110}, y la proporción de orientación del plano {110} es de 30% a 75%.
MX2022012031A 2020-03-31 2020-12-21 Material plateado, metodo para producirlo y componente terminal. MX2022012031A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020061888A JP7455634B2 (ja) 2020-03-31 2020-03-31 銀めっき材およびその製造方法、並びに、端子部品
PCT/JP2020/047671 WO2021199526A1 (ja) 2020-03-31 2020-12-21 銀めっき材およびその製造方法、並びに、端子部品

Publications (1)

Publication Number Publication Date
MX2022012031A true MX2022012031A (es) 2022-11-09

Family

ID=77928873

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2022012031A MX2022012031A (es) 2020-03-31 2020-12-21 Material plateado, metodo para producirlo y componente terminal.

Country Status (6)

Country Link
US (1) US20230142395A1 (es)
EP (1) EP4130345A1 (es)
JP (1) JP7455634B2 (es)
CN (1) CN115398041A (es)
MX (1) MX2022012031A (es)
WO (1) WO2021199526A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118020116A (zh) 2021-09-30 2024-05-10 Ａｇｃ株式会社 硫化物系固体电解质粉末的制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009079250A (ja) 2007-09-26 2009-04-16 Dowa Metaltech Kk 最表層として銀合金層が形成された銅または銅合金部材およびその製造方法
JP5667543B2 (ja) * 2011-09-30 2015-02-12 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法
JP5848168B2 (ja) * 2012-03-14 2016-01-27 Ｄｏｗａメタルテック株式会社 銀めっき材
JP6086532B2 (ja) * 2013-03-21 2017-03-01 Ｄｏｗａメタルテック株式会社 銀めっき材
JP6395560B2 (ja) * 2013-11-08 2018-09-26 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法
JP6611602B2 (ja) * 2015-01-30 2019-11-27 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法
JP6450639B2 (ja) * 2015-04-27 2019-01-09 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法

Also Published As

Publication number Publication date
CN115398041A (zh) 2022-11-25
JP7455634B2 (ja) 2024-03-26
US20230142395A1 (en) 2023-05-11
WO2021199526A1 (ja) 2021-10-07
EP4130345A1 (en) 2023-02-08
JP2021161463A (ja) 2021-10-11

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